A method of failure mapping is provided. The method includes determining that a non-volatile memory block in the memory has a defect and generating a mask that indicates the non-volatile memory block and the defect. The method includes reading from the non-volatile memory block with application of the mask, wherein the reading and the application of the mask are performed by the non-volatile solid-state storage.

A memory system includes a memory medium and a memory controller. The memory medium has a second address system that is different from a first address system of a host. The memory controller performs a control operation to access the memory medium based on a command from the host. The memory controller is configured to store a second address, corresponding to an address of a read data, when an error of the read data that is outputted from the memory medium is uncorrectable and is configured to repair a region of the memory medium, designated by the second address, when the region of the memory medium that is designated by the second address is repairable.

A memory device includes a row decoder, a column decoder, and a repair control circuit, which is configured to: (i) compare a row address with a stored failed row address, (ii) compare a column address with a stored failed column address, (iii) control the row decoder to activate the at least one of a plurality of redundancy word lines when the row address corresponds to the failed row address, and (iv) control the column decoder to activate at least one of a plurality of redundancy bit lines when the column address corresponds to the failed column address. The repair control circuit varies a repair unit according to an address input during a repair operation.

A three-dimensional stacked integrated circuit (3D SIC) that can have at least a first 3D XPoint (3DXP) die and, in some examples, can have at least a second 3DXP die too. In such examples, the first 3DXP die and the second 3DXP die can be stacked. The 3D SIC can be partitioned into a plurality of columns that are perpendicular to each of the stacked dies. In such examples, when a first column of the plurality of columns is determined as failing, data stored in the first column can be replicated to a second column of the plurality of columns. Also, for example, when a part of a first column of the plurality of columns is determined as failing, data stored in the part of the first column can be replicated to a corresponding part of a second column of the plurality of columns.

A three-dimensional stacked integrated circuit (3D SIC) that can have at least a first 3D XPoint (3DXP) die and, in some examples, can have at least a second 3DXP die too. In such examples, the first 3DXP die and the second 3DXP die can be stacked. The 3D SIC can be partitioned into a plurality of columns that are perpendicular to each of the stacked dies. In such examples, when a first column of the plurality of columns is determined as failing, data stored in the first column can be replicated to a second column of the plurality of columns. Also, for example, when a part of a first column of the plurality of columns is determined as failing, data stored in the part of the first column can be replicated to a corresponding part of a second column of the plurality of columns.

A memory device includes a row decoder, a column decoder, and a repair control circuit, which is configured to: (i) compare a row address with a stored failed row address, (ii) compare a column address with a stored failed column address, (iii) control the row decoder to activate the at least one of a plurality of redundancy word lines when the row address corresponds to the failed row address, and (iv) control the column decoder to activate at least one of a plurality of redundancy bit lines when the column address corresponds to the failed column address. The repair control circuit varies a repair unit according to an address input during a repair operation.

An apparatus includes a media management superblock component. The media management superblock component determines that a quantity of blocks of a superblock of a non-volatile memory array are bad blocks. The media management superblock component compares the quantity of bad blocks to a bad block criteria. The media management superblock component writes host data to the superblock with the quantity of bad blocks in response to the quantity of bad blocks meeting the bad block criteria.

A repair method of a memory includes dividing a plurality of general bits into a plurality of first groups and dividing a plurality of redundancy bits into a plurality of second groups. When one of the plurality of first groups has a defective bit, one of the plurality of second groups is selected to replace the first group which has the defective bit. Because the repair method uses a group as a repair unit, a repair circuit is simpler and smaller and a processing speed of the repair circuit is faster.

The present disclosure provides an operation method related to a post package repair (PPR) function in a dynamic random access memory (DRAM) device. The method for operating a post package repair (PPR) function of a memory device is disclosed. The method includes providing a memory bank, which includes a memory array and a sense amplifier adjacent to the memory array, wherein the memory array comprises at least one defective row and at least one associated row, and the at least one associated row is electrically connected to the sense amplifier by a plurality of bit lines. The method also includes arranging a redundant row adjacent to the memory array, wherein the redundant row is electrically connected to the sense amplifier by the plurality of bit lines. The method also includes activating the at least one associated row to transmit data in the at least one associated row to the sense amplifier, latching the data in the sense amplifier; activating the redundant row, and transmitting the data from the sense amplifier to the redundant row.

According to one embodiment, a semiconductor device includes chips and a first selection circuit. Each of the chips has at least first and second vias for transmitting at least first and second address signals, wherein these chips are stacked to be electrically connected via the first and second vias. The first selection circuit is provided in each chip, and includes a logic circuit that selects a chip based on at least the first and second address signals, and supplies a result of operating the first and second address signals to the subsequent chip.