A method for the manufacture of a formerless, multi-coil cylindrical superconducting magnet structure is disclosed. The structure comprises superconducting coils and annular spacers of composite filler material. The disclosure also provides a formerless, multi-coil cylindrical superconducting magnet structure as may be manufactured by such a method.

Techniques are described for a method to manufacture a magnet structure comprising superconducting coils and annular spacers comprising a filled composite filler material. Also described are superconducting magnet structures as may be manufactured by such a method.

A transformer comprises at least two windings and each of the at least two windings includes at least one lead-out wire, and a silicone rubber heat-shrinkable sleeve is wrapped around the outer surface of the lead-out wire. The at least two windings and a portion of the silicone rubber heat-shrinkable sleeve are encapsulated in a potting box with a first potting sealant, and another portion of the silicone rubber heat-shrinkable sleeve is exposed outside of the potting box.

The present disclosure concerns a method of manufacturing an electronic device, where the electronic device includes at least one electronic component with at least one electrical winding, and at least one heat dissipation mass coating, and the method includes inserting the at least one electronic component into a cavity; pouring, before or after the insertion of the electronic component, a heat dissipation mass into the cavity so as to at least partially fill the cavity and at least partially cover the electronic component with the heat dissipation mass; removing the electronic device, namely, the electronic component covered by the heat dissipation mass coating, from the cavity. The present disclosure also concerns an electronic apparatus including at least one electronic device manufactured by the foregoing method.

An embedded-core device including a substrate, a core embedded in the substrate, a winding arranged around the core, and a dummy pin in direct contact with the core and not in direct contact with the winding. A method of a manufacturing an embedded-core device includes providing winding pins and a dummy pin, inserting a core between the winding pins using the dummy pin such that the dummy pin is in direct contact with the core and not in direct contact with the winding pins, and sealing the core with resin.

A coil component includes a molded portion having one surface and another surface opposing each other, and a wound coil disposed on the one surface of the molded portion and including an innermost turn, at least one intermediate turn, and an outermost turn disposed outwardly of a central portion of the one surface of the molded portion. A cover portion is disposed to face the one surface of the molded portion and to cover the wound coil, and first and second external electrodes are connected to the wound coil and arranged to be spaced apart from each other on the other surface of the molded portion. A thickness of one region of the cover portion disposed on the innermost turn is thicker than a thickness of another region of the cover portion disposed on the outermost turn.

An apparatus and a method for manufacturing a reactor capable of preventing a core from being cracked due to a resin pressure during molding are provided. An apparatus for manufacturing a reactor provided with a core includes a mold with a cavity for housing the core. The mold includes a core support pin brought into contact with the core and configured to support the core against a resin pressure during molding. Resin flow paths during molding includes an inner flow path passing through inside the core and an outer flow path passing through outside the core. The core support pin is disposed at a position where a width of the inner flow path is greater than a width of the outer flow path.

An inductor includes an encapsulation shell with an inductive component encapsulated inside; an input electrode exposed on a surface of the encapsulation shell and configured to receive an alternating voltage; an output electrode exposed on the surface of the encapsulation shell and configured to output a direct current voltage, where the input electrode and the output electrode are electrically isolated by the encapsulation shell; and a metal shield layer asymmetrically covering the surface of the encapsulation shell and electrically connected to the output electrode, where the metal shield layer keeps the input electrode electrically isolated from the output electrode. An inductor fabrication method and a power supply circuit containing an inductor are further provided to resolve prior-art problems such as small range and poor effect of electromagnetic shielding and potential instability of the inductor, thereby achieving a better electromagnetic shielding effect and keeping the potential of the inductor stable.

An electrical induction device includes a housing and a contact arrangement in the housing of the electrical induction device for electrically contacting an electrical conductor. The contact arrangement includes a conductor tube, a receiver contact which is fastened to the conductor tube and configured to receive and electrically connect with the electrical conductor, and a resilient suspension arrangement fastened to the housing and connected to an outside of the conductor tube such that the receiver contact is resiliently movable in a plane which is parallel to a cross section of the conductor tube while being substantially immovable in an axial direction of the conductor tube.

A rare earth permanent magnet is prepared by immersing a portion of a sintered magnet body of R.sup.1—Fe—B composition (wherein R.sup.1 is a rare earth element) in an electrodepositing bath of a powder dispersed in a solvent, the powder comprising an oxide, fluoride, oxyfluoride, hydride or rare earth alloy of a rare earth element, effecting electrodeposition for letting the powder deposit on a region of the surface of the magnet body, and heat treating the magnet body with the powder deposited thereon at a temperature below the sintering temperature in vacuum or in an inert gas.