A non-volatile memory device includes a first semiconductor layer and a second semiconductor layer arranged in the vertical direction. A first semiconductor layer includes a plurality of memory cells, and a plurality of metal lines extending in a first direction, and including first bit lines, second bit lines, and a common source line tapping wire between the first bit lines and the second bit lines. A second semiconductor layer includes a page buffer circuit connected to the first bit lines and the second bit lines, and the page buffer circuit includes first transistors arranged below the first bit lines and electrically connected to the first bit lines, second transistors arranged below the second bit lines and electrically connected to the second bit lines, and a first guard ring arranged below and overlapped the common source line tapping wire in the vertical direction and extending in the first direction.

A non-volatile memory device includes a first semiconductor layer and a second semiconductor layer arranged in the vertical direction. A first semiconductor layer includes a plurality of memory cells, and a plurality of metal lines extending in a first direction, and including first bit lines, second bit lines, and a common source line tapping wire between the first bit lines and the second bit lines. A second semiconductor layer includes a page buffer circuit connected to the first bit lines and the second bit lines, and the page buffer circuit includes first transistors arranged below the first bit lines and electrically connected to the first bit lines, second transistors arranged below the second bit lines and electrically connected to the second bit lines, and a first guard ring arranged below and overlapped the common source line tapping wire in the vertical direction and extending in the first direction.

A nonvolatile memory apparatus may include a control circuit, a sense amplifier, and a reference generator. The control circuit may apply a read voltage across a target memory cell through a selected global bit line and a selected global word line. The sense amplifier may generate an output signal by comparing voltage levels of the selected global word line and a reference line. The reference generator may change the voltage level of the reference line by charging and discharging a capacitor that is coupled to the reference line.

A nonvolatile memory apparatus may include a control circuit, a sense amplifier, and a reference generator. The control circuit may apply a read voltage across a target memory cell through a selected global bit line and a selected global word line. The sense amplifier may generate an output signal by comparing voltage levels of the selected global word line and a reference line. The reference generator may change the voltage level of the reference line by charging and discharging a capacitor that is coupled to the reference line.

A semiconductor memory device includes a first semiconductor pillar having i first memory cells on a first side and i second memory cells on a second side, a second semiconductor pillar having i third memory cells on a third side and i fourth memory cells on a fourth side, i first word lines (i is an integer of 4 or more) connected to the i first memory cells and the i third memory cells, i second word lines connected to the i second memory cells and the i fourth memory, and a driver. In writing data to the k-th (k is smaller than i and greater than 1) first memory cell, the driver supplies the k-th first word line with a first voltage larger than a reference voltage, and supplies the k-th second word line with a second voltage smaller than the reference voltage.

A semiconductor memory device includes a first semiconductor pillar having i first memory cells on a first side and i second memory cells on a second side, a second semiconductor pillar having i third memory cells on a third side and i fourth memory cells on a fourth side, i first word lines (i is an integer of 4 or more) connected to the i first memory cells and the i third memory cells, i second word lines connected to the i second memory cells and the i fourth memory, and a driver. In writing data to the k-th (k is smaller than i and greater than 1) first memory cell, the driver supplies the k-th first word line with a first voltage larger than a reference voltage, and supplies the k-th second word line with a second voltage smaller than the reference voltage.

Methods, systems, and devices for sense amplifier with digit line multiplexing are described. A method includes precharging an input and an output of an amplifier stage of a sense component to a first voltage based on a read operation associated with a memory cell. The method includes precharging a first side and a second side of a latch stage of the sense component to the first voltage based on precharging the output of the amplifier stage to the first voltage, the latch stage coupled with the amplifier stage. The method may also include coupling a second voltage from a digit line associated with the memory cell to the input of the amplifier stage, the amplifier stage generating a third voltage on the output based on coupling the second voltage to the input, and the latch stage latching a logic value associated with the memory cell based on the third voltage.

Methods, systems, and devices for sense amplifier with digit line multiplexing are described. A method includes precharging an input and an output of an amplifier stage of a sense component to a first voltage based on a read operation associated with a memory cell. The method includes precharging a first side and a second side of a latch stage of the sense component to the first voltage based on precharging the output of the amplifier stage to the first voltage, the latch stage coupled with the amplifier stage. The method may also include coupling a second voltage from a digit line associated with the memory cell to the input of the amplifier stage, the amplifier stage generating a third voltage on the output based on coupling the second voltage to the input, and the latch stage latching a logic value associated with the memory cell based on the third voltage.

A memory module includes a module substrate, a plurality of memory devices, a first power line, and a second power line. The memory devices are mounted on the module substrate. Each of the memory devices includes a power management member. The first power line may be arranged in the module substrate to provide each of the memory devices with power. The second power line may be electrically connected between the power management members of adjacent memory devices to control and share the power provided to the adjacent memory devices.

A memory module includes a module substrate, a plurality of memory devices, a first power line, and a second power line. The memory devices are mounted on the module substrate. Each of the memory devices includes a power management member. The first power line may be arranged in the module substrate to provide each of the memory devices with power. The second power line may be electrically connected between the power management members of adjacent memory devices to control and share the power provided to the adjacent memory devices.