In an embodiment a noon-volatile memory device includes a memory plane including at least one memory area including an array of memory cells having two rows and N columns, wherein each memory cell comprises a state transistor having a control gate and a floating gate selectable by a vertical selection transistor buried in a substrate and including a buried selection gate, and wherein each column of memory cells includes a pair of twin memory cells, two selection transistors of the pair of twin memory cells having a common selection gate and a processor configured to store in the memory area information including a succession of N bits so that, with exception of the last bit of the succession, a current bit of the succession is stored in two memory cells located on the same row and on two adjacent columns and a current bit and the following bit are respectively stored in two twin cells.

The present disclosure relates to integrated circuits, and more particularly, to a method for identifying unprogrammed bits for one-time-programmable memory (OTPM) and a corresponding structure. In particular, the present disclosure relates to a structure including: a read circuit configured to perform at least one read operation at an address for a twin-cell one-time-programmable-memory (OTPM); and a comparison circuit configured to identify whether at least one bit of the address for the twin-cell OTPM has been programmed based on the at least one read operation.

A semiconductor memory structure includes a substrate having thereon a transistor forming region and a capacitor forming region. A transistor is disposed on the substrate within the transistor forming region. A capacitor is disposed within the capacitor forming region and electrically coupled to the transistor. A first inter-layer dielectric layer covers the transistor forming region and the capacitor forming region. The first inter-layer dielectric layer surrounds a metal gate of the transistor and a bottom plate of the capacitor. A cap layer is disposed on the first inter-layer dielectric layer. The cap layer has a first thickness within the transistor forming region and a second thickness within the capacitor forming region. The first thickness is greater than the second thickness. The cap layer within the capacitor forming region acts as a capacitor dielectric layer of the capacitor.

A light-erasable embedded memory device and a method for manufacturing the same are provided in the present invention. The light-erasable embedded memory device includes a substrate with a memory region and a core circuit region, a floating gate on the memory region of the substrate, at least one light-absorbing film above the floating gate, wherein at least one light-absorbing film is provided with dummy via holes overlapping the floating gate, and a dielectric layer on the light-absorbing film and filling up the dummy via holes.

According to one embodiment, a semiconductor storage device includes: a memory cell array including a memory cell transistor that is an electrically rewritable non-volatile semiconductor storage element. The memory cell transistor includes a gate electrode and a channel region adjacent the gate electrode. The semiconductor storage device includes a circuit configured to write the memory cell transistor by applying a breakdown voltage to cause dielectric breakdown between the gate electrode and the channel region.

The present disclosure relates to integrated circuits, and more particularly, to a method for identifying unprogrammed bits for one-time-programmable memory (OTPM) and a corresponding structure. In particular, the present disclosure relates to a structure including: a read circuit configured to perform at least one read operation at an address for a twin-cell one-time-programmable-memory (OTPM); and a comparison circuit configured to identify whether at least one bit of the address for the twin-cell OTPM has been programmed based on the at least one read operation.

The present disclosure relates to integrated circuits, and more particularly, to a method for identifying unprogrammed bits for one-time-programmable memory (OTPM) and a corresponding structure. In particular, the present disclosure relates to a structure including: a read circuit configured to perform at least one read operation at an address for a twin-cell one-time-programmable-memory (OTPM); and a comparison circuit configured to identify whether at least one bit of the address for the twin-cell OTPM has been programmed based on the at least one read operation.

A semiconductor device includes a memory cell formed on a semiconductor substrate. The memory cell includes a first source region and a first drain region that are formed in the semiconductor substrate and a first selection gate, and a first floating gate disposed in series between the first source region and the first drain region. A first floating gate transistor including the first drain region and the first floating gate has a threshold set lower than a threshold of a first selection gate transistor including the first source region and the first selection gate.

First alternating stacks of first insulating strips and first spacer material strips is formed in a first device region, second alternating stacks of second insulating strips and second spacer material strips are formed in a second device region. Each of the first line trenches is filled with a respective laterally alternating sequence of memory stack structures and first dielectric pillar structures to form a three-dimensional NAND memory. Each of the memory stack structures includes a vertical semiconductor channel and a vertical stack of memory elements. Each of the second line trenches with a respective laterally alternating sequence of active region assemblies of lateral field effect transistors and second dielectric pillar structures to form a three-dimensional NOR memory. Each of the active region assemblies includes a source pillar, a drain pillar, and a tubular channel region. The spacer material strips include, or are subsequently replaced with, electrically conductive strips.

According to one embodiment, a semiconductor storage device includes: a memory cell array including a memory cell transistor that is an electrically rewritable non-volatile semiconductor storage element. The memory cell transistor includes a gate electrode and a channel region adjacent the gate electrode. The semiconductor storage device includes a circuit configured to write the memory cell transistor by applying a breakdown voltage to cause dielectric breakdown between the gate electrode and the channel region.