A shunt resistor according to the present invention includes a pair of electrode plates spaced apart from each other in a plate surface direction and a resistive alloy plate that connects the pair of electrode plates and that has a predetermined set resistance value. A surface of the resistive alloy plate is provided with a visually recognizable character string pattern that is formed by laser processing and that indicates the set resistance value of the resistive alloy plate, and a surface area and a carving depth of the character string pattern are set in such a manner that the resistive alloy plate has the set resistance value.

A mounting structure includes a PCB on which first and second conductive patterns are formed, and a shunt resistor mounted on one surface of a substrate via a conductive bonding material. Each of the first and second conductive patterns includes: a first/second lead-out portion and a first/second pull-out portion which is pulled out to the outside of a region of the shunt resistor from the first/second lead-out portion. A resistance value of the shunt resistor is detected between the first pull-out portion and the second pull-out portion. A bonding material flow-out preventing resist is disposed at a portion of a surface of at least one of the first lead-out portion and the second lead-out portion, and a fillet of the bonding material terminates at a position corresponding to a position where the bonding material flow-out preventing resist is disposed.

A mounting structure includes a PCB on which first and second conductive patterns are formed, and a shunt resistor mounted on one surface of a substrate via a conductive bonding material. Each of the first and second conductive patterns includes: a first/second lead-out portion and a first/second pull-out portion which is pulled out to the outside of a region of the shunt resistor from the first/second lead-out portion. A resistance value of the shunt resistor is detected between the first pull-out portion and the second pull-out portion. A bonding material flow-out preventing resist is disposed at a portion of a surface of at least one of the first lead-out portion and the second lead-out portion, and a fillet of the bonding material terminates at a position corresponding to a position where the bonding material flow-out preventing resist is disposed.

A surge protective device (SPD) assembly includes a base and an SPD module configured to be mounted on the base. The SPD module includes an SPD module PCB, an SPD module circuit, and a thermal disconnector mechanism. The SPD module circuit is at least partly embodied in the SPD module PCB and includes an overvoltage protection component mounted on the SPD module PCB. The thermal disconnector mechanism is mounted on the SPD module PCB in a ready configuration. The thermal disconnector mechanism is operative to transition from the ready configuration to an actuated configuration responsive to sufficient overheating of the overvoltage protection component. When the thermal disconnector mechanism is positioned in the ready configuration, the SPD circuit forms a first current path through the overvoltage protection component. When the thermal disconnector mechanism is positioned in the actuated configuration, the thermal disconnector mechanism forms an alternate second current path that bypasses the overvoltage protection component.

An object is to provide a shunt resistor module that is reduced in size, can handle a large current, and can accurately detect current. A shunt resistor module of the present invention includes: a shunt resistor that includes a plurality of resistor bodies having a columnar shape, and electrodes that are located at both ends of each of the plurality of resistor bodies; and a circuit board that includes a plurality of through-holes that can house the plurality of resistor bodies, and a plurality of voltage detection terminals that detects a voltage between the electrodes of the shunt resistor that has been inserted into the plurality of through-holes, and each of the plurality of voltage detection terminals is collected near a center of gravity of the shunt resistor.

A three-dimensional thermistor device and a manufacturing method thereof. The three-dimensional thermistor device comprising a thermistor array formed on a base layer extending in first and second directions. Where the thermistor array comprises: thermistor pattern layers and insulating layers stacked alternately on the base layer in a third direction; each thermistor pattern layer including a continuous electrically conductive first trace disposed along a first path extending in both the first and second directions, and each insulating layer including an electrically conductive first via extending through the insulating layer in the third direction to electrically connect the first traces to each other. Where successive electrical connections between the respective first vias on the stacked insulating layers and the respective first traces on the stacked thermistor layers form a continuous electrical first thermistor element extending in the first, second and third directions across multiple of the thermistor pattern layers.

A three-dimensional thermistor device and a manufacturing method thereof. The three-dimensional thermistor device comprising a thermistor array formed on a base layer extending in first and second directions. Where the thermistor array comprises: thermistor pattern layers and insulating layers stacked alternately on the base layer in a third direction; each thermistor pattern layer including a continuous electrically conductive first trace disposed along a first path extending in both the first and second directions, and each insulating layer including an electrically conductive first via extending through the insulating layer in the third direction to electrically connect the first traces to each other. Where successive electrical connections between the respective first vias on the stacked insulating layers and the respective first traces on the stacked thermistor layers form a continuous electrical first thermistor element extending in the first, second and third directions across multiple of the thermistor pattern layers.

A strain gauge includes a flexible resin substrate; a functional layer formed of a metal, an alloy, or a metal compound, directly on one surface of the substrate; a resistor formed of a film including Cr, CrN, and Cr.sub.2N, on one surface of the functional layer; and an insulating resin layer with which the resistor is coated.

A radial-leaded over-current protection device comprises a PTC element, a first electrode lead, a second electrode lead and an electrically insulating encapsulation layer. The PTC element comprises a first conductive layer, a second conductive layer and a PTC material layer laminated therebetween. The PTC material layer comprises crystalline polymer and conductive filler dispersed therein. The first electrode lead has an end connecting to the first conductive layer, whereas the second electrode lead has an end connecting to the second conductive layer. The electrically insulating encapsulation layer includes a fluorine-containing polymer, and wraps around an entire outer surface of the PTC element and the ends of the first and second electrodes connecting to the PTC element. The electrically insulating encapsulation layer has a thickness of 10.sup.2˜10.sup.5 nm, and the radial-leaded over-current protection device has an initial resistance R.sub.bf of 0.0017˜0.0027Ω.

A method for producing a device for measuring current strengths. The method includes providing a resistor arrangement with two connection elements and a resistor element arranged between the connection elements, molding a contact element from the material of the connection element or from the material of the resistor element. The contact element has an end face remote from the resistor arrangement and a cavity open on the end face. The method further includes providing a circuit board with a through-bore on whose inner surface electrically conductive material is present, positioning the circuit board on the resistor arrangement such that the contact element projects into the through-bore, and expanding the contact element in the radial direction using an expansion element inserted into the cavity of the contact element to establish an electrically conductive connection between the contact element and the electrically conductive material on the inner surface of the through-bore.