A cover for a cable harness including: (i) a first layer comprising a first color; (ii) a second layer layered adjacent to the first layer, the second layer comprising a second color that is different than the first color; and (iii) an adhesive layer adhered to the first layer, at least a portion of the adhesive is not covered by the second layer. The first color can black, while the second color is white. The second layer comprises fibers that can be substantially free of dye. At least one of the first layer and the second layer can be polyethylene terephthalate. The cover can cover a plurality of cables of a cable harness. If wear forms a hole through the first layer, the second color of the second layer is visible from an environment external to the covered cable harness through the hole through the first layer.

A differential mode instrumentation cable for improving the signal integrity of audio signals in different environments including use of microphones, speaker cable, audiophile cables and analog audio balanced/differential tie lines comprising a first triaxial cable and a second triaxial cable placed side-by-side and mounted together, said first coaxial cable and said second coaxial cable including a wired connection that includes an active driven shield buffer circuit in each triaxial cable having an inner conductor for voltage in from the positive polarity and minus polarity and the voltage out driven guard shield with series breakout resistor connected to the each triaxial inner shield.

Provided is a semiconductor inspection device capable of high-speed response analysis as defect analysis of a fine-structured device constituting an LSI. Therefore, the semiconductor inspection device includes a vacuum chamber 3, a sample table 4 which is disposed in the vacuum chamber and on which a sample 6 is placed, an electron optical system 1 disposed such that an electron beam is emitted from above the sample, a plurality of probe units 24 connected to external devices 11 and 12 disposed outside the vacuum chamber via a coaxial cable 10, and an electrode 5 provided on or in the vicinity of the sample table. The probe unit 24 includes a measurement probe 8 configured to come into contact with the sample, a GND terminal 9 configured to come into contact with the electrode 5, and a probe holder 7 configured to hold the measurement probe and the GND terminal, connect a signal line of the coaxial cable to the measurement probe, and connect a GND line of the coaxial cable to the GND terminal. When the measurement probe of the probe unit comes into contact with the sample, the GND terminal comes into contact with the electrode.

A cable connection structure is provided with an electronic component including electrodes on an electrode-forming surface, a cable including electric wires connected to the electrodes respectively, and a buried member which is composed of a cured resin and embedded with the electric wires. At least three electric wires are separating wires including separating regions being separated from each other in the normal direction as being distant from the electrode-forming surface. At least three electrodes are arranged side by side on a virtual circle. At least three separating wires are connected to the at least three electrodes. The separating regions of the at least three separating wires are provided to be located eccentric radially outwardly in the virtual circle as being distant from the electrode surface in the normal direction of the electrode-forming surface. An angle between the separating region and the normal direction of the electrode-forming surface is 10 degrees or more and 45 degrees or less.

Provided is a semiconductor inspection device capable of high-speed response analysis as defect analysis of a fine-structured device constituting an LSI. Therefore, the semiconductor inspection device includes a vacuum chamber 3, a sample table 4 which is disposed in the vacuum chamber and on which a sample 6 is placed, an electron optical system 1 disposed such that an electron beam is emitted from above the sample, a plurality of probe units 24 connected to external devices 11 and 12 disposed outside the vacuum chamber via a coaxial cable 10, and an electrode 5 provided on or in the vicinity of the sample table. The probe unit 24 includes a measurement probe 8 configured to come into contact with the sample, a GND terminal 9 configured to come into contact with the electrode 5, and a probe holder 7 configured to hold the measurement probe and the GND terminal, connect a signal line of the coaxial cable to the measurement probe, and connect a GND line of the coaxial cable to the GND terminal. When the measurement probe of the probe unit comes into contact with the sample, the GND terminal comes into contact with the electrode.

Apparatus and method for trapping RF on shields of a multiply shielded RF cable. In some embodiments, the RF trap shorts an outer conductor shield to an inner shield conductor of the cable successively at selected locations along an end length of the shield conductors. Some embodiments provide an RF-trap apparatus for blocking stray signals on a shielded RF cable that has two or more concentric peripheral shield conductors separated from one another by one or more electrically insulating layers, and at least one inner conductor for carrying RF signals. The RF trap apparatus includes: a first housing; and a plurality of projections configured be coupled to the first housing and to move to selectively electrically connect an outer shield conductor to an inner shield conductor by a pierce operation on the shielded RF cable.

A cable connection structure is provided with an electronic component including electrodes on an electrode-forming surface, a cable including electric wires connected to the electrodes respectively, and a buried member which is composed of a cured resin and embedded with the electric wires. At least three electric wires are separating wires including separating regions being separated from each other in the normal direction as being distant from the electrode-forming surface. At least three electrodes are arranged side by side on a virtual circle. At least three separating wires are connected to the at least three electrodes. The separating regions of the at least three separating wires are provided to be located eccentric radially outwardly in the virtual circle as being distant from the electrode surface in the normal direction of the electrode-forming surface. An angle between the separating region and the normal direction of the electrode-forming surface is 10 degrees or more and 45 degrees or less.

Methods and apparatus for a shielded and grounded cable assembly include a coaxial cable assembly having a uniform spacing between cables to pre-align the cable assembly in an array corresponding to a connection layout of at a source end. The cable assembly includes a plurality of coaxial cables with exposed shields that are commonly grounded to a drain wire. The cable assembly may also be configured to be connected vertically/perpendicularly to a ball grid array or edge connected to a circuit board.