Technology is disclosed herein for concurrently programming the same data pattern in multiple sets of non-volatile memory cells. Voltage are applied to bit lines in accordance with a data pattern. A select voltage is applied to drain select gates of multiple sets of NAND strings. The system concurrently applies a program pulse to control gates of a different set of selected memory cells in each respective set of the multiple sets of the NAND strings while the select voltage is applied to the drain select gates of the multiple sets of the NAND strings and the voltages are applied to the plurality of bit lines to concurrently program the data pattern into each set of the selected memory cells.

Apparatuses and techniques are described for programming data in memory cells while concurrently storing backup data. Initial pages of multiple bit per cell data are encoded to obtain at least first and second pages of single bit per cell data. The initial pages of multiple bit per cell data are programmed into a primary set of memory cells, while concurrently the first and second pages of single bit per cell data are programmed into first and second backup sets of memory cells, respectively. In the event of a power loss, the first and second pages of single bit per cell data are read from the first and second backup sets of memory cells, and decoded to recover the initial pages of multiple bit per cell data.

Aspects of the present disclosure are directed to magnetic tunnel junction (MTJ) structures comprising multiple MTJ bits connected in series. For example, a magnetic tunnel junction (MTJ) stack according to the present disclosure may include at least a first MTJ bit and a second MTJ bit stacked above the first MTJ bit, and a resistance state of the MTJ stack may be read by passing a single read current through both the first MTJ bit and the second MTJ bit.

An operation method of a semiconductor storage device including a first memory die is provided. The first memory die includes a first memory plane including a plurality of first memory blocks, a second memory plane including a plurality of second memory blocks. The method includes starting a first write sequence with respect to one of the first memory blocks in response to a first command set designating the one of the first memory blocks and starting a second write sequence with respect to one of the second memory blocks in response to a second command set designating the one of the second memory blocks. At least part of the second write sequence is performed while the first write sequence is being performed.

Provided herein may be a memory device capable of completing program operations for multiple pages in one ready/busy period. The memory device may include a plurality of memory cells configured to form a plurality of pages, a peripheral circuit configured to perform a first program operation and a second program operation and control logic configured to control the peripheral circuit to receive least significant bit (LSB) page data of a page adjacent to a selected page, center significant bit (CSB) page data, and most significant bit (MSB) page data of the selected page from a memory controller, and program the LSB page data of the page adjacent to the page adjacent to the selected page and to obtain LSB page data from the selected page, previously stored in the selected page, and program the LSB page data, the CSB page data and the MSB page data of the selected page to the selected page.

A command to program data to a memory device is received. Target charge levels of a set of memory cells in the memory device for a first programming step are determined based on the data. A first set of indicators are provided to the memory device. The first set of indicators indicate the target charge levels for the first programming step. Target charge levels of the set of memory cells for a second programming step are determined based on the data. A second set of indicators are provided to the memory device. The second set of indicators indicate the target charge levels for the second programming step.

Skip program verify for dynamic start voltage (DSV) sampling reduces latency of a program operation on multi-level cell (MLC) memory having at least two pages and programmable with multiple threshold voltage levels, such as a Triple Level Cell (TLC) NAND device. The NAND device skips program verifies corresponding to higher levels of voltage thresholds during DSV sampling. As a result, the NAND device can reduce a total program time (tPROG) to program the MLC memory, and determine the dynamic start program voltage more quickly. The NAND device can improve an effective TLC NAND tPROG by as much as 2% without impacting the placement of the first sub-block being programmed. The skipped program verifies corresponding to the higher levels of voltage thresholds are resumed as soon as DSV sampling is complete.

Described herein are embodiments related to first-pass dynamic program targeting (DPT) operations on memory cells of memory systems. A method includes determining that a first programming pass of a programming operation has been performed on a memory cell of the memory component, and performing a dynamic program targeting (DPT) operation on the memory cell to calibrate a first program-verify (PV) target value that results in an adjustment to a placement of a first first-pass programming distribution and a second PV target value that results in an adjustment to a placement of a second first-pass programming distribution before a second programming pass of the programming operation is performed on the memory cell.

Multi-state programming of non-volatile memory cells, where cells being programmed to different target states are programmed concurrently, is performed by modulating the program speed of each state using a controlled amount of state-dependent weak boosting in their respective channels. In one example, the channel boosting is controlled by using a multi-stair word line ramp in conjunction with raising of the voltage on bit lines at a time based on the corresponding memory cell's target state.

The present technology includes a memory device which includes a plurality of planes in which data is stored, a peripheral circuit configured to perform operations on the plurality of planes, micro-control circuits configured to control the peripheral circuit so that the operations on the plurality of planes are independently performed, and a memory manager including a control memory in which different control codes for controlling the peripheral circuit are stored, and configured to output the control codes to the micro-control circuits, wherein the memory manager is configured to sequentially output a selected control code among the control codes to the micro-control circuits respectively corresponding to the planes.