Systems and methods are provided for controlling a wake-up operation of a memory circuit. The memory circuit is configured to precharge the bit lines of a memory array sequentially during wakeup. A sleep signal is received by the first bit line of a memory cell and then a designed delay occurs prior to the precharge of a second complementary bit line. The sleep signal may then precharge the bit lines of a second memory cell with further delay between the precharge of each bit line. The memory circuit is configured to precharge both bit lines of a memory cell at the same time when an operation associated with that cell is designated.

Embodiments of the present application provide a readout circuit layout structure, a readout circuit, and a memory layout structure. The readout circuit layout structure includes: a readout amplification module, a first processing module, and a second processing module arranged along a preset direction, wherein the readout amplification module is configured to read a voltage of a bit line, and the first processing module and the second processing module are at least configured to perform a noise cancellation on an output signal of the readout amplification module. The readout amplification module includes: a first NMOS region and a first PMOS region arranged close to the first processing module, and a second NMOS region and a second PMOS region arranged close to the second processing module, the first NMOS region, the first PMOS region, the second PMOS region, and the second NMOS region being arranged along the preset direction.

Embodiments of the present application provide a memory structure and a memory layout. The memory structure includes: memory arrays, each including memory cells; read-write conversion circuits, each disposed between two adjacent ones of the memory arrays in a first direction, the read-write conversion circuits being arranged in a second direction, having a symmetry axis in the second direction, and configured to write external data into the memory cells, or read data from the memory cells, and the first direction being perpendicular to the second direction; and sense amplification circuits, symmetrically disposed between two adjacent ones of the memory arrays based on the symmetry axis, and coupled to the memory cells in the adjacent ones of the memory arrays, configured to sense voltages of the memory cells and output logic 1 or 0 corresponding to the voltages of the memory cells.

Structures for 3D sense amplifiers for 3D memories are disclosed. A first embodiment uses one type of vertical transistors in constructing 3D sense amplifiers. A second embodiment uses both n- and p-type transistors for 3D sense amplifiers. Either or both of n- and p-type transistors are vertical transistors. The n- and p-type transistors may reside on different levels, or on the same level above a substrate if both are vertical transistors. In any embodiment, different options are available for gate contact formation. In any embodiments and options or alternatives thereof, one or more sense-enable circuits may be used. Sense amplifiers for several bit lines may be staggered on one or both sides of a memory array. Column multiplexers may be used to couple particular bit lines to data outputs. Bit-line multiplexers may be used to couple certain bit lines to shared 3D sense amplifiers.

Systems and methods are provided for controlling a wake-up operation of a memory circuit. The memory circuit is configured to precharge the bit lines of a memory array sequentially during wakeup. A sleep signal is received by the first bit line of a memory cell and then a designed delay occurs prior to the precharge of a second complementary bit line. The sleep signal may then precharge the bit lines of a second memory cell with further delay between the precharge of each bit line. The memory circuit is configured to precharge both bit lines of a memory cell at the same time when an operation associated with that cell is designated.

Various implementations described herein are directed to an integrated circuit. The integrated circuit may include precharge circuitry for precharging bitlines to a source voltage level. The integrated circuit may include write assist circuitry having a charge storage element for providing a write assist signal to at least one of the bitlines. The integrated circuit may include read assist circuitry having a switching element for providing charge sharing between the bitlines, the precharge circuitry, and the charge storage element of the write assist circuitry.

Bit line equalization driver circuits and related apparatuses, methods, and computing systems are disclosed. An apparatus includes an output inverter including a pull-up transistor and a pull-down transistor electrically connected in series between a pull-up node and a pull-down node. An output node is electrically connected between the pull-up transistor and the pull-down transistor. The pull-down transistor includes a short length transistor having a degradation voltage potential across the pull-down transistor below which the pull-down transistor is configured to operate to avoid degradation of the pull-down transistor. The apparatus also includes biasing circuitry configured to control voltage potentials at the pull-up node and the pull-down node to enable the output inverter to assert, at the output node, an output voltage potential that is greater than the degradation voltage potential higher than a low power supply voltage potential at the low power supply node.

A circuit for reading a memory cell of a non-volatile memory device provided with a memory array with cells arranged in wordlines and bitlines, among which a first bitline, associated to the memory cell, and a second bitline, has: a first circuit branch associated to the first bitline and a second circuit branch associated to the second bitline, each with a local node, coupled to which is a first dividing capacitor, and a global node, coupled to which is a second dividing capacitor; a decoder stage for coupling the local node to the first or second bitlines and coupling the global node to the local node; and a differential comparator stage supplies an output signal indicative of the datum stored; and a control unit for controlling the decoder stage, the coupling stage, and the differential comparator stage for generation of the output signal.

Bit line equalization driver circuits and related apparatuses, methods, and computing systems are disclosed. An apparatus includes an output inverter including a pull-up transistor and a pull-down transistor electrically connected in series between a pull-up node and a pull-down node. An output node is electrically connected between the pull-up transistor and the pull-down transistor. The pull-down transistor includes a short length transistor having a degradation voltage potential across the pull-down transistor below which the pull-down transistor is configured to operate to avoid degradation of the pull-down transistor. The apparatus also includes biasing circuitry configured to control voltage potentials at the pull-up node and the pull-down node to enable the output inverter to assert, at the output node, an output voltage potential that is greater than the degradation voltage potential higher than a low power supply voltage potential at the low power supply node.

Structures for 3D sense amplifiers for 3D memories are disclosed. A first embodiment uses one type of vertical transistors in constructing 3D sense amplifiers. A second embodiment uses both n- and p-type transistors for 3D sense amplifiers. Either or both of n- and p-type transistors are vertical transistors. The n- and p-type transistors may reside on different levels, or on the same level above a substrate if both are vertical transistors. In any embodiment, different options are available for gate contact formation. In any embodiments and options or alternatives thereof, one or more sense-enable circuits may be used. Sense amplifiers for several bit lines may be staggered on one or both sides of a memory array. Column multiplexers may be used to couple particular bit lines to data outputs. Bit-line multiplexers may be used to couple certain bit lines to shared 3D sense amplifiers.