A system which identifies a memory device using a physical unclonable function. The system performs raw read operations on every page of a block; sorts the pages into low and high groups using an average number of ones based on the raw read operations; generates unordered page pairs by sequentially selecting a first page from the low group and a second page from the high group; generates ordered page pairs by selectively converting an order of pages in each pair of the unordered page pairs; and generates a sequence for identifying the selected block based on comparing the average number of ones for pages in each ordered page pair.

A memory device includes an array of memory cells configured on a die or chip and coupled to sense lines and access lines of the die or chip and a respective sense amplifier configured on the die or chip coupled to each of the sense lines. Each of a plurality of subsets of the sense lines is coupled to a respective local input/output (I/O) line on the die or chip for communication of data on the die or chip and a respective transceiver associated with the respective local I/O line, the respective transceiver configured to enable communication of the data to one or more device off the die or chip.

An address control circuit includes an address timing control circuit configured to latch address signals inputted from outside the address timing control circuit, sequentially store the latched signals at predetermined timings, and output the stored signals as a bank group address. The address control circuit also includes an address multiplexing circuit configured to generate bank group select signals according to the bank group address. The address multiplexing circuit is configured to generate the bank group select signals having a second value according to the bank group address having a first value when a preset memory access mode is a first memory access mode, and generate the bank group select signals having the second value according to the bank group address having a third value different from the first value when the preset memory access mode is a second memory access mode.

An integrated circuit (IC) includes: a storage having a storage interface and addressable bytes, the storage interface coupled to first and second sets of peripheral terminals; control circuitry having control circuitry inputs and control circuitry outputs, the control circuitry inputs coupled to the storage interface and configured to receive configuration bits provided by the storage responsive to a control circuitry update trigger, and the control circuitry outputs coupled to first and second sets of peripheral outputs; and a cyclic-redundancy check (CRC) engine coupled to the storage interface, the CRC engine configured to distinguish between purposeful updates to the data in the storage and bit errors in the data in the storage.

Methods, systems, and devices for communicating data with stacked memory dies are described. A first semiconductor die may communicate with an external computing device using a binary-symbol signal including two signal levels representing one bit of data. Semiconductor dies may be stacked on one another and include internal interconnects (e.g., through-silicon vias) to relay an internal signal generated based on the binary-symbol signal. The internal signal may be a multi-symbol signal modulated using a modulation scheme that includes three or more levels to represent more than one bit of data. The multi-level symbol signal may simplify the internal interconnects. A second semiconductor die may be configured to receive and re-transmit the multi-level symbol signal to semiconductor dies positioned above the second semiconductor die.

A memory array arranged in multiple columns and rows. Computation circuits that each calculate a computation value from cell values in a corresponding column. A column multiplexer cycles through multiple data lines that each corresponds to a computation circuit. Cluster cycle management circuitry determines a number of multiplexer cycles based on a number of columns storing data of a compute cluster. A sensing circuit obtains the computation values from the computation circuits via the column multiplexer as the column multiplexer cycles through the data lines. The sensing circuit combines the obtained computation values over the determined number of multiplexer cycles. A first clock may initiate the multiplexer to cycle through its data lines for the determined number of multiplexer cycles, and a second clock may initiate each individual cycle. The multiplexer or additional circuitry may be utilized to modify the order in which data is written to the columns.

A semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed in the vicinity of the input/output circuit than the first FIFO.

A memory is provided that includes a write multiplexer, which multiplexes among a plurality of bit line columns. The multiplexer includes a positive boost circuit that applies a positive boost to a voltage at the gates of transistors to strengthen an on state of those transistors. The positive boosting may be in addition to, or instead of, negative boosting at a write driver circuit.

Aspects of the present disclosure are directed to devices and methods for performing MAC operations using a memory array as a compute-in-memory (CIM) device that can enable higher computational throughput, higher performance and lower energy consumption compared to computation using a processor outside of a memory array. In some embodiments, an activation architecture is provided using a bit cell array arranged in rows and columns to store charges that represent a weight value in a weight matrix. A read word line (RWL) may be repurposed to provide the input activation value to bit cells within a row of bit cells, while a read-bit line (RBL) is configured to receive multiplication products from bit cells arranged in a column. Some embodiments provide multiple sub-arrays or tiles of bit cell arrays.

A semiconductor memory device includes: first pad transmitting and receiving first timing signal; second pad transmitting and receiving data signal in response to the first timing signal; third pad receiving second timing signal; fourth pad receiving control information in response to the second timing signal; memory cell array; sense amplifier connected to the memory cell array; first register connected to the sense amplifier; second register storing first control information; third register storing second control information; and control circuit executing data-out operation. The first control information is stored in the second register based on an input to the fourth pad in response to the second timing signal consisting of i cycles, and the second control information is stored in the third register based on an input to the fourth pad in response to the second timing signal consisting of j cycles.