A multilayer inductor component includes an element body that is an insulator and a coil in which a plurality of coil conductor layers that extend along planes in the element body are electrically connected to each other. Also, each of the coil conductor layers includes metal part and glass part, and the glass part include internal glass portion that is entirely included in the metal part.

A high voltage direct current energy transmission (HVDCT) air-core inductor includes at least one concentric winding layer having electric terminals are formed at its ends, and includes an electrostatic shield that has a layer of electrostatically dissipative material having a surface resistance ranging from 109 to 1014 ohm/square, wherein at least one end of the layer is provided with a collector electrode that extends essentially along the circumference of the end of the layer and that is to be connected to one of the terminals, and where the layer is designed as a spray coating on an outer surface of an exterior winding layer.

A coil component in which occurrence of plating elongation is further suppressed and an inductance value is higher. A coil component includes an element body including metal magnetic particles, a coil conductor inside the element body, and a plurality of external electrodes on a surface of the element body. The element body has a substantially rectangular parallelepiped shape including upper and lower surfaces substantially orthogonal to a winding axis of the coil conductor, first and second side surfaces facing each other, and third and fourth side surfaces facing each other. An average particle diameter of each of metal magnetic particles constituting the upper surface, metal magnetic particles constituting the lower surface, metal magnetic particles constituting the first side surface, and metal magnetic particles constituting the second side surface is smaller than an average particle diameter of metal magnetic particles existing inside a winding portion of the coil conductor.

A manufacturing method of a thin-film power inductor includes: Alloy powder is mixed with plasticizer, adhesive, curing agent, dispersing agent and organic solvent to form slurry; the slurry is applied on a PET film, and drying to form a magnetic band; and the magnetic band is cut to form a plurality of magnetic sheets. A hole is opened on a magnetic sheet to form a hole-shaped magnetic sheet. Electrodes are processed on an insulating substrate to form a coil layer. Magnetic sheets, hole-shaped magnetic sheets, and the coil layer are stacked to form a block. The block is pressed, and the block is cut to form an individual product. The individual product is baked to form a main body. Silver paste is applied on the main body to form outer electrodes. A nickel layer and a tin layer are electroplated on outer electrodes to form a thin-film power inductor.

A layered electronic component includes a multilayer body having a metallic magnetic material layer including metallic magnetic material particles and a coil being built in the multilayer body. The coil is formed of multiple conductor patterns spirally connected each other and stacked along an axis direction of the coil, and the multilayer body includes a nonmagnetic ferrite part arranged at least an inner area of the coil when viewed from a winding axis direction of the coil.

A coil component according to one or more embodiments includes a base body having first to sixth surfaces, and a coil conductor including a winding portion that extends around a coil axis intersecting the first and second surfaces. The winding portion includes first, second, third, and fourth portions facing the third, fourth, fifth, and sixth surfaces, respectively when viewed from a direction of the coil axis. The radii of curvature of the first and second portions are both smaller than the radii of curvature of the third and fourth portions. When viewed from the direction of the coil axis, the distance between the first portion and the third surface and the distance between the second portion and the fourth surface are both larger than the distance between the third portion and the fifth surface and the distance between the fourth portion and the sixth surface.

A coil array component including an element assembly that includes a filler and a resin material, a first coil portion and a second coil portion that are embedded in the element assembly and that are composed of a first coil conductor and a second coil conductor, respectively, and four outer electrodes electrically connected to the first coil portion and the second coil portion. Also, the first coil conductor and the second coil conductor are covered with a glass layer.

The disclosure relates to methods for fabricating coreless printed circuit board (PCB) based transformers and/or coreless PCB-based circuits containing one or more coil inductor(s). More specifically, the disclosure relates to methods for fabricating coreless PCB-based transformers and/or inductors having concatenated helix architecture of their primary and secondary windings using layer-by-layer printing of dielectric and conductive patterns.

Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.

An electronic component includes a body, an inner conductor inside the body, and an outer electrode that lies on part of at least a first main surface of the body and includes an underlying electrode and a plating electrode with which the underlying electrode is covered. The underlying electrode includes a first underlying electrode on part of the first main surface and connected directly to the inner conductor and a second underlying electrode at part of the first main surface away from the first underlying electrode and closer than the first underlying electrode to the center of the body in the length direction and not connected directly to the inner conductor. The plating electrode includes first and second plating electrodes. The first underlying electrode is covered with the first plating electrode, and the second underlying electrode is covered with the second plating electrode.