A temperature sensor evaluation method is mentioned. The temperature sensor is arranged in a memory device and includes a comparator, a voltage divider and a band gap reference voltage source. The comparator compares a temperature reference voltage that varies with temperature with a plurality of divided voltages generated by the voltage divider. The evaluation method for a plurality of predetermined testing temperatures includes changing the plurality of divided voltages of the voltage divider, using the comparator to compare the divided voltages with the temperature reference voltage to determine the first detection voltage, and based on the voltage difference between a target divided voltage and the first detection voltage, retrieving the value of a temperature error between the sensing temperature of the temperature sensor and the testing temperature.

A memory device includes a memory array with memory blocks each having a plurality of memory cells, and one or more current monitors configured to measure current during post-deployment operation of the memory device; and a controller configured to identify a bad block within the memory blocks based on the measured current, and disable the bad block for preventing access thereof during subsequent operations of the memory device.

A semiconductor device may include a main circuit component and a spare circuit component including a plurality of spare elements and selected to change a function of the main circuit component, wherein each of the plurality of spare elements is configured to block a source voltage supply.

A system includes a memory device having a plurality of memory dies and at least a first spare memory die and a processing device coupled to the memory device. The processing device is to perform operations including: tracking a value of a write counter representing a number of write operations performed at the plurality of memory dies; activating the first spare memory die in response to detecting a failure of a first memory die of the plurality of memory dies; storing an offset value of the write counter in response to activating the first spare memory die; and commanding the memory device to modify die trim settings of the first spare memory die at predetermined check point values of the write counter that are offset from the offset value.

A system includes a memory device with multiple memory dies and at least a spare memory die. A processing device is coupled to the memory device. The processing device is to track a value of a write counter representing a number of write operations performed at the multiple memory dies. The processing device is to activate the spare memory die in response to detection of a failure of a first memory die of the multiple memory dies. The processing device is to store an offset value of the write counter in response to the detection of the activation of the spare memory die, the offset value representing the value of the write counter upon activation of the first spare memory die.

Devices and techniques for a flash memory block retirement policy are disclosed herein. In an example embodiment, a first memory block is provisionally removed from service in response to encountering read errors in the first memory block. Memory pages of the first memory block are tested in a second mode comprising reading memory pages at different read voltages. A raw bit error rate (RBER) or a read window budget (RWB) is determined for memory pages at the different read voltages and the provisionally removed first memory block is returned to service or retired based on the determined RBER or the RWB.

A semiconductor structure, a memory device, a semiconductor device and a semiconductor device manufacturing method are provided. The semiconductor structure includes a die, a power bus and a first pad assembly. The power bus is disposed on the die and extends in a predetermined direction. The first pad assembly is arranged on one side of the power bus. The first pad assembly includes at least four pads separated from one another along the predetermined direction by the first, the second and the third gaps. The first gap and the second gap both have a width larger than a width of the third gap and the first pad assembly includes a power pad coupled to the power bus and located between the first gap and the second gap. The power pad and the first and second gaps are all located between opposing ends of the power bus.

A memory device includes a memory array with memory blocks each having a plurality of memory cells, and one or more current monitors configured to measure current during post-deployment operation of the memory device; and a controller configured to identify a bad block within the memory blocks based on the measured current, and disable the bad block for preventing access thereof during subsequent operations of the memory device.

When testing a memory chip, the memory chip is determined to be defective if even a portion of the memory chip is defective, and is discarded, which lowers the yield of the three-dimensional memory device. A three-dimensional device is provided comprising a plurality of stacked circuit chips each having one or more circuit blocks in each of a plurality of divided regions obtained by dividing a circuit plane and an interconnect portion communicatively connected, for each group of circuit blocks included in each of the divided regions overlapping in a stacking direction in the plurality of circuit chips, to a predetermined number of circuit blocks sorted from the circuit blocks within the group.

Examples described herein provide a method for disabling a defective portion of a fabric die of a stacked IC device. The method includes receiving a signal indicating that a portion of a fabric die of a stacked IC device including at least two fabric dies is defective. The method further includes, in response to the signal, pulling a source voltage rail of the defective portion to ground, thereby disabling the portion, and operating the remainder of the fabric die without interference from or contention with the disabled portion. In one example, the stacked IC device is an active on active (AoA) device, and the portion of the fabric die includes a configuration memory cell. In one example, the signal is received after power-up of the stacked IC device.