A memory controller includes an interface and a control module. The interface interfaces with a memory device which includes a plurality of dies that each include a plurality of blocks. The control module groups a plurality of blocks included in different dies and manages the plurality of blocks as a super block. The control module performs scheduling to alternately perform a program on a part of an Nth super block, wherein N is a natural number, and a phased erase on an N+1st super block, and the control module completes the program on the Nth super block and the erase on the Nth super block before the program on the N+1st super block starts.

A memory device and an operating method thereof are provided. The memory device includes a first memory array, a first row decoder, a first column decoder, a second memory array, a second row decoder and a second column decoder. The first memory array and the second memory array are different type memories and formed in a single memory die of a wafer.

A memory device includes a first memory area including a first memory cell array having a plurality of first memory cells and a first peripheral circuit disposed below the first memory cell array; a second memory area including a second memory cell array having a plurality of second memory cells and a second peripheral circuit disposed below the second memory cell array; and a pad area including a power wiring. The first and second memory areas respectively include first and second local lockout circuits separately determining whether to lock out of each of the memory areas. The first and second memory areas are included in a single semiconductor chip to share the pad area, and the first and second memory areas operate individually. Accordingly, in the memory device, unnecessary data loss may be reduced by selectively stopping an operation of only a memory area requiring recovery.

A memory device includes a first memory area including a first memory cell array having a plurality of first memory cells and a first peripheral circuit disposed below the first memory cell array; a second memory area including a second memory cell array having a plurality of second memory cells and a second peripheral circuit disposed below the second memory cell array; and a pad area including a power wiring. The first and second memory areas respectively include first and second local lockout circuits separately determining whether to lock out of each of the memory areas. The first and second memory areas are included in a single semiconductor chip to share the pad area, and the first and second memory areas operate individually. Accordingly, in the memory device, unnecessary data loss may be reduced by selectively stopping an operation of only a memory area requiring recovery.

The present technology relates to a memory device. A memory device according to the present technology may include a plurality of planes, individual operation controllers configured to respectively control read operations on the plurality of planes, a common operation controller configured to control a program operation or an erase operation on any one of the plurality of planes, a command decoder configured to provide a read command among the plurality of commands to an individual operation controller that controls a plane that is indicated by an address that corresponds to the read command among the individual operation controllers, and configured to provide a program command or an erase command among the plurality of commands to the common operation controller, and a peripheral circuit configured to generate operation voltages that are used for the read operations, the program operation, and the erase operation.

The present technology relates to a memory device. A memory device according to the present technology may include a plurality of planes, individual operation controllers configured to respectively control read operations on the plurality of planes, a common operation controller configured to control a program operation or an erase operation on any one of the plurality of planes, a command decoder configured to provide a read command among the plurality of commands to an individual operation controller that controls a plane that is indicated by an address that corresponds to the read command among the individual operation controllers, and configured to provide a program command or an erase command among the plurality of commands to the common operation controller, and a peripheral circuit configured to generate operation voltages that are used for the read operations, the program operation, and the erase operation.

The present disclosure includes apparatuses and methods related to performing background operations in memory. A memory device can be configured to perform background operations while another memory device in a memory system and/or on a common memory module is busy performing commands received from a host coupled to the memory system and/or common memory module. An example apparatus can include a first memory device, wherein the first memory device can include an array of memory cells and a controller configured to perform a background operation on the first memory device in response to detecting a command from a host to a second memory device.

A memory controller includes an interface and a control module. The interface interfaces with a memory device which includes a plurality of dies that each include a plurality of blocks. The control module groups a plurality of blocks included in different dies and manages the plurality of blocks as a super block. The control module performs scheduling to alternately perform a program on a part of an Nth super block, wherein N is a natural number, and a phased erase on an N+1st super block, and the control module completes the program on the Nth super block and the erase on the Nth super block before the program on the N+1st super block starts.

A flash memory and a writing method thereof are provided. The flash memory includes a plurality of memory blocks and a plurality of multiplex circuits. The memory blocks are arranged into a plurality of memory banks. Each of the memory blocks transmits a plurality of erase voltages or a plurality of program voltages to the corresponding memory bank for executing an erase operation or a program operation. The program operation is executed by one of the memory banks while the erase operation is executed by another one of the memory banks according to a programming while erasing instruction.

A memory controller includes an interface and a control module. The interface interfaces with a memory device which includes a plurality of dies that each include a plurality of blocks. The control module groups a plurality of blocks included in different dies and manages the plurality of blocks as a super block. The control module performs scheduling to alternately perform a program on a part of an Nth super block, wherein N is a natural number, and a phased erase on an N+1st super block, and the control module completes the program on the Nth super block and the erase on the Nth super block before the program on the N+1st super block starts.