Patent classifications
H01F17/00
Coil-incorporated multilayer substrate and method for manufacturing the same
A coil-incorporated multilayer substrate includes base materials and a coil portion including conductor patterns that are wound a plurality of times on at least one of the base materials, and, in a predetermined direction along the surface of the base material of the coil portion, the width of outermost conductor patterns is larger than the widths of the conductor patterns between an innermost conductor pattern and an outermost conductor pattern, the width of the innermost conductor pattern is larger than the widths of the conductor patterns between the outermost conductor pattern and the innermost conductor pattern, and the width of the innermost conductor pattern is larger than the distance between the innermost conductor pattern and the conductor pattern adjacent to the innermost conductor pattern.
Coil component
Disclosed herein is a coil component that includes an element body having first and second magnetic layers and a coil part positioned therebetween, and first and second external terminals formed on the element body. The first external terminal is formed on the mounting surface and the first side surface. The second external terminal is formed on the mounting surface and the second side surface. The first and second external terminals formed on the first and second side surfaces, respectively, have a meander shape.
Multilayer coil component
A multilayer coil component includes a multilayer body, and first and second outer electrodes. The multilayer body is formed by stacking plural insulating layers in a length direction, and includes a coil incorporated therein. The first and second outer electrodes are electrically connected to the coil. The coil is formed by electrically connecting plural coil conductors stacked in the length direction together with the insulating layers. The multilayer body has first and second end surfaces, first and second major surfaces, and first and second lateral surfaces. The first outer electrode has first, second, and third electrode portions. As viewed in plan in the width direction, the third electrode portion is substantially concave toward a vertex where first and second edges meet, the first edge being an edge where the first and third electrode portions meet, the second edge being an edge where the second and third electrode portions meet.
Coupling inductors in an IC device using interconnecting elements with solder caps and resulting devices
Methods of coupling inductors in an IC device using interconnecting elements with solder caps and the resulting device are disclosed. Embodiments include forming a top inductor structure, in a top inductor area on a lower surface of a top substrate, the top inductor structure having first and second top terminals at its opposite ends; forming a bottom inductor structure, in a bottom inductor area on an upper surface of a bottom substrate, the bottom inductor structure having first and second bottom terminals at its opposite ends; forming top interconnecting elements on the lower surface of the top substrate around the top inductor area; forming bottom interconnecting elements on the upper surface of the bottom substrate around the bottom inductor area; forming solder bumps on lower and upper surfaces, respectively, of the top and bottom interconnecting elements; and connecting the top and bottom interconnecting elements to each other.
PRINTED CIRCUIT BOARD MODULE
A printed circuit board module comprises: a first printed circuit board; a second printed circuit board arranged on one surface of the first printed circuit board; a third printed circuit board arranged on the other surface of the first printed circuit board; and a core passing through the first printed circuit board to the third printed circuit board, wherein the second printed circuit board includes a first coil, the third printed circuit board includes a second coil, and the cross-sectional area of the second printed circuit board and the third printed circuit board is less than the cross-sectional area of the first printed circuit board.
REDUCTION OF AC RESISTIVE LOSSES IN PLANAR CONDUCTORS
A planar inductor may include a first coil and a second coil. The first coil may include a first trace that forms a first set of turns. The second coil may include a second trace that forms a second set of turns. A distance between the turns of the first set of turns may be equal to a distance between the turns of the second set of turns. A width of the first trace may be equal to a width of the second trace. The first coil and the second coil may be physically positioned or sized according to a/b in which a represents the width of the first trace and b represents the distance between the turns of the first set of turns.
Wireless monitoring system for coal-gangue mixing ratio based on non-Hermite technology
Disclosed is a wireless monitoring system for a coal-gangue mixing ratio based on a non-Hermite technology, including a signal generation monitoring device, an excitation coil, a receiving coil and a parallel plate capacitor. The signal generation monitoring device is connected with the excitation coil; the receiving coil is connected with the parallel plate capacitor to form an LC resonance system; the receiving coil is placed in parallel with the excitation coil, and the axis of the receiving coil and the axis of the excitation coil are on a same horizontal line; the signal generation monitoring device is used to generate a pulse current and collect reflected signals; the excitation coil excites an initial magnetic field based on the generated pulse current, and the LC resonance circuit performs an electromagnetic field induction to generate an induced magnetic field, and feeds back the reflected signals to the signal generation monitoring device.
Multilayer electronic device including a high precision inductor
A multilayer electronic device may include a plurality of dielectric layers and a signal path having an input and an output. An inductor may include a conductive layer formed on one of the plurality of dielectric layers and may be electrically connected at a first location with the signal path and electrically connected at a second location with at least one of the signal path or a ground. The inductor may include an outer perimeter that includes a first straight edge facing outward in a first direction and a second straight edge parallel to the first straight edge and facing outward in the first direction. The second straight edge may be offset from the first straight edge by an offset distance that is less than about 500 microns and less than about 90% of a first width of the inductor in the first direction at the first straight edge.
CHIP PARTS
A chip part is provided that includes a substrate in which an element region and an electrode region are set, an insulating film (a first insulating film and a second insulating film) which is formed on the substrate and which selectively includes an internal concave/convex structure in the electrode region on a surface, a first connection electrode and a second connection electrode which include, at a bottom portion, an anchor portion entering the concave portion of the internal concave/convex structure and which include an external concave/convex structure on a surface on the opposite side and a circuit element which is disposed in the element region and which is electrically connected to the first connection electrode and the second connection electrode.
AUTO-BALANCING TRANSFORMERS
Auto balancing transformers are disclosed for balancing a multi-phase electrical system by varying the degree of electromagnetic coupling between primary and secondary winding. The auto-balancing transformer includes a movable to selectively couple primary phases with two or fewer phases of the secondary system.