According to one embodiment, a semiconductor device 1 includes an Si substrate 11, an inductor 12 formed in wiring layers disposed above the Si substrate 11, and a shield 13 formed so as to surround the inductor 12, in which the shield 13 includes metals 105 to 109 formed in, among the wiring layers, a layer in which the inductor 12 is formed and a layer above that layer, and a silicide 104 formed between the Si substrate 11 and the wiring layers above the Si substrate 11.

A complex electronic component includes a body including a first external electrode and a second external electrode, disposed on an external surface thereof and a laminate; a plurality of first electrodes and a plurality of second electrodes, disposed in the laminate and electrically connected to the first external electrode and the second external electrode, respectively; a third electrode and a fourth electrode, disposed on the laminate to be spaced apart from each other and electrically connected to the first external electrode and the second external electrode, respectively; and an ESD discharge layer disposed between the third electrode and the fourth electrode. In addition, a distance between the third electrode and the fourth electrode is within a range of 30 μm to 60 μm.

A coil component includes a body, a support substrate disposed within the body, a coil portion disposed on the support substrate and having first and second lead-out portions exposed to respective surfaces of the body, a noise removal portion disposed within the body and spaced apart from the coil portion, and including a pattern portion forming an open loop and having a slit between one end portion thereof and another end portion thereof spaced apart from each other. The noise removal portion also includes a third lead-out portion connected to the pattern portion and having one surface exposed to a side surface of the body. An insulating layer is disposed between the coil portion and the noise removal portion, and first to third external electrodes are disposed on respective surfaces of the body and connected to the first to third lead-out portions, respectively.

Disclosed herein is a coil component that includes an element body made of a first magnetic material, a coil conductor embedded in the element body, and first and second magnetic films made of a second magnetic material having higher permeability than that of the first magnetic material. The element body has an upper surface crossing a coil axis of the coil conductor and first and second side surfaces extending substantially parallel to the coil axis. The first magnetic film is formed on the upper surface and first side surface of the element body, and the second magnetic film is formed on the upper surface and second side surface of the element body.

A multilayer substrate includes a stacked body including thermoplastic resin insulating base material layers, a coil, and a first low flow member and a second low flow member including a flowability lower than the flowability of the thermoplastic resin at a temperature during heating and pressurizing. The coil includes linear conductors that are each provided on the insulating base material layers and include a first region surrounded by the linear conductors when viewed in a stacking direction (Z-axis direction) of the insulating base material layers. The first low flow member including a planar or substantially planar shape and the second low flow member including a winding shape, when viewed in the Z-axis direction, are arranged in the first region. The first low flow member, when viewed in the Z-axis direction, at least partially overlaps a second region surrounded by the second low flow member.

According to one aspect of the present disclosed subject matter, a receiver inductively powered by a transmitter for powering a load, the receiver comprising: a resonance circuit capable of tuning its resonance frequency for coupling with the transmitter and generate AC voltage; a power supply section configured to rectify the AC voltage and adjust a DC current and a DC voltage to the load; and a control and communication section designed to set parameters for the receiver and communicate operation points (OP) to the transmitter, wherein the parameters and the OP derived from determining a minimal power loss of the receiver.

A power amplifier module includes a first substrate and a second substrate, at least part of the second substrate being disposed in a region overlapping the first substrate. The second substrate includes a first amplifier circuit and a second amplifier circuit. The first substrate includes a first transformer including a primary winding having a first end and a second end and a secondary winding having a first end and a second end; a second transformer including a primary winding having a first end and a second end and a secondary winding having a first end and a second end; and multiple first conductors disposed in a row between the first transformer and the second transformer, each of the multiple first conductors extending from the wiring layer on a first main surface to the wiring layer on a second main surface of the substrate.

An integrated circuit (IC) device may include a first substrate having an inductor ground plane in a conductive layer of the first substrate. The integrated circuit may also include a first inductor in a passive device layer of a second substrate that is supported by the first substrate. A shape of the inductor ground plane may substantially correspond to a silhouette of the first inductor.

An electronic package comprises an integrated circuit (IC) configured to receive a power input signal and to deliver a regulated power output signal. A multilayer electrical routing structure is attached to the IC and is configured to couple the electronic package to an external circuit. The multilayer routing structure has one or more electrical conductors on each of at least two layers which are configured to route the power input signal from the external circuit to the IC and to route the regulated power output signal from the IC to the external circuit. The one or more electrical conductors form an integrated inductive device having a respective portion disposed on each of the at least two layers and the power output signal is coupled to the external circuit through the integrated inductive device.

An inductive component and package structure is provided, comprising a magnetic body having a top surface and a bottom surface, wherein a plurality of conductive through holes are formed from the top surface to the bottom surface of the magnetic body, and the plurality of conductive through holes are electrically connected via first conductive patterns disposed over the top surface of the magnetic body and second conductive patterns disposed over the bottom surface of the magnetic body so as to form at least one conductive path, each passing through a corresponding set of conductive through holes, wherein each of the at least one conductive path has two terminals and a corresponding inductance. At least one portion of a first electronic device is disposed in a first space, at least partially surrounded by the at least one conductive path.