An elementary cell includes a device and a non-volatile resistive memory mounted in a series, the device including an upper selector electrode, a lower selector electrode, a layer made up of a first active material, referred to as an active selecting layer, the device being intended to form a volatile selector; the memory including an upper memory electrode, a lower memory electrode, a layer made of at least a second active material, referred to as an active memory layer, the active selecting layer being in a conductive crystalline state and the memory being in a very strongly resistive state that is more resistive than the strongly resistive state of the memory.

A phase change (PCM) memory device that includes a PCM and a resistance-capacitance (RC) circuit. The PCM has one or more PCM properties, each PCM property has a plurality of PCM property states. As the PCM property states of a given property are Set or Reset, the PCM property states each produce an incremental change to a property level of the respective/associated PCM property, e.g., PCM conductance. The incremental changes to property level of the PCM memory device are in response to application of one or more of a pulse number of voltage pulses. The RC circuit produces a configuring current that flows through the PCM in response to one or more of the voltage pulses. The configuring current modifies one or more of the incremental changes to one or more of the property levels so that the property level changes lineally with respect to the pulse number. The PCM memory device has use in a synapse connector, e.g., in a memory array. The memory array can be used to store and/or read memory values associated with one or more of the property levels. The memory values can be used as weighting values in a neuromorphic computing application/system, like a neural network.

A semiconductor device is provided. The semiconductor device includes a substrate a substrate, a first electrode structure on the substrate, the first electrode structure including first insulating patterns and first electrode patterns, the first insulating patterns alternately stacked with the first electrode patterns, a second electrode pattern on a sidewall of the first electrode structure, and a data storage film on a sidewall of the second electrode pattern. The data storage film has a variable resistance.

A memory includes first signal lines divided into groups respectively including m (m is an integer equal to or larger than 2) lines, and second signal lines. A memory cell array includes memory cells. (m+2) or more global signal lines are configured to apply a selection voltage to any of the first signal lines. First transistors are provided to correspond to each of the first signal lines in one-to-one correspondence and are connected between the first signal lines and the global signal lines. First selection signal lines are provided to respectively correspond to the groups, and are each connected to gate electrodes of the first transistors included in a corresponding one of the groups in common. The first signal lines located at both ends of each of any two of the groups which are adjacent to each other are connected to mutually different ones of the global signal lines.

In an embodiment, a method includes receiving, between a positive input terminal and a negative input terminal, a supply voltage, receiving a data signal, generating, by a voltage generator in a branch of a plurality of branches, a branch current as a function of a respective driving signal and of a regulated voltage, each branch connected between the positive input terminal and the negative input terminal, selectively activating the voltage generator as a function of a respective enabling signal and providing, between a positive output terminal and a negative output terminal, the regulated voltage to one or more driving circuits.

Systems and methods for reducing the impact of defects within a crossbar memory array when performing multiplication operations in which multiple control lines are concurrently selected are described. A group of memory cells within the crossbar memory array may be controlled by a local word line that is controlled by a local word line gating unit that may be configured to prevent the local word line from being biased to a selected word line voltage during an operation; the local word line may instead be set to a disabling voltage during the operation such that the memory cell currents through the group of memory cells are eliminated. If a defect has caused a short within one of the memory cells of the group of memory cells, then the local word line gating unit may be programmed to hold the local word line at the disabling voltage during multiplication operations.

A memory cell includes an input coupled to a read line, an output coupled to a circuit ground, a bi-polar memristor, and at least one address switch coupled to an address line to select the memory cell. A memory includes the bi-polar memristor and a one-way current conducting device, wherein the one-way current conducting device is positioned between the memristor cell output and the circuit ground, or between the read line and the memristor cell input.

Circuit and method for controlling a resistive memory formed by resistive memory cells each provided with a resistive memory element associated in series with a selector, each cell implementing a coding referred to as “multi-level” coding and being programmed in a given programming state among k (with k>2) possible programming states, wherein during a read operation, a sequence of different read voltages are applied to the given cell, and at each applied read voltage it is detected whether the read current passing through said given cell consecutively to the application of said read voltage corresponds to a leakage current level of the selector when this selector is in an off state or to a current level when the selector is in an on state.

A control method to operate a memory device, a control method to operate a memory system and a control system are provided. The control method includes providing a first voltage to a memory device for accessing a memory element of the memory device; obtaining an aging information of the memory device; and providing a second voltage to the memory device according to the aging information, wherein the first voltage and the second voltage are reverse biased voltages.

A resistive memory device including a resistive memory pattern; and a selection element pattern electrically connected to the resistive memory pattern, the selection element pattern including a chalcogenide switching material and at least one metallic material, the chalcogenide switching material including germanium, arsenic, and selenium, and the at least one metallic material including aluminum, strontium, or indium, wherein the selection element pattern includes an inhomogeneous material layer in which content of the at least one metallic material in the selection element pattern is variable according to a position within the selection element pattern.