Technologies for performing a quick reliability scan include, for a particular block of a set of blocks of different block types. Each block of the set of blocks includes pages of memory of a physical memory device. A subset of the pages of the block is identified. The block is scanned by scanning the subset of the plurality of pages of the block for a fold condition. A page of the subset of the plurality of pages is determined to have the fold condition. After the set of blocks has been scanned, the folding of the block that includes the page that has been determined to have the fold condition is requested.

A memory device may include a pin for receiving a direct current (DC) voltage indicating an operating configuration setting of the memory device and for communicating an alternating current (AC) voltage signal that provides feedback to a power management component. The memory device may determine that a supply voltage is outside of a target range, and may drive the AC signal onto the pin based on determining that the supply voltage is outside the range. The pin may be coupled with a capacitive component the passes the AC signal and blocks the DC signal. The power management component may receive the capacitively coupled AC signal and may maintain or adjust the supply voltage based on the received AC signal.

A memory subsystem has multiple memory devices coupled to a command/address line and an error alert line, the error alert line delay-compensated to provide deterministic alert signal timing. The command/address line and the error alert line are connected between the memory devices and a memory controller that manages the memory devices. The command/address line is driven by the memory controller, and the error alert line is driven by the memory devices.

A method for writing to a non-volatile electronic memory with data words and assigned pieces of index information. The non-volatile electronic memory is initially filled exclusively with empty data frames. The empty data frames are overwritable with multi-data frames and/or individual data frames. A multi-data frame includes a selectable number of sequentially stored data words, and a multi-data frame header. A frame-type marker, the number of data words, and a selectable start index are stored in the multi-data frame header so that each data word is assignable a unique index value from an index interval by incrementing or decrementing. An individual data frame includes one data word and an individual data frame header. A frame-type marker and a selectable index value for the one data word of the individual data frame are stored in the individual data frame header.

Fuses can store different delay states to cause execution of a command to be staggered for different memory dies of a memory package. Fuse arrays can be included in the memory package and programmed to cause execution of a command to be delayed by different amounts for different dies. The fuse arrays can be fabricated and then programmed to cause different delays for different dies.

Methods, systems, and devices for initializing memory systems are described. A memory system may transmit, to a host system over a first channel, signaling indicative of a first set of values for a set of parameters associated with communicating information over a second channel between a storage device of the memory system and a memory device of the memory system. The host system may transmit, to the memory system, additional signaling associated with the first set of values for the set of parameters. For instance, the host system may transmit a second set of values for the set of parameters, an acknowledgement to use the first set of values, or a command to perform a training operation on the second channel to identify a second set of values for the set of parameters. The memory system may communicate the information over the second channel based on the additional signaling.

A command decoder circuit, a memory, and an electronic device are provided. The circuit includes a first decoder unit, configured to perform decoding for a first command signal based on a dynamic clock signal; a second decoder unit, configured to perform decoding for a second command signal based on the dynamic clock signal; and the clock gate, configured to generate the dynamic clock signal after a chip select signal of the first decoder unit indicates that decoding to be started for the first command signal and before the second decoder unit has performed decoding for the second command signal, and cut off the dynamic clock signal before the chip select signal of the first decoder unit indicates that the decoding to be started for the first command signal or after the second decoder unit has performed decoding for the second command signal.

A semiconductor memory device includes: first pad transmitting and receiving first timing signal; second pad transmitting and receiving data signal in response to the first timing signal; third pad receiving second timing signal; fourth pad receiving control information in response to the second timing signal; memory cell array; sense amplifier connected to the memory cell array; first register connected to the sense amplifier; second register storing first control information; third register storing second control information; and control circuit executing data-out operation. The first control information is stored in the second register based on an input to the fourth pad in response to the second timing signal consisting of i cycles, and the second control information is stored in the third register based on an input to the fourth pad in response to the second timing signal consisting of j cycles.

A processing-in-memory (PIM) device includes a plurality of multiplication and accumulation (MAC) units, each of the MAC units including a memory bank and a MAC operator, and a control circuit configured to control the plurality of MAC units to perform an all MAC mode operation in which MAC operations are performed in all MAC units, among the plurality of MAC units, or a dispersion MAC mode operation in which the MAC operations are performed in some MAC units, among the plurality of MAC units.

A memory device includes a memory cell array configured to store data; and a data output circuit configured to transmit status data to an external device through at least one data line in a latency period in response to a read enable signal received from the external device and transmit the data read from the memory cell array to the external device through the at least one data line in a period subsequent to the latency period.