An integrated circuit (IC) device may include a single substrate that includes a single chip, and a plurality of memory cells spaced apart from one another on the substrate and having different structures. Manufacturing the IC device may include forming a plurality of first word lines in a first region of the substrate, and forming a plurality of second word lines in or on a second region of the substrate. Capacitors may be formed on the first word lines. Source lines may be formed on the second word lines. An insulation layer that covers the plurality of capacitors and the plurality of source lines may be formed in the first region and the second region. A variable resistance structure may be formed at a location spaced apart from an upper surface of the substrate by a first vertical distance, in the second region.

A memory device includes a page made of a plurality of memory cells arranged in rows on a substrate. A page write operation is performed, during which, in each of the memory cells included in the page, a first voltage V1 is applied to a first drive control line PL, a second voltage V2 is applied to a word line WL, a third voltage V3 is applied to a source line SL, a fourth voltage V4 is applied to a bit line BL, a group of holes generated by an impact ionization phenomenon is retained in an inside of the channel semiconductor layer. A page erase operation is performed, during which the voltages to be applied to the first drive control line PL, the word line WL, the source line SL, and the bit line BL are controlled to discharge the group of holes from the inside of the channel semiconductor layer, and the voltage of the channel semiconductor layer is decreased. A page read operation is performed, during which a fifth voltage V5 that is lower than the first voltage V1 is applied to the first drive control line PL, a sixth voltage V6 that is lower than the second voltage V2 is applied to the word line WL, the third voltage V3 is applied to the source line, and a seventh voltage V7 that is lower than the fourth voltage V4 is applied to the bit line.

A semiconductor device including a memory which can perform a pipeline operation is provided. The semiconductor device includes a processor core, a bus, and a memory section. The memory section includes a first memory. The first memory includes a plurality of local arrays. The local array includes a sense amplifier array and a local cell array stacked thereover. The local cell array is provided a memory cell including one transistor and one capacitor. The transistor is preferably an oxide semiconductor transistor. The first memory is configured to generate a wait signal. The wait signal is generated when a request for writing data to the same local array is received over two successive clock cycles from the processor core. The wait signal is sent to the processor core via the bus. The processor core stands by for a request for the memory section on the basis of the wait signal.

Embodiment provides a semiconductor structure and a fabrication method thereof, and relates to the field of semiconductor technology. The method includes: providing a substrate having an array region including a first region and a second region arranged adjacently; and forming a first memory in the first region and forming a second memory in the second region by means of a same fabrication process, the fabrication process being a process configured for fabricating the first memory.

Embodiments relate to the field of semiconductor manufacturing technology, and more particularly, to a semiconductor structure and a method for fabricating a semiconductor structure. The semiconductor structure includes a substrate including a first array region and a second array region. The first array region is provided with a first memory array comprising a plurality of first memory structures, and the second array region is provided with a second memory array comprising a plurality of second memory structures. Compared with related technologies where different memory structures are stacked on a substrate, in this embodiment, the plurality of first memory structures and the plurality of second memory structures are arranged side by side on the substrate, which is advantageous to simplifying fabrication processes and improving production efficiency.

A memory system and memory controller for interleaving volatile and non-volatile memory accesses are described. In the memory system, the memory controller is coupled to the volatile and non-volatile memories using a shared address bus. Activate latencies for the volatile and non-volatile memories are different, and registers are included on the memory controller for storing latency values. Additional registers on the memory controller store precharge latencies for the memories as well as page size for the non-volatile memory. A memory access sequencer on the memory controller asserts appropriate chip select signals to the memories to initiate operations therein.

A memory cell arrangement is provided that may include: one or more memory cells, each memory cell of the one or more memory cells including: a field-effect transistor structure; a plurality of first control nodes; a plurality of first capacitor structures, a second control node; and a second capacitor structure including a first electrode connected to the second control node and a second electrode connected to a gate region of the field-effect transistor. Each of the plurality of first capacitor structures includes a first electrode connected to a corresponding first control node of the plurality of first control nodes, a second electrode connected to the gate region of the field-effect transistor structure, and a spontaneous-polarizable region disposed between the first electrode and the second electrode of the first capacitor structure.

A semiconductor memory cell including a capacitorless transistor having a floating body configured to store data as charge therein when power is applied to the cell, and a non-volatile memory comprising a bipolar resistive change element, and methods of operating.

Embodiments of an improved memory architecture for processing data inside of a device are described. In some embodiments, the device can store neural network layers, such as a systolic flow engine, in non-volatile memory and/or a separate first memory. A processor of a host system can delegate the execution of a neural network to the device. Advantageously, neural network processing in the device can be scalable, with the ability to process large amounts of data.

There is provided a neural network circuit device including a plurality of synapse circuits storing a synaptic coupling weight and a neuron circuit connected to the plurality of synapse circuits. The plurality of synapse circuits store the synaptic coupling weight in a non-volatile manner and output a voltage signal having a magnitude based on the stored synaptic coupling weight in response to an input signal. The neuron circuit includes a neuron MOS transistor having a floating gate and a plurality of control gates which are capacitively coupled to the floating gate and to which the voltage signals from the plurality of synapse circuits are input respectively, and a pulse generator outputting a pulse signal by turning on or off the neuron MOS transistor.