A magnetic inlay includes a magnetic matrix and a plurality of electrically conductive vertical through connections extending vertically through the magnetic matrix. Further, a component carrier including the magnetic inlay and a method of manufacturing said magnetic inlay are described.

A magnetic inlay for a component carrier includes a magnetic matrix and an electrically conductive structure embedded horizontally in the magnetic matrix. The electrically conductive structure is configured as an inductive element. The magnetic inlay is configured so that, depending on the geometrical properties of the electrically conductive structure, a specific inductance value is provided for the magnetic inlay.

A coil electronic component includes a body having first and second surfaces opposing each other, and third and fourth surfaces connecting the first and second surfaces to each other and opposing each other, an insulating substrate disposed in the body and including an end portion having one side surface exposed externally of the body, first and second coil portions disposed on one surface and the other surface of the insulating substrate opposing each other, respectively, a first lead-out portion connected to the first coil portion, disposed on one surface of the insulating substrate, and exposed from the body, a second lead-out portion connected to the first coil portion, disposed on the other surface of the insulating substrate, and exposed from the body, and a direction indicator disposed on at least one of one surface and the other surface of the end portion opposing each other.

An embedded magnetic component transformer device includes an insulating substrate with a cavity and a magnetic core housed within the cavity. First and second electrical windings pass through the insulating substrate around the magnetic core. The first electrical winding includes a first end terminal and a second end terminal, and a first tap terminal between the first and second end terminals. The device includes circuitry with a first input terminal electrically connected to the first end terminal and a first output terminal. In a first configuration of the circuitry, the first output terminal is electrically connectable to the second end terminal. In a second configuration of the circuitry, the first output terminal is electrically connectable to the first tap terminal.

The present invention provides a multilayer transformer PCB structure for an electric car and manufacturing method for the same, which includes first and second connecting copper tabs horizontally formed in plural on both surfaces of a base substrate, thereby forming inner layer circuits coupled to battery cells, and third and fourth connecting copper tabs stacked on a top surface of the first connecting copper tab and a top surface of the second connecting copper tab by patterning process a copper material several times as a predetermined thickness, thereby forming outer layer circuits coupled to the battery cells. According to the present invention configured thus, the transformer PCB for an electric car has a structure in which a conductive material having a predetermined thickness is stacked in a multilayer form, and thus an increased quantity of charges to be treated is highly distributed, thereby maximizing current efficiency.

A diplex filter having tunable inductors. Preferably the tunable inductors include pads that may each selectively receive one end of a jumper.

An inductive device includes an insulating layer, a lower magnetic layer, and an upper magnetic layer that are formed such that the insulating layer does not separate the lower magnetic layer and the upper magnetic layer at the outer edges or wings of the inductive device. The lower magnetic layer and the upper magnetic layer form a continuous magnetic layer around the insulating layer and the conductors of the inductive device. Magnetic leakage paths are provided by forming openings through the upper magnetic layer. The openings may be formed through the upper magnetic layer by semiconductor processes that have relatively higher precision and accuracy compared to semiconductor processes for forming the insulating layer such as spin coating. This reduces magnetic leakage path variation within the inductive device and from inductive device to inductive device.

A method making a three-dimensional inductor, the method including: forming a plurality of vias in a substrate or a molding compound, wherein the vias are arranged with spacings among them; forming a metal layer having interconnects, wherein the interconnects of the metal layer connect the plurality of vias on one end of the vias; forming a plurality of wires to connect the plurality of vias on the other end of the vias to form the 3D inductor; and tuning one or more of the plurality of wires to adjust a physical configuration and inductance value of the 3D inductor.

An inductive device includes an insulating layer, a lower magnetic layer, and an upper magnetic layer that are formed such that the insulating layer does not separate the lower magnetic layer and the upper magnetic layer at the outer edges or wings of the inductive device. The lower magnetic layer and the upper magnetic layer form a continuous magnetic layer around the insulating layer and the conductors of the inductive device. Magnetic leakage paths are provided by forming openings through the upper magnetic layer. The openings may be formed through the upper magnetic layer by semiconductor processes that have relatively higher precision and accuracy compared to semiconductor processes for forming the insulating layer such as spin coating. This reduces magnetic leakage path variation within the inductive device and from inductive device to inductive device.

A coil component comprising a coil conductor layer wound on a plane, an outer-circumferential lead-out conductor led out on the same plane as the coil conductor layer from an outer-circumferential end of the coil conductor layer, and an inner-circumferential lead-out conductor led out on the same plane as the coil conductor layer from an inner-circumferential end of the coil conductor layer. The coil component further comprises a branch conductor disposed to branch from at least one of the outer-circumferential lead-out conductor and the inner-circumferential lead-out conductor, and extending on the same plane as the coil conductor layer.