A semiconductor device includes a sampling code generation circuit and a code comparator. The sampling code generation circuit includes a buffer circuit configured to receive an external set signal. The sampling code generation circuit is configured to perform a count operation during a sampling period, the sampling period adjusted based on an output signal of the buffer circuit to generate a sampling code. The code comparator is configured to compare the sampling code with a reference code to generate a comparison flag.

The present technology includes a memory device. The memory device includes memory cells, page buffers configured to store sensed data obtained from the memory cells, a current sensing circuit configured to compare a sensed voltage generated according to the sensed data and a reference voltage generated according to an allowable fail bit code, and output a pass signal or a fail signal according to a comparison result, and a fail bit manager configured to increase an allowable number of fail bits included in the allowable fail bit code until the pass signal is output from the current sensing circuit, change the allowable fail bit code according to the allowable number of fail bits, and provide the allowable fail bit code to the current sensing circuit.

A high resolution impedance adjustment (ZQ) calibration method using a hidden least significant bit (HLSB) is provided. The high resolution ZQ calibration method generates a data input/output (DQ) code of n+1 bits without a calibration time increase by adding the hidden least significant bit (HLSB) to a ZQ code of n bits output in a ZQ calibration operation of an impedance adjustment (ZQ) pad. A change in a termination resistance of the DQ pad is reduced as small as possible by the DQ code of n+1 bits.

A memory sub-system configured to use first values of a plurality of optimized read voltages to perform a first read calibration, which determines second values of the plurality of optimized read voltages. A plurality of shifts, from the first values to the second values respectively, can be computed for the plurality of optimized read voltages respectively. After recognizing a pattern in the plurality of shifts that are computed for the plurality of voltages respectively, the memory sub-system can control and/or initiate a second read calibration based on the recognized pattern in the shifts.

The present disclosure relates to method for checking the reading phase of a non-volatile memory device including at least an array of memory cells and with associated decoding and sensing circuitry and a memory controller, the method comprises: storing in a dummy row associated to said memory block at least internal block variables and a known pattern; performing a reading of said dummy row; comparing a result of the reading with the known pattern; trimming the parameters of the reading and/or swapping the used memory block based on the result of the comparing.

A memory controller receives a command to program information to a memory storage array controlled by the memory controller. The memory controller determines a target memory state to store the information, and a target threshold voltage level corresponding to the target memory state. Based at least on the target memory state, the memory controller determines one or more program pulses for a pre-program cycle, including voltage levels for the one or more program pulses based at least on the target threshold voltage level. The memory controller selects a memory location in the memory storage array to program the information, and pre-programs the selected memory location by applying the one or more program pulses at respective voltage levels, the one or more program pulses applied without program verify operations. Following the pre-programming, the memory controller programs the information to the selected memory location.

A current operating characteristic value of a unit of the memory device is identified. An operating characteristic threshold value is identified from a set of operating characteristic thresholds, where the current operating characteristic value satisfies an operating characteristic threshold criterion that is based on the operating characteristic threshold value. A set of write-to-read (W2R) delay time thresholds that corresponds to the operating characteristic threshold value is identified from a plurality of sets of W2R delay time thresholds. Each of the W2R delay time thresholds in the set is associated with a corresponding read voltage level. A W2R delay time threshold associated with a W2R delay time threshold criterion is identified from the set of W2R delay time thresholds, where the W2R threshold criterion is satisfied by a current W2R delay time of the memory sub-system. A read voltage level associated with the identified W2R delay time threshold is identified.

Exemplary methods, apparatuses, and systems include receiving a plurality of read operations. The read operations are divided into a current set of a sequence of read operations and one or more other sets. The size of the current set is a first number of read operations. An aggressor read operation is selected from the current set. A first data integrity scan is performed on a victim of the aggressor and a first indicator of data integrity is determined based on the first data integrity scan. A scaling factor is determined using the indicator of data integrity and a number of program erase cycles for the portion of memory. The set size of read operations is adjusted to a second number of read operations using the scaling factor for a subsequent set.

Methods, systems, and devices for modifying memory bank operating parameters are described. Operating parameter(s) may be individually adjusted for memory banks or memory bank groups within a memory system based on trimming information. The local trimming information for a memory bank or memory bank group may be stored in a fuse set that also stores repair information for the particular memory bank or in a fuse set that also stores repair information for a memory bank in the particular memory bank group. The local trimming information may be applied to operating parameters for particular memory banks or memory bank groups relative to or instead of global adjustments applied to operating parameters of multiple or all of the memory banks in the memory system.

Methods, systems, and devices for imprint recovery for memory cells are described. In some cases, memory cells may become imprinted, which may refer to conditions where a cell becomes predisposed toward storing one logic state over another, resistant to being written to a different logic state, or both. Imprinted memory cells may be recovered using a recovery or repair process that may be initiated according to various conditions, detections, or inferences. In some examples, a system may be configured to perform imprint recovery operations that are scaled or selected according to a characterized severity of imprint, an operational mode, environmental conditions, and other factors. Imprint management techniques may increase the robustness, accuracy, or efficiency with which a memory system, or components thereof, can operate in the presence of conditions associated with memory cell imprinting.