There are provided an inexpensive copper alloy plate having excellent bending workability, excellent stress corrosion cracking resistance and excellent stress relaxation resistance while maintaining the high strength thereof, and a method for producing the same. The copper alloy plate has a chemical composition which contains 17 to 32% by weight of zinc, 0.1 to 4.5% by weight of tin, 0.5 to 2.0% by weight of silicon, 0.01 to 0.3% by weight of phosphorus and the balance being copper and unavoidable impurities, wherein the total of the content of silicon and six times as much as the content of phosphorus is 1% by weight or more and wherein the copper alloy plate has a crystal orientation satisfying I{220}/I{420}≤2.0 assuming that the X-ray diffraction intensity on {220} crystal plane on the plate surface of the copper alloy plate is I{220} and that the X-ray diffraction intensity on {420} crystal plane thereon is I{420}.

The invention relates to an insulated conductor comprising an elongate conductor provided with an insulating layer which comprises a polymeric material. Said polymeric material has a crystallinity of at least 25% and includes a repeat unit of general formula

##STR00001##

wherein t1 and w1 independently represent 0 or 1 and v1 represents 0, 1 or 2. The insulating layer has a thickness in the range 2 μm-300 μm.

According to embodiments of the present invention, a conductive paste is provided. The conductive paste has a cam-position including a plurality of conductive nanoparticles and a plurality of conductive nanowires, wherein a weight ratio of the plurality of conductive nanoparticles to the plurality of conductive nanowires is between about 10:1 and about 50:1. According to further embodiments of the present invention, a method for forming an interconnection and an electrical device are also provided.

A method for producing an insulated electric wire of the present invention is a method for forming an insulating coating film on a surface of an electric wire by performing baking treatment after forming an insulating layer on the surface of the electric wire by an electrodeposition method using an insulating electrodeposition coating material containing a polymer. Pretreatment of evaporating a solvent in the insulating layer is performed before the baking treatment, and the pretreatment is performed by a near infrared ray heating furnace. In addition, a temperature of the pretreatment is lower than a temperature of the baking treatment.

PROBLEM: To provide a multi-layer preform sheet capable of forming a highly reliable and high-quality electric interconnect, an electro-conductive bonding portion and so forth that are less likely to produce the Kirkendall void.

SOLUTION: A multi-layer preform sheet having at least a first layer and a second layer, the first layer being composed of a solder material that contains an intermetallic compound, and the second layer containing a first metal having a melting point of 300° C. or above, and a second metal capable of forming an intermetallic compound with the first metal.

A copper alloy has a composition including: 70 mass ppm or more and 400 mass ppm or less of Mg; 5 mass ppm or more and 20 mass ppm or less of Ag; less than 3.0 mass ppm of P; and a Cu balance containing inevitable impurities. In the copper alloy, the electrical conductivity is 90% IACS or more, and the average value of KAM values is 3.0 or less.

A method for producing fine copper particles includes producing fine copper particles having a coating film containing cuprous oxide on a surface by heating copper or a copper compound in a reducing flame formed by a burner. The fine copper particles are produced by adjusting a mixing ratio between a combustible gas and a combustion supporting gas which form the reducing flame such that a volume ratio of CO/CO.sub.2 is in a range of 1.5 to 2.4.

An electrode or wiring, an electrode pair, and a method for manufacturing the electrode or wiring. The electrode or wiring includes: particles of a layered material including one or more layers; and metal particles or a sintered metal. The one or plural layers include a layer body represented by M.sub.mX.sub.n, wherein M is at least one metal belonging to group 3, 4, 5, 6, or 7, X is a carbon atom, a nitrogen atom, or a combination thereof, n is 1-4, and m is greater than n and at most 5, and a modification or terminal T (T being at least one of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom) is present on the surface of the layer body.

A high-voltage electrical cable assembly includes a central wire strand containing at least seven wires formed of a first alloy and a plurality of outer wire strands twisted around the central strand. At least one outer wire strand of the plurality of outer wire strands contains at least seven wires formed of a second alloy different from the first alloy. There is an electrochemical potential of about 2 volts between the first alloy and the second alloy. A method of assembling a high-voltage electrical cable assembly is also presented herein.

A cable includes: core wires comprising a pair of inner conductors and an inner insulating layer separately covered around each of the pair of inner conductors; a wrapping layer covering the core wires; a shielding layer covering the wrapping layer; and an outer coating layer covering the shielding layer; wherein the wrapping layer comprises a first wrapping layer covering the core wires and a second wrapping layer covering the first wrapping layer.