A digital signal processing device includes a control unit that performs control to alternately burst transfer burst length audio data in a first half area of a first buffer memory and burst length audio data in a second half area of the first buffer memory to a DRAM, in which the control unit performs control to burst transfer the burst length audio data in the first half area of the first buffer memory to the DRAM while writing audio data one word at a time to the second half area of the first buffer memory in sequence and performs control to burst transfer the burst length audio data in the second half area of the first buffer memory to the DRAM while writing audio data one word at a time to the first half area of the first buffer memory in sequence.

An input sampling method includes the following operations. A first pulse signal and a second pulse signal are received. Logical operation is performed on the first pulse signal and the second pulse signal to determine a to-be-sampled signal. The to-be-sampled signal is obtained by shielding an invalid part of the second pulse signal according to a logical operation result. Sampling process is performed on the to-be-sampled signal to obtain a target sampled signal.

An input sampling method includes the following operations. A first pulse signal and a second pulse signal are received. Logical operation is performed on the first pulse signal and the second pulse signal to determine a to-be-sampled signal. The to-be-sampled signal is obtained by shielding an invalid part of the second pulse signal according to a logical operation result. Sampling process is performed on the to-be-sampled signal to obtain a target sampled signal.

Disclosed is a low dropout regulator which includes a first resistor, a first transistor including a gate terminal connected with a first end of the first resistor, a source terminal connected with a power supply voltage terminal, and a drain terminal connected with a first node, an operational amplifier including input terminals respectively connected with a reference voltage and the first node and an output terminal, a second transistor including a gate terminal connected with the output terminal of the operational amplifier, a source terminal connected with the first node, and a drain terminal connected with a second node, a third transistor including a gate terminal connected with a second end of the first resistor, a source terminal connected with the power supply voltage terminal, and a drain terminal connected with a third node, and a current source connected between the second node and a ground voltage terminal.

Disclosed is a low dropout regulator which includes a first resistor, a first transistor including a gate terminal connected with a first end of the first resistor, a source terminal connected with a power supply voltage terminal, and a drain terminal connected with a first node, an operational amplifier including input terminals respectively connected with a reference voltage and the first node and an output terminal, a second transistor including a gate terminal connected with the output terminal of the operational amplifier, a source terminal connected with the first node, and a drain terminal connected with a second node, a third transistor including a gate terminal connected with a second end of the first resistor, a source terminal connected with the power supply voltage terminal, and a drain terminal connected with a third node, and a current source connected between the second node and a ground voltage terminal.

A semiconductor memory apparatus includes a first memory cell array, a second memory cell array, and a hammering control circuit. The first memory cell array includes a first row hammer memory cell. The second memory cell array includes a second row hammer memory cell. The hammering control circuit controls the number of active operations on a first word line to be stored in the second row hammer memory cell and controls the number of active operations on a second word line to be stored in the first row hammer memory cell.

A semiconductor memory apparatus includes a first memory cell array, a second memory cell array, and a hammering control circuit. The first memory cell array includes a first row hammer memory cell. The second memory cell array includes a second row hammer memory cell. The hammering control circuit controls the number of active operations on a first word line to be stored in the second row hammer memory cell and controls the number of active operations on a second word line to be stored in the first row hammer memory cell.

Methods, apparatuses, and systems related to coordinating a set of timing-critical operations across parallel processing pipelines are described. The coordination may include selectively using (1) circuitry associated with a corresponding pipeline to generate enable signals associated with the timing critical operations when a separation between the operations corresponds to a number of pipelines or (2) circuitry associated with a non-corresponding or another pipeline when the separation is not a factor of the number of pipelines.

Methods, apparatuses, and systems related to coordinating a set of timing-critical operations across parallel processing pipelines are described. The coordination may include selectively using (1) circuitry associated with a corresponding pipeline to generate enable signals associated with the timing critical operations when a separation between the operations corresponds to a number of pipelines or (2) circuitry associated with a non-corresponding or another pipeline when the separation is not a factor of the number of pipelines.

Apparatuses and methods are provided for logic/memory devices. An example apparatus comprises a plurality of memory components adjacent to and coupled to one another. A logic component is coupled to the plurality of memory components. At least one memory component comprises a memory device having an array of memory cells and sensing circuitry coupled to the array. The sensing circuitry includes a sense amplifier and a compute component. Timing circuitry is coupled to the array and sensing circuitry and configured to control timing of operations for the sensing circuitry. The logic component comprises control logic coupled to the timing circuitry. The control logic is configured to execute instructions to cause the sensing circuitry to perform the operations.