The present disclosure relates to the field of semiconductor circuit design, and in particular to a readout circuit layout structure and a method of reading data. The readout circuit layout structure includes: a first readout circuit structure and a second readout circuit structure having identical structures, wherein the first readout circuit structure and the second readout circuit structure each include: a first isolation module, configured to be turned on according to a first isolation signal, electrically connect a bit line and a first readout bit line, and electrically connect a complementary bit line and a first complementary readout bit line; a second isolation module, configured to be turned on according to a second isolation signal, electrically connect the first readout bit line and a second readout bit line, and electrically connect the first complementary readout bit line and a second complementary readout bit line.

The present disclosure includes apparatuses and methods related to performing logical operations using sensing circuitry. An example apparatus comprises an array of memory cells and sensing circuitry coupled to the array. The sensing circuitry can include a sense amplifier coupled to a pair of complementary sense lines and a compute component coupled to the sense amplifier via pass gates coupled to logical operation selection logic. The logical operation selection logic can be configured to control pass gates based on a selected logical operation.

An edge memory array mat with access lines that are split, and a bank of sense amplifiers formed under the edge memory array may in a region that separates the access line segment halves. The sense amplifiers of the bank of sense amplifiers are coupled to opposing ends of a first subset of the half access lines pairs. The edge memory array mat further includes access line connectors configured to connect a second subset of the half access line pairs across the region occupied by the bank of sense amplifiers to form combined or extended access lines that extend to a bank of sense amplifiers coupled between the edge memory array mat and an inner memory array mat.

A semiconductor memory includes storage arrays, at least one verification module and gating circuits. Each verification module corresponds to multiple storage arrays. The verification module is configured to verify whether an error occurs in data information of the corresponding storage arrays. Each verification module is connected to a group of global data buses. The gating circuits are respectively connected to the storage arrays and the global data buses, and the gating circuits are configured to control on and off of a data transmission path connecting the global data buses to the storage arrays.

Memory systems with burst mode having logic gates as sense elements and related methods are provided. A memory system comprises a memory array including a first set of memory cells coupled to a first wordline, a second set of memory cells coupled to a second wordline, and a plurality of sense elements, not including any sense amplifiers. The control unit is configured to generate control signals for: in response to a burst mode read request, simultaneously: (1) asserting a first wordline signal on the first wordline coupled to each of a plurality of first set of bitlines, and (2) asserting a second wordline signal on the second wordline coupled to each of a plurality of second set of bitlines, and as part of a burst, outputting data corresponding to a subset of each of the first set of memory cells and the second set of memory cells.

A memory device includes a plurality of word lines elongated along a first direction, and at least one memory unit. The at least one memory unit includes a plurality of memory cells, at least one bit line, and at least one column word line. The plurality of memory cells are arranged along a second direction different from the first direction. The at least one bit line is elongated along the second direction, and configured to transmit data of a selected memory cell. The at least one column word line is elongated along the second direction, and configured to control electrical connections between the memory cells and the at least one bit line, wherein the selected memory cell is selected by a corresponding word line and the at least one column word line.

The present disclosure includes apparatuses and methods for cache operations. An example apparatus includes a memory device including a plurality of subarrays of memory cells, where the plurality of subarrays includes a first subset of the respective plurality of subarrays and a second subset of the respective plurality of subarrays. The memory device includes sensing circuitry coupled to the first subset, the sensing circuitry including a sense amplifier and a compute component. The first subset is configured as a cache to perform operations on data moved from the second subset. The apparatus also includes a cache controller configured to direct a first movement of a data value from a subarray in the second subset to a subarray in the first subset.

An apparatus is described. The apparatus according to an embodiment includes a voltage dividing resistor circuit formed on a semiconductor substrate and including first and second resistors and first and second selector switches. The first and second resistors and the first and second selector switches are arranged with one of first and second layouts. The first layout is such that the first and second selector switches are placed between the first and second resistors. The second layout is such that the first and second resistors are placed between the first and second selector switches.

A control circuit, a method for reading and writing and a memory are provided. The control circuit includes a pre-charge circuit, an amplification circuit and an equalization circuit. The pre-charge circuit is directly electrically connected to at least one of a bit line or a complementary bit line. The amplification circuit has a first node and a second node. The equalization circuit is connected between the first node and the bit line and between the second node and the complementary bit line.

A memory includes S storage blocks, N global bitlines, and a signal amplification circuit. Each of the S storage blocks is connected to the N global bitlines, the N global bitlines are connected to the signal amplification circuit, the signal amplification circuit is configured to amplify electrical signals on the N global bitlines, and each storage block includes N columns of storage units, N local bitlines, and N bitline switches. In each storage block, storage units in an i.sup.th column are connected to an i.sup.th local bitline, the i.sup.th local bitline is connected to an i.sup.th global bitline by using an i.sup.th bitline switch in the N bitline switches. A memory array is fine-grained, so that i.sup.th local bitlines in the S storage blocks can share one global bitline.