Methods, systems, and devices for die location detection for grouped memory dies are described. A memory device may include multiple memory die that are coupled with a shared bus. In some examples, each memory die may include a circuit configured to output an identifier associated with a location of the respective memory die. For example, a first memory die may output a first identifier, based on receiving one or more signals, that identifies a location of the first memory die. Identifying the locations of the respective memory dies may allow for the dies to be individually accessed despite being coupled with a shared bus.

A solid state drive (SSD) device includes a first nonvolatile memory package, a second nonvolatile memory package, and a controller. The first nonvolatile memory package includes a first buffer chip and a plurality of first nonvolatile memory chips. The second nonvolatile memory package includes a plurality of second nonvolatile memory chips. The controller controls the first nonvolatile memory package and the second nonvolatile memory package. The first buffer chip communicates a first address signal and a first data with the controller, and selectively communicates the first data with one of the plurality of first nonvolatile memory chips and the plurality of second nonvolatile memory chips based on the first address signal.

A memory module can be programmed to deliver relatively wide, low-latency data in a first access mode, or to sacrifice some latency in return for a narrower data width, a narrower command width, or both, in a second access mode. The narrow, higher-latency mode requires fewer connections and traces. A controller can therefore support more modules, and thus increased system capacity. Programmable modules thus allow computer manufacturers to strike a desired balance between memory latency, capacity, and cost.

A memory module can be programmed to deliver relatively wide, low-latency data in a first access mode, or to sacrifice some latency in return for a narrower data width, a narrower command width, or both, in a second access mode. The narrow, higher-latency mode requires fewer connections and traces. A controller can therefore support more modules, and thus increased system capacity. Programmable modules thus allow computer manufacturers to strike a desired balance between memory latency, capacity, and cost.

One or more memory systems, architectural structures, and/or methods of storing information in memory devices is disclosed to improve the data bandwidth and or to reduce the load on the communication links. The system may include one or more memory devices, one or more memory control circuits and one or more data buffer circuits. The memory system, architectural structure and/or method improves the ability of the communications links to transfer data downstream to the data buffer circuits. The memory control circuit receives a store command and a store data tag (Host tag) from a Host and sends the store data command and the store data tag to the data buffer circuits. No store data tag or control signal is sent over the communication links between the Host and the data buffer circuits, only data is sent over the communication links between the Host and the data buffer circuits.

According to one embodiment, a semiconductor device includes receiving terminals on a surface of a substrate to receive first signals and transmitting terminals on the surface of the substrate to transmit second signals. The transmitting terminals are symmetrically positioned on the surface of the substrate with respect to the receiving terminals at a substantially 90 degree rotation about a rotation center position. The ordering of the transmitting terminals along the surface of the substrate from the rotation center position matches the ordering of the receiving terminals along the surface of the substrate from the rotation center position.

The disclosure provides a semiconductor storage device and a reading method, which may achieve high-speed processing time for error detection and correction and achieve miniaturization. The flash memory of the disclosure has a NAND chip and an ECC chip. The NAND chip has: a memory array; a page buffer/sensing circuit, including latches L1 and L2 ; and dedicated input and output terminals, which may be used for data transmission with ECC chip. The latch L1 contains cache C0 and cache C1, and the latch L2 only contains the cache C1. The data in the cache C0 of the latch L1 and the data in the cache C1 of the latch L2 are transmitted to the ECC chip. In response to outputting data at the initial address from the ECC chip, the next page is read from the memory array, and the read data is held in the latch L1.

Apparatuses, mufti-memory systems, and methods for controlling data timing in a multi-memory system are disclosed. An example apparatus includes a plurality of memory units. In the example apparatus, a memory unit of the plurality of memory units includes a memory configured to provide associated read data to a data pipeline based on row control signals and column control signals. The memory unit further includes local control logic configured to provide the row control signals and the column control signals to the memory, and a configurable delay circuit coupled between the local control logic and the memory, the configured to delay receipt of the column control signals to the memory.

Embodiments of the present disclosure relate to a storage device based on a daisy chain topology. According to embodiments of the present disclosure, a storage device may include a plurality of memory package chips each including a plurality of memory dies capable of storing data; and a controller communicating with the plurality of memory package chips and connected to the plurality of memory package chips through one or more daisy chain circuits.

Provided are a method and apparatus for method and apparatus for encoding registers in a memory module. A mode register command is sent to the memory module over a bus, initialization of the memory module before the bus to the memory module is trained for bus operations, to program one of a plurality of mode registers in the memory module, wherein the mode register command indicates one of the mode registers and includes data for the indicated mode register.