To provide a wire-wound resistor provided with high reliability and that retains the basic functionality of the wire-wound resistor, and a method for manufacturing the same. A wire-wound resistor in which a resistor wire is wound onto an external periphery of a core (11) obtained by bundling fibrous insulators, and a connection terminal (13) is attached to both ends of the core (11) and connected to the resistor wire (12a), wherein the core (11) is impregnated with a binder in the portion (11a) in the vicinity of the external periphery. The binder (1) is preferably not included in a center portion (11b) of the core (11).

A circuit board structure includes a multi-layer board and a ceramic resistor embedded in the multi-layer board. The ceramic resistor includes a ceramic sheet, a plurality of connecting pads spacedly arranged on the ceramic sheet, and a plurality of resistance layers arranged on the ceramic sheet. At least one of the resistance layers is arranged between and electrically connected to any two of the connecting pads for providing a resistance value. The number of the resistance values provided by the ceramic resistor is more than the number of the resistance layers. The multi-layer board has a plurality of contacts arranged apart from each other, and the contacts are respectively and electrically connected to the connecting pads.

A resistor assembly can include a resistor having a first end and a second end, and a conductive member, where the conductive member is coupled to the first end of the resistor. The resistor assembly can also include a shield cup and a housing, where the housing includes at least one housing wall having at least one aperture, and where the housing encloses at least a portion of the resistor and at least a portion of the shield cup. A volume of space between the at least one housing wall of the housing and the resistor can be substantially filled with an insulating material and at least the outside of the housing is substantially covered with the insulating material.

A resistor assembly can include a resistor having a first end and a second end, and a conductive member, where the conductive member is coupled to the first end of the resistor. The resistor assembly can also include a shield cup and a housing, where the housing includes at least one housing wall having at least one aperture, and where the housing encloses at least a portion of the resistor and at least a portion of the shield cup. A volume of space between the at least one housing wall of the housing and the resistor can be substantially filled with an insulating material and at least the outside of the housing is substantially covered with the insulating material.

A resistor includes: a first resin protruding part formed in the bottom surface of an exterior material (mold resin body), on an end opposite to a leading side of harness wires along the length of the exterior material near a through-hole piercing an upper surface and a lower surface of the exterior material, and a second resin protruding part, surrounding the circumference of a metal bush embedded in the through-hole and the entire circumference of the resistor substrate. Moreover, a concave part is formed in a region sandwiched between the first resin protruding part and the second resin protruding part.

Described herein is a composite panel that includes a first layer made from an electrically non-conductive material. The composite panel also includes a resistance heater printed onto the first layer. Further, the composite panel includes a second layer adjacent the resistance heater, the resistance heater being positioned between the first layer and the second layer. The second layer is made from an electrically non-conductive material.

Described herein is a composite panel that includes a first layer made from an electrically non-conductive material. The composite panel also includes a resistance heater printed onto the first layer. Further, the composite panel includes a second layer adjacent the resistance heater, the resistance heater being positioned between the first layer and the second layer. The second layer is made from an electrically non-conductive material.

Embodiments of the present disclosure disclose a variable resistance and a manufacturing method thereof, and the variable resistance is a variable resistance with continually adjustable resistance value. This variable resistance comprises: an elastic insulation envelope and conductive particles filled in the elastic insulation envelope. The manufacturing method of the variable resistance comprises: filling conductive particles into an elastic insulation envelope with an opening; and sealing the opening of the elastic insulation envelope.

Embodiments of the present disclosure disclose a variable resistance and a manufacturing method thereof, and the variable resistance is a variable resistance with continually adjustable resistance value. This variable resistance comprises: an elastic insulation envelope and conductive particles filled in the elastic insulation envelope. The manufacturing method of the variable resistance comprises: filling conductive particles into an elastic insulation envelope with an opening; and sealing the opening of the elastic insulation envelope.

A micro-resistance structure with high bending strength is disclosed. The micro-resistance structure with high bending strength comprises a multi-layer metallic substrate; a patterned electrode layer disposed on a lower surface of the multi-layer metallic substrate; an encapsulant layer covering a portion of the multi-layer metallic substrate, wherein the encapsulant layer is substantially made of a flexible resin ink; and two external electrodes, which are electrically insulated from each other, covering the exposed portion of the multi-layer metallic substrate. The abovementioned structure is characterized in high bendability and applicable to wearable devices. A manufacturing method and a semi-finished structure of the micro-resistance structure with high bending strength are also disclosed herein.