A method for performing an in-memory computation includes: storing data in memory cells of a memory array, the data including weights for computation; determining whether an update command to change at least one of the weights is received; in response to receiving the update command, performing a write operation on the memory array to update the at least one weight; and disabling the write operation on the memory array until receiving a next update command to change the at least one weight.

The present application relates to a semiconductor memory training method and related devices, belonging to the technical field of semiconductors. The method comprises: obtaining a stored historical training result of a semiconductor memory, the historical training result comprising a historical expected delay value and a historical expected voltage; setting a delay threshold and a current training voltage range, the delay threshold being less than or equal to the historical expected delay value, the current training voltage range comprising the historical expected voltage; obtaining a current minimum delay value for the semiconductor memory under the historical expected voltage; and using the stored historical training result as a current training result of the semiconductor memory, if the current minimum delay value for the semiconductor memory under the historical expected voltage is no less than the delay threshold.

A semiconductor memory instance is provided that includes an array of memory cells. The array includes a plurality of semiconductor memory cells arranged in at least one column and at least one row. Each of the semiconductor memory cells includes a floating body region configured to be charged to a level indicative of a state of the memory cell. Further includes are a plurality of buried well regions, wherein each of the buried well regions can be individually selected, and a decoder circuit to select at least one of the buried well regions.

A semiconductor memory instance is provided that includes an array of memory cells. The array includes a plurality of semiconductor memory cells arranged in at least one column and at least one row. Each of the semiconductor memory cells includes a floating body region configured to be charged to a level indicative of a state of the memory cell. Further includes are a plurality of buried well regions, wherein each of the buried well regions can be individually selected, and a decoder circuit to select at least one of the buried well regions.

First semiconductor structures are formed on a first wafer. At least one of the first semiconductor structures includes a programmable logic device, an array of static random-access memory (SRAM) cells, and a first bonding layer including first bonding contacts. Second semiconductor structures are formed on a second wafer. At least one of the second semiconductor structures includes an array of NAND memory cells and a second bonding layer including second bonding contacts. The first wafer and the second wafer are bonded in a face-to-face manner, such that the at least one of the first semiconductor structures is bonded to the at least one of the second semiconductor structures. The first bonding contacts of the first semiconductor structure are in contact with the second bonding contacts of the second semiconductor structure at a bonding interface. The bonded first and second wafers are diced into dies. At least one of the dies includes the bonded first and second semiconductor structures.

A novel semiconductor device or a highly reliable semiconductor device is provided. The on/off state of a transistor which functions as a switch for writing data is controlled using the potential of a potential hold portion. The potential of the potential hold portion is controlled using a plurality of capacitors, whereby both a positive potential and a negative potential can be held in the potential hold portion. Accordingly, deterioration of the transistor which functions as the switch for writing data can be prevented and the characteristics of the transistor can be maintained. Therefore, the highly reliable semiconductor device can be provided.

In accordance with a first aspect of the present disclosure, a storage device is provided, comprising: a capacitor configured to be charged; a charge circuit configured to charge said capacitor; a pass device coupled between the charge circuit and the capacitor; a control circuit configured to control said pass device; a photosensitive diode coupled between the control circuit and the pass device, such that an input voltage provided by the control circuit to the pass device is reduced if the storage device is exposed to light. In accordance with a second aspect of the present disclosure, a corresponding method of producing a storage device is conceived.

A semiconductor device that writes data to, instead of a defective memory cell, another memory cell is provided. The semiconductor device includes a first circuit and a second circuit over the first circuit; the first circuit corresponds to a memory portion and includes a memory cell and a redundant memory cell; a second circuit corresponds to a control portion and includes a third circuit and a fourth circuit. The memory cell is electrically connected to the third circuit, the redundant memory cell is electrically connected to the third circuit, and the third circuit is electrically connected to the fourth circuit. The fourth circuit has a function of sending data to be written to the memory cell or the redundant memory cell to the third circuit, and the third circuit has a function of bringing the memory cell and the fourth circuit into a non-conduction state and the redundant memory cell and the fourth circuit into a conduction state to send the data to the redundant memory cell when the memory cell is a defective cell.

Semiconductor devices including vertically-stacked combination memory devices and associated systems and methods are disclosed herein. The vertically-stacked combination memory devices include at least one volatile memory die and at least one non-volatile memory die stacked on top of each other. The corresponding stack may be attached to a controller die that is configured to provide interface for the attached volatile and non-volatile memory dies.

Systems, apparatuses and methods include technology that identifies whether a product of first and second digital numbers is associated with a positive value or a negative value. During a first clock phase, the technology sets a first reference voltage to have a first value or a second value based on whether the product is associated with the positive value or the negative value. During the first clock phase, the technology controls switches to supply the first reference voltage to first plates of capacitors. Each of the capacitors includes a respective first plate of the first plates and a second plate. Further, during the first clock phase, the technology controls the switches based on the first digital number to electrically connect at least one of the second plates to the first reference voltage and electrically connect at least one of the second plates to a second reference voltage.