According to one embodiment, an arithmetic device includes one or a plurality of arithmetic units. One of the one or plurality of arithmetic units includes a memory part including a plurality of memory regions, and an arithmetic part. At least one of the memory regions includes a memory element. The memory element is of a shift register-type.

In some embodiments, a programmable circuit configured to store a shift setting for a mode register parameter, and a shift circuit is configured to receive a first value of a mode register parameter. In response to the shift setting signal having a first value, the shift circuit is configured to adjust the first value of the mode register parameter to provide the mode register parameter having a second value. In response to the shift setting signal having a second value, the shift circuit is further configured to provide the first value of the mode register parameter as the second value of the mode register parameter. Circuitry coupled to an input/output terminal is configured to set a configuration based on the second value of the mode register parameter. The mode register parameter includes an on-die termination (ODT) parameter and the circuitry includes an ODT circuit, in some examples.

In some embodiments, a programmable circuit configured to store a shift setting for a mode register parameter, and a shift circuit is configured to receive a first value of a mode register parameter. In response to the shift setting signal having a first value, the shift circuit is configured to adjust the first value of the mode register parameter to provide the mode register parameter having a second value. In response to the shift setting signal having a second value, the shift circuit is further configured to provide the first value of the mode register parameter as the second value of the mode register parameter. Circuitry coupled to an input/output terminal is configured to set a configuration based on the second value of the mode register parameter. The mode register parameter includes an on-die termination (ODT) parameter and the circuitry includes an ODT circuit, in some examples.

A method includes receiving, at a bitline-mux driver circuit, a subarray activation (SUBA) signal and a delay signal. The bitline-mux driver circuit includes a header circuit operable to output a driver voltage to a plurality of driver circuits. The driver voltage is boosted through a voltage divider with diode header circuit based on the SUBA signal to set the driver voltage to a value above a standard supply voltage (VDD) and between a voltage bitline high (VBLH) level and a high voltage (VPP) level. The VPP level exceeds a maximum allowed voltage (VMAX) level of the driver circuits. A master wordline output of the driver circuits is driven to select a bitline mux of a computer memory module based on an address input signal, the delay signal, and the driver voltage.

A method includes receiving, at a bitline-mux driver circuit, a subarray activation (SUBA) signal and a delay signal. The bitline-mux driver circuit includes a header circuit operable to output a driver voltage to a plurality of driver circuits. The driver voltage is boosted through a voltage divider with diode header circuit based on the SUBA signal to set the driver voltage to a value above a standard supply voltage (VDD) and between a voltage bitline high (VBLH) level and a high voltage (VPP) level. The VPP level exceeds a maximum allowed voltage (VMAX) level of the driver circuits. A master wordline output of the driver circuits is driven to select a bitline mux of a computer memory module based on an address input signal, the delay signal, and the driver voltage.

In some embodiments, a programmable circuit configured to store a shift setting for a mode register parameter, and a shift circuit is configured to receive a first value of a mode register parameter. In response to the shift setting signal having a first value, the shift circuit is configured to adjust the first value of the mode register parameter to provide the mode register parameter having a second value. In response to the shift setting signal having a second value, the shift circuit is further configured to provide the first value of the mode register parameter as the second value of the mode register parameter. Circuitry coupled to an input/output terminal is configured to set a configuration based on the second value of the mode register parameter. The mode register parameter includes an on-die termination (ODT) parameter and the circuitry includes an ODT circuit, in some examples.

According to an embodiment, a semiconductor device includes a plurality of first interconnections, a plurality of gate dielectric films, and a plurality of second interconnections. The plurality of first interconnections are oxide semiconductors formed in parallel at predetermined intervals in a first direction. The plurality of gate dielectric films are formed on surfaces of the first interconnections, respectively. The plurality of second interconnections are conductors formed at predetermined intervals in parallel to a second direction orthogonal to the first direction, respectively, to bridge over the gate dielectric films.

According to one embodiment, an arithmetic device includes one or a plurality of arithmetic units. One of the one or plurality of arithmetic units includes a memory part including a plurality of memory regions, and an arithmetic part. At least one of the memory regions includes a memory element. The memory element is of a shift register-type.

A field effect transistor, a memory element, and a manufacturing method of a charge storage structure are provided. The memory element includes a plurality of field effect transistors, and each of the field effect transistors includes a substrate, a source region, a drain region, a gate conductive layer, and a charge storage structure. Both the source region and the drain region are located in the substrate and connected to an upper surface of the substrate. The source and drain regions are spaced apart from each other to define a channel region therebetween. The gate conductive layer is disposed over the upper surface and overlaps with the channel region. The charge storage structure disposed between the gate conductive layer and the channel region includes a ferroelectric material and a paraelectric material so that the charge storage structure has better capability of trapping charges and a higher switching speed.

A charge-coupled device (CCD) image sensor is provided. The CCD image sensor may include an array of photosensors that transfer charge to multiple vertical CCD shift registers, which then in turn transfer the charge to a horizontal CCD shift register. The horizontal CCD shift register then feeds an output buffer circuit. The output buffer circuit can include multiple output stages, each of which can include a source-follower transistor coupled in series with a current sink transistor and at least one cascode transistor. The current sink transistor may have its gate terminal shorted to ground. In one arrangement, the cascode transistor has a gate terminal that receives a non-zero bias voltage. In another arrangement, the cascode transistor has a gate terminal that is also shorted to ground and operates in depletion mode.