A high temperature cooling tube for use with an inspection device is provided. The cooling tube permits operation of the inspection device in environments having a temperature of greater than about 302° F. (150° C.). By providing the capability to inspect equipment in a relatively hot condition, cooling time required before inspection is reduced, overall turnaround time for such inspections is reduced, inspected equipment is placed back into service more quickly, and revenues are increased. In an exemplary embodiment, the cooling tube includes an inner sleeve for protecting the inspection device, a middle sleeve for insulation and air flow, and an outer sleeve for protecting the cooling tube and the inspection device from damage. The middle sleeve can include expanded polytetrafluoroethylene (EPTFE), which protects the inspection device from extreme high temperature working environments, and which permits flexibility. Related apparatuses, systems, techniques and articles are also described.

A high temperature cooling tube for use with an inspection device is provided. The cooling tube permits operation of the inspection device in environments having a temperature of greater than about 302° F. (150° C.). By providing the capability to inspect equipment in a relatively hot condition, cooling time required before inspection is reduced, overall turnaround time for such inspections is reduced, inspected equipment is placed back into service more quickly, and revenues are increased. In an exemplary embodiment, the cooling tube includes an inner sleeve for protecting the inspection device, a middle sleeve for insulation and air flow, and an outer sleeve for protecting the cooling tube and the inspection device from damage. The middle sleeve can include expanded polytetrafluoroethylene (EPTFE), which protects the inspection device from extreme high temperature working environments, and which permits flexibility. Related apparatuses, systems, techniques and articles are also described.

A high temperature cooling tube for use with an inspection device is provided. The cooling tube permits operation of the inspection device in environments having a temperature of greater than about 302° F. (150° C.). By providing the capability to inspect equipment in a relatively hot condition, cooling time required before inspection is reduced, overall turnaround time for such inspections is reduced, inspected equipment is placed back into service more quickly, and revenues are increased. In an exemplary embodiment, the cooling tube includes an inner sleeve for protecting the inspection device, a middle sleeve for insulation and air flow, and an outer sleeve for protecting the cooling tube and the inspection device from damage. The middle sleeve can include expanded polytetrafluoroethylene (EPTFE), which protects the inspection device from extreme high temperature working environments, and which permits flexibility. Related apparatuses, systems, techniques and articles are also described.

A high temperature cooling tube for use with an inspection device is provided. The cooling tube permits operation of the inspection device in environments having a temperature of greater than about 302° F. (150° C.). By providing the capability to inspect equipment in a relatively hot condition, cooling time required before inspection is reduced, overall turnaround time for such inspections is reduced, inspected equipment is placed back into service more quickly, and revenues are increased. In an exemplary embodiment, the cooling tube includes an inner sleeve for protecting the inspection device, a middle sleeve for insulation and air flow, and an outer sleeve for protecting the cooling tube and the inspection device from damage. The middle sleeve can include expanded polytetrafluoroethylene (EPTFE), which protects the inspection device from extreme high temperature working environments, and which permits flexibility. Related apparatuses, systems, techniques and articles are also described.

The present disclosure relates to semiconductors. Some embodiments may include a series circuit arrangement of power semiconductors comprising: cooling-water boxes arranged on the semiconductors and electrically connected to them; two cooling-water distributor lines; respective branchings on the cooling-water distributor lines for the cooling chambers; and a control electrode arranged on the cooling-water distributor lines. The cooling chambers are connected in parallel between the cooling-water distributor lines with respect to a cooling-water stream. The cooling chambers are connected to the branchings via a respective connecting line. For at least some of the cooling chambers, the branchings on the cooling-water distributor lines are arrayed relative to the position of the respective cooling chamber in offset manner in relation to a geometrically shortest possible link to the cooling-water distributor lines, so that a difference of potential between the cooling chambers and the branchings is minimized.

The present disclosure relates to semiconductors. Some embodiments may include a series circuit arrangement of power semiconductors comprising: cooling-water boxes arranged on the semiconductors and electrically connected to them; two cooling-water distributor lines; respective branchings on the cooling-water distributor lines for the cooling chambers; and a control electrode arranged on the cooling-water distributor lines. The cooling chambers are connected in parallel between the cooling-water distributor lines with respect to a cooling-water stream. The cooling chambers are connected to the branchings via a respective connecting line. For at least some of the cooling chambers, the branchings on the cooling-water distributor lines are arrayed relative to the position of the respective cooling chamber in offset manner in relation to a geometrically shortest possible link to the cooling-water distributor lines, so that a difference of potential between the cooling chambers and the branchings is minimized.

The present disclosure relates to semiconductors. Some embodiments may include a series circuit arrangement of power semiconductors comprising: cooling-water boxes arranged on the semiconductors and electrically connected to them; two cooling-water distributor lines; respective branchings on the cooling-water distributor lines for the cooling chambers; and a control electrode arranged on the cooling-water distributor lines. The cooling chambers are connected in parallel between the cooling-water distributor lines with respect to a cooling-water stream. The cooling chambers are connected to the branchings via a respective connecting line. For at least some of the cooling chambers, the branchings on the cooling-water distributor lines are arrayed relative to the position of the respective cooling chamber in offset manner in relation to a geometrically shortest possible link to the cooling-water distributor lines, so that a difference of potential between the cooling chambers and the branchings is minimized.