A memory device includes a memory array of memory cells and control logic operatively coupled to the memory array. The control logic to perform memory erase operations including: performing a true erase sub-operation by causing multiple pulse steps to be applied sequentially to a group of memory cells of the memory array, wherein each sequential pulse step of the multiple pulse steps occurs during a pulse-step period and at a higher voltage compared to an immediately-preceding pulse-step; in response to detecting an erase suspend command during a pulse step, suspending the true erase sub-operation at a start of a subsequent pulse-step period after the pulse step; and resuming the true erase sub-operation at an end of the subsequent pulse-step period.

A method of controlling a memory device includes receiving a write instruction; starting a write operation to a first address in response to the write instruction; receiving a first read instruction of the first address; suspending the write operation; and applying a read voltage to a word line corresponding to the first address in a first read operation in response to the first read instruction.

A semiconductor memory device includes a memory cell array, a peripheral circuit, and control logic. The memory cell array includes a plurality of memory cells. The peripheral circuit is configured to perform a first operation, corresponding to a first command, on the memory cell array. The control logic is configured to control the first operation of the peripheral circuit. The control logic is configured to control the peripheral circuit to suspend the performance of the first operation and perform a second operation corresponding to a second command, in response to the second command being received while the first operation is being performed.

A semiconductor memory device according to an embodiment includes a plurality of planes including a plurality of blocks each being a set of memory cells, and a sequencer configured to execute a first operation, and a second operation shorter than the first operation. Upon receiving a first command set that instructs execution of the first operation, the sequencer is configured to execute the first operation. Upon receiving a second command set that instructs execution of the second operation while the first operation is being executed, the sequencer is configured to suspend the first operation and execute the second operation or execute the second operation in parallel with the first operation, based on an address of a block that is a target of the first operation and an address of a block that is a target of the second operation.

A memory controller controlling an operation of a memory device including a plurality of memory cells may provide a first suspend command instructing the memory device to suspend performance of the first operation, provide a command requesting information on a target period in which the first operation is suspended among the plurality of periods, provide a command instructing a second operation to the memory device, provide a resume command instructing the memory device to resume the performance of the first operation after the second operation is ended and provide a second suspend command instructing the memory device to re-suspend the performance of the first operation after a delay elapses from a time at which the resume command is provided, the delay being based on the delay information corresponding to the target period.

A semiconductor memory device according to an embodiment includes a plurality of planes including a plurality of blocks each being a set of memory cells, and a sequencer configured to execute a first operation and a second operation shorter than the first operation. Upon receiving a first command set that instructs execution of the first operation, the sequencer is configured to execute the first operation. Upon receiving a second command set that instructs execution of the second operation while the first operation is being executed, the sequencer is configured to suspend the first operation and execute the second operation or execute the second operation in parallel with the first operation, based on an address of a block that is a target of the first operation and an address of a block that is a target of the second operation.

An operation method of a semiconductor storage device including a first memory die is provided. The first memory die includes a first memory plane including a plurality of first memory blocks, a second memory plane including a plurality of second memory blocks. The method includes starting a first write sequence with respect to one of the first memory blocks in response to a first command set designating the one of the first memory blocks and starting a second write sequence with respect to one of the second memory blocks in response to a second command set designating the one of the second memory blocks. At least part of the second write sequence is performed while the first write sequence is being performed.

Various embodiments provide for adjusting (or adapting) a program voltage step used to program a memory cell by a program algorithm after the program algorithm resumes from a suspension, where the program voltage step is adjusted (or adapted) based on one or more factors.

A memory device includes a memory array of memory cells and control logic operatively coupled with the memory array. The control logic is to perform operations including: initiating a true erase sub-operation by causing an erase pulse to be applied to one or more sub-blocks of the memory array; tracking, a number of suspend commands received from a processing device during time periods that a memory line of the memory array is caused to ramp towards an erase voltage of the erase pulse; causing, in response to receiving each suspend command, the true erase sub-operation to be suspended to enable performing a non-erase memory operation; and in response to the number of suspend commands satisfying a threshold criterion, alerting the processing device to terminate sending suspend commands until after completion of the true erase sub-operation.

Described are systems and methods for implementing continuous memory programming operations. An example memory device comprises: a memory array comprising a plurality of memory cells electrically coupled to a plurality of conductive lines; and a controller coupled to the memory array. The controller performs operations comprising: performing a memory programming operation with respect to a set of memory cells of the memory array, wherein the memory programming operation comprises a sequence of programming pulses applied to one or more conductive lines electrically coupled to the set of memory cells; responsive to receiving a command to perform a memory access operation, suspending the memory programming operation after performing a current programming pulse of the sequence of programming pulses, wherein the current programming pulse is performed at a first voltage level; initiating the memory access operation; and resuming the memory programming operation by performing a next programming pulse at a second voltage level that exceeds the first voltage level.