A semiconductor memory device includes a memory and a memory controller configured to control the memory. The memory controller includes a normal operation control part and a repair part. The normal operation control part is configured to control a normal operation of the memory and includes a plurality of storage spaces used while the normal operation is controlled. The repair part is configured to control a repair operation of the memory and stores faulty addresses detected while the repair operation is controlled into the plurality of storage spaces included in the normal operation control part.

A method to manufacture a semiconductor device includes: bonding a first wafer and a second wafer to be stacked vertically with one another, in which the first wafer provides a plurality of memory components and the second wafer provides a control circuit; forming a plurality of input/output channels on a surface of one of the first and second wafers; and cutting the bonded first and second wafers into a plurality of dices; wherein a plurality of first conductive contacts in the first wafer are electrically connected to the control circuit and the first conductive contacts in combinations with a plurality of first conductive vias in the first wafer form a plurality of transmission channels through which the control circuit is capable to access the memory components.

A semiconductor device includes a processing unit that issue a memory access request with a virtual address, a first and a second memory management unit and a test result storage unit. The first and the second memory management unit are hierarchically provided, and each include address translation unit translating the virtual memory of the memory access request into a physical address and self-test unit testing for the address translation unit. The test result storage unit stores a first self-test result that indicates a result of the first self-test unit and a second self-test result that indicates a result of the second self-test unit.

A system includes a plurality of memory dice and a processing device coupled to the plurality of memory dice. The processing device is to determine whether an error correcting code (ECC) check of ECC-protected data read from a die of the plurality of memory dice results in detecting an error. In response to detecting the error from the ECC-protected data, the processing device performs a confirmation check that the error is a result of a defect in the die. In response to the confirmation check confirming the die is defective, the processing device ignores a temperature value from the die when determining whether to trigger a thermal-related operation.

Apparatuses and methods of sharing error correction memory on an interface chip are described. An example apparatus includes: at least one memory chip having a plurality of first memory cells and an interface chip coupled to the at least one memory chip and having a control circuit and a storage area. The control circuit detects one or more defective memory cells of the first memory cells of the at least one memory chip. The control circuit further stores first defective address information of the one or more defective memory cells of the first memory cells into the storage area. The interface chip responds to the first defective address information and an access request to access the storage area in place of the at least one memory chip when the access request has been provided with respect to the one or more defective memory cells of the first memory cells.

Apparatuses and methods are described for selective determination of data error repair. An example apparatus includes a memory array and a controller coupled to the memory array. The controller is configured to direct performance, responsive to a request, of a read operation at an address in the memory array, direct detection of an error in data corresponding to the read operation address, and direct storage of the read operation address in an address error register. The controller is further configured to direct a response be sent to the enable selective determination of data error repair, where the response does not include the read operation address.

A memory device may include a memory cell array including a plurality of memory cells, and an internal operation circuit configured to perform a test operation in a test mode using a parallel bit operation of simultaneously comparing a plurality of bits and also perform an internal operation including a comparison operation with respect to external data in a normal mode other than the test mode using the parallel bit operation.

An input-output circuit includes a reception circuit and a register circuit. The reception circuit operates in accordance with a normal write protocol commonly in a normal write mode and a test write mode. The reception circuit receives a plurality of input signals to generate a plurality of latch signals. The register circuit generates a plurality of test result signals based on the latch signals in the test write mode. The input-output circuit may perform the multiple-input shift register (MISR) function in accordance with the normal write path and the normal write protocol. The MISR function may be performed efficiently without consideration of additional timing adjustment for the test write operation because the MISR function is performed under the same timing condition as the normal write operation.

A system, computer readable medium and a method. The method may include sending input data to a NAND flash memory unit that comprises the NAND flash memory array and instructing the NAND flash memory unit to write input data to the NAND flash memory array to provide programmed data; reading from the NAND flash memory array the programmed data to provide read data; comparing the input data and the read data to provide column errors statistics at a column resolution; and defining, by a flash memory controller, bad columns of the NAND flash memory array in response to the column error statistics.

The present invention relates to a method of validating a memory device. The method includes validating a second memory device based on one or more first microcode instructions stored in a validated predetermined part of a first memory device to detect the operational status of the second memory device. Further, the method includes receiving one or more second microcode instructions upon validating the second memory device. Finally, validating the first memory device based on the one or more second microcode instructions stored in the second memory device to detect the operational status of the first memory device.