A memory device includes a page made up of plural memory cells arranged in a column on a substrate, and a page write operation is performed to hold positive hole groups generated by an impact ionization phenomenon, in a channel semiconductor layer by controlling voltages applied to a first gate conductor layer, a second gate conductor layer, a first impurity region, and a second impurity region of each memory cell contained in the page and a page erase operation is performed to remove the positive hole groups out of the channel semiconductor layer by controlling voltages applied to the first gate conductor layer, the second gate conductor layer, the first impurity region, and the second impurity region. The first impurity layer of the memory cell is connected with a source line, the second impurity layer is connected with a bit line, one of the first gate conductor layer and the second gate conductor layer is connected with a word line, and another is connected with a drive control line; during the write operation after the page erase operation, the positive hole group is formed in the channel semiconductor layer by an impact ionization phenomenon by controlling voltages applied to the word line, the drive control line, the source line, and the bit line; and an applied voltage/applied voltages of one or both of the word line and the drive control line is/are lowered with drops in a first threshold voltage of the first gate conductor layer and a second threshold voltage of the second gate conductor layer.

A data receiving device of a memory device comprises a first pre-amplifier configured to receive previous data, a first reference voltage, and input data, and to output differential signals by comparing the input data with the first reference voltage in response to a clock, when the first pre-amplifier is selected in response to the previous data, a second pre-amplifier configured to receive inverted previous data, a second reference voltage, different from the first reference voltage, and the input data, and outputting a common signal in response to the clock, when the second pre-amplifier is unselected in response to the previous data; and an amplifier configured to receive the differential signals and the common signal, and to latch the input data by amplifying the differential signals.

A storage device includes 3D NAND including layers of multi-level cells. Test reads are performed by reading only LSB pages and reading layers in a repeating pattern of reading two and skipping two. A test read of a block is performed when its read count reaches a threshold. The counter threshold is updated according to errors detected during the test read such that the frequency of test reads increases with increase in errors detected. Counter thresholds according to errors may be specified in a table. The table may be selected as corresponding to a range of PEC values including the current PEC count of the 3D NAND. Each table further specifies a number of errors that will result in garbage collection being performed.

The present technology includes a memory device. The memory device includes memory cells, page buffers configured to store sensed data obtained from the memory cells, a current sensing circuit configured to compare a sensed voltage generated according to the sensed data and a reference voltage generated according to an allowable fail bit code, and output a pass signal or a fail signal according to a comparison result, and a fail bit manager configured to increase an allowable number of fail bits included in the allowable fail bit code until the pass signal is output from the current sensing circuit, change the allowable fail bit code according to the allowable number of fail bits, and provide the allowable fail bit code to the current sensing circuit.

A high resolution impedance adjustment (ZQ) calibration method using a hidden least significant bit (HLSB) is provided. The high resolution ZQ calibration method generates a data input/output (DQ) code of n+1 bits without a calibration time increase by adding the hidden least significant bit (HLSB) to a ZQ code of n bits output in a ZQ calibration operation of an impedance adjustment (ZQ) pad. A change in a termination resistance of the DQ pad is reduced as small as possible by the DQ code of n+1 bits.

The present disclosure provides a shift register, a gate driving circuit and a display panel, and belongs to the field of display technology. The shift register of the present disclosure includes: an input circuit configured to precharge and reset a pull-up node; one pull-down control circuit being electrically connected to one pull-down circuit through a pull-down node; the pull-down control circuit being configured to control a potential at the pull-down node under a first power voltage; each pull-down circuit being configured to pull down the potential at the pull-down node in response to a potential at the pull-up node; an output circuit configured to output a clock signal through a signal output terminal in response to the potential at the pull-up node; one first noise reduction circuit connected to one pull-down node.

An error compensation circuit for analog capacitor memory circuits includes a first transistor and a second transistor with gates connected respectively to top and bottom of an analog memory capacitor to read a voltage charged in the analog memory capacitor; a first switch and a second switch connected respectively to the first transistor and the second transistor to select the voltage to read; a first capacitor and a second capacitor to charge an electric charge to compensate or refresh the analog memory capacitor according to on/off of the first switch and the second switch; and an input terminal connected to sources of the first transistor and the second transistor to apply the voltage to operate the circuit. Accordingly, it is possible to compensate for an unintended phenomenon of the analog capacitor memory or refresh a change in memory value caused by leakage.

A semiconductor device includes: a charge pump circuit configured to generate an output voltage by pumping an input voltage according to first and second main clocks, a voltage detection circuit configured to generate a comparison signal by comparing the output voltage with a reference voltage, and a driving control circuit configured to selectively invert first and second external clocks at a start time of an activation period of the comparison signal to receive the inverted clocks as first and second internal clocks, to generate the first and second main clocks according to the first and second internal clocks during the activation period while controlling a transition order so that the second main clock transitions after the first main clock transitions, and to store logic levels of the first and second main clocks, respectively, at an end time of the activation period.

Exemplary methods, apparatuses, and systems include receiving a plurality of read operations. The read operations are divided into a current set of a sequence of read operations and one or more other sets. The size of the current set is a first number of read operations. An aggressor read operation is selected from the current set. A data integrity scan is performed on a victim of the aggressor and a first indicator of data integrity is determined based on the first data integrity scan. A size of a subsequent set of read operations is set to a second number, which less than the first number, based on the indicator of data integrity.

A sense amplifier includes a sense amplifying unit, first and second isolation units, and first and second offset cancellation unit. The sense amplifying unit includes a first P-type metal-oxide-semiconductor (PMOS) transistor, a second PMOS transistor, a first N-type metal-oxide-semiconductor (NMOS) transistor, and a second NMOS transistor. In a layout of the sense amplifier, the first and second PMOS transistors are disposed in a central region of the sense amplifier, the first and second NMOS transistors are disposed at opposite sides of the sense amplifier from each other, the first isolation unit and the first offset cancellation unit are disposed between the first PMOS transistor and the first NMOS transistor, and the second isolation unit and the second offset cancellation unit are disposed between the second PMOS transistor and the second NMOS transistor. In other layouts, the locations of the PMOS transistors and NMOS transistors may be reversed.