An ultrasound imaging device or an ultrasound imaging probe includes an imaging device including at least one heat generating component and at least one thermal energy storage insert spaced from and disposed in thermal contact with the imaging device, the at least one thermal energy storage insert containing a phase change material (PCM) therein. The thermal energy storage insert is manufactured to closely confirm to a shape of a space defined within the interior of the probe. A method of forming the ultrasound imaging probe includes the steps of manufacturing a thermal energy storage insert from a thermally conductive material, filling the thermal energy storage insert with a phase change material (PCM) and positioning the thermal energy storage insert within an interior of the probe.

A display device, a heat dissipation layer, an electronic device, and a method for manufacturing a display device are provided. The display device includes: a silicon-based organic light-emitting display panel, including a silicon substrate, a first electrode of a display element, an organic light-emitting layer, and a second electrode of the display element that are stacked sequentially; a flexible printed circuit board electrically connected to the silicon substrate; and a heat dissipation layer on a non-display side of the silicon-based organic light-emitting display panel, extending to the flexible printed circuit board to cover at least a part of the flexible printed circuit board. A gate drive circuit, a data drive circuit, and a pixel circuit are integrated on the silicon substrate, and the flexible printed circuit board is configured to transmit electrical signals to the gate drive circuit, the data drive circuit, and the second electrode of the display element.

In some examples, an electronic device includes an outer housing and a heat spreader inside an inner chamber defined by the outer housing. The heat spreader is structurally engaged to the outer housing to provide structural support for the outer housing, and the heat spreader is to spread heat along two different directions. Electronic components are in thermal contact with a surface of the heat spreader to transfer heat produced by the electronic components to the heat spreader.

In some examples, an electronic device includes an outer housing and a heat spreader inside an inner chamber defined by the outer housing. The heat spreader is structurally engaged to the outer housing to provide structural support for the outer housing, and the heat spreader is to spread heat along two different directions. Electronic components are in thermal contact with a surface of the heat spreader to transfer heat produced by the electronic components to the heat spreader.

A display device, a heat dissipation layer, an electronic device, and a method for manufacturing a display device are provided. The display device includes: a silicon-based organic light-emitting display panel, including a silicon substrate, a first electrode of a display element, an organic light-emitting layer, and a second electrode of the display element that are stacked sequentially; a flexible printed circuit board electrically connected to the silicon substrate; and a heat dissipation layer on a non-display side of the silicon-based organic light-emitting display panel, extending to the flexible printed circuit board to cover at least a part of the flexible printed circuit board. A gate drive circuit, a data drive circuit, and a pixel circuit are integrated on the silicon substrate, and the flexible printed circuit board is configured to transmit electrical signals to the gate drive circuit, the data drive circuit, and the second electrode of the display element.

In some examples, an electronic device includes an outer housing and a heat spreader inside an inner chamber defined by the outer housing. The heat spreader is structurally engaged to the outer housing to provide structural support for the outer housing, and the heat spreader is to spread heat along two different directions. Electronic components are in thermal contact with a surface of the heat spreader to transfer heat produced by the electronic components to the heat spreader.

Monitors are for pressurized systems are described. These may include batteryless monitors that run on power harvested from their environments.

Monitors are for pressurized systems are described. These may include batteryless monitors that run on power harvested from their environments.

Monitors are for pressurized systems are described. These may include batteryless monitors that run on power harvested from their environments.

An ultrasound imaging device or an ultrasound imaging probe includes an imaging device including at least one heat generating component and at least one thermal energy storage insert spaced from and disposed in thermal contact with the imaging device, the at least one thermal energy storage insert containing a phase change material (PCM) therein. The thermal energy storage insert is manufactured to closely confirm to a shape of a space defined within the interior of the probe. A method of forming the ultrasound imaging probe includes the steps of manufacturing a thermal energy storage insert from a thermally conductive material, filling the thermal energy storage insert with a phase change material (PCM) and positioning the thermal energy storage insert within an interior of the probe.