A conductive substrate includes a base material and a conductive layer arranged on the base material, in which the conductive layer has a conductive thin wire part containing a metal and a transparent insulating part containing no metal, the transparent insulating part being adjacent to the conductive thin wire part, and the conductive layer contains a compound represented by Formula (1).

A conductive substrate includes a base material and a conductive layer arranged on the base material, in which the conductive layer has a conductive thin wire part containing a metal and a transparent insulating part containing no metal, the transparent insulating part being adjacent to the conductive thin wire part, and the conductive layer contains a compound represented by Formula (1).

A process for the preparation of polyolefins by polymerizing olefins at temperatures of from 20 to 200° C. and pressures of from 0.1 to 20 MPa in the presence of a polymerization catalyst and an antistatically acting composition in a polymerization reactor, wherein the antistatically acting composition is a mixture comprising an oil-soluble surfactant and water and the use of an antistatically acting composition comprising an oil-soluble surfactant and water as antistatic agent for the polymerization of olefins at temperatures of from 20 to 200° C. and pressures of from 0.1 to 20 MPa in the presence of a polymerization catalyst.

A process for the preparation of polyolefins by polymerizing olefins at temperatures of from 20 to 200° C. and pressures of from 0.1 to 20 MPa in the presence of a polymerization catalyst and an antistatically acting composition in a polymerization reactor, wherein the antistatically acting composition is a mixture comprising an oil-soluble surfactant and water and the use of an antistatically acting composition comprising an oil-soluble surfactant and water as antistatic agent for the polymerization of olefins at temperatures of from 20 to 200° C. and pressures of from 0.1 to 20 MPa in the presence of a polymerization catalyst.

Polymers comprising at least one unit of formula (1) and their use as semiconducting materials.

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The present invention relates to formulations comprising at least one organic semiconductor and at least one organic solvent, characterized in that the formulation contains less than 10,000 particles per liter formulation having an average size in the range from 0.1 to 20 μm, to their use for the preparation of electronic devices, to methods for preparing electronic devices using the formulations of the present invention, and to electronic devices prepared from such methods and formulations.

Provided is a coating for forming a conductive release layer capable of forming a conductive release layer having high adhesion to a film base material, suppressing deterioration in conductivity over time in the air, and having a sufficient releasing property. The coating for forming a conductive release layer of the present invention contains a conductive composite including a π-conjugated conductive polymer and a polyanion, an epoxy compound having an epoxy group, a curable silicone, a polyester resin, and an organic solvent.

Provided is a coating for forming a conductive release layer capable of forming a conductive release layer having high adhesion to a film base material, suppressing deterioration in conductivity over time in the air, and having a sufficient releasing property. The coating for forming a conductive release layer of the present invention contains a conductive composite including a π-conjugated conductive polymer and a polyanion, an epoxy compound having an epoxy group, a curable silicone, a polyester resin, and an organic solvent.

A method of manufacturing a highly conductive polymer thin film is proposed. The method includes a step of coating a substrate with a first dopant solution including a polymer material and a first dopant to form a conductive polymer thin film subjected to first conductive treatment; and a step of performing second conductive treatment using a second dopant solution including pyronin B on the conductive polymer thin film to form a highly conductive polymer thin film.

A method of manufacturing a highly conductive polymer thin film is proposed. The method includes a step of coating a substrate with a first dopant solution including a polymer material and a first dopant to form a conductive polymer thin film subjected to first conductive treatment; and a step of performing second conductive treatment using a second dopant solution including pyronin B on the conductive polymer thin film to form a highly conductive polymer thin film.