A capacitor assembly, configured for a high-voltage application, contains an active capacitor part, a housing for accommodating the active capacitor part and an insulating medium for the electrical insulation of the active capacitor part. A flexible-shape inlay is arranged between the insulating medium and the housing and connected electrically thereto. Ideally the capacitor assembly is part of a converter assembly.

The present disclosure provides a manufacturing method of an electrode outer casing capable of improving a yield in a manufacturing method of an electrode outer casing which uses a laminated film and implementing an increase in productivity. The manufacturing method of an electrode outer casing disclosed herein includes a preparation step of preparing a multilayer laminated film which has at least a plurality of resin film layers, a transport step of transporting the laminated film to an unevenness forming section in order to form an uneven shape, a forming step of forming the laminated film in the unevenness forming section, and a cutting step of cutting the laminated film having been subjected to the forming step.

A base tape includes an accommodating section having a rectangular or substantially rectangular parallelepiped, and the base tape includes a surface layer including a carbon layer. The accommodating section includes a bottom surface portion, a side wall portion including a plurality of surfaces, and an opening portion. The side wall portion includes at at least one surface thereof an edge portion located between the bottom surface portion and the opening portion and an electrical discharge path portion inclined from the edge portion toward the opening portion. An electronic component array includes the base tape, an electronic component accommodated in the accommodating section of the base tape, and a cover tape that covers the accommodating section.

A multilayer ceramic capacitor package accommodating multilayer ceramic capacitors includes a carrier tape that is elongated and includes recess pockets at equal or substantially equal intervals in a longitudinal direction, a cover tape that is elongated and attached to the carrier tape to cover an opening of each of the pockets, and the multilayer ceramic capacitors respectively accommodated in the pockets. In the multilayer ceramic capacitor package, in adjacent multilayer ceramic capacitors, a difference in densities of surfaces on an opening side of the pockets is about 0% or more and about 4% or less.

A method for producing a resin mold-type electronic component in which an electronic component main body is covered with a mold resin includes preparing a first mold resin provided with a metal terminal, having an accommodating portion for the electronic component main body, and having a joining material filling space to be filled with a joining material, accommodating the electronic component main body in the accommodating portion of the first mold resin, and joining the metal terminal and a terminal electrode of the electronic component main body by filling the joining material filling space with the joining material.

A method of manufacturing an electronic component includes preparing an unfired multilayer body including first and second main surfaces facing each other in a stacking direction, first and second side surfaces facing each other in a width direction, and first and second end surfaces facing each other in a length direction, bonding one main surface of the unfired multilayer body to an elongated first adhesive sheet, conveying the first adhesive sheet in a first direction in which the first adhesive sheet approaches an elongated second adhesive sheet, and bonding one side surface of the unfired multilayer body to the second adhesive sheet, conveying the second adhesive sheet in a second direction different from the first direction to peel off the unfired multilayer body from the first adhesive sheet, polishing another side surface of the unfired multilayer body, and forming a first insulating layer on the polished another side surface.

A method of manufacturing an electronic component includes preparing an unfired multilayer body including first and second main surfaces facing each other in a stacking direction, first and second side surfaces facing each other in a width direction, and first and second end surfaces facing each other in a length direction, bonding one main surface of the unfired multilayer body to an elongated first adhesive sheet, conveying the first adhesive sheet in a first direction in which the first adhesive sheet approaches an elongated second adhesive sheet, and bonding one side surface of the unfired multilayer body to the second adhesive sheet, conveying the second adhesive sheet in a second direction different from the first direction to peel off the unfired multilayer body from the first adhesive sheet, polishing another side surface of the unfired multilayer body, and forming a first insulating layer on the polished another side surface.

A capacitor element and a method of manufacturing the same are provided. The method includes steps of: providing a metal foil having an oxide layer formed on an outer surface of the metal foil; forming a surrounding barrier layer onto the oxide layer so as to divide the outer surface of the oxide layer into a first part outer surface and a second part outer surface separated from each other; forming a base layer onto the oxide layer so as to partially encapsulate the oxide layer; cleaning the base layer by a cleaning solution and then drying the base layer; forming a conductive polymer layer onto the base layer; and forming a conductive paste layer onto the conductive polymer layer.

An electronic component includes an electronic component main body including a body and an external electrode disposed on the body. The body includes a dielectric layer and an internal electrode. The electronic component further includes a coating portion including a coating layer, disposed on an external surface of the electronic component main body, and a plurality of projections disposed on the coating layer.

A hermetically sealed feedthrough assembly for an active implantable medical device having an oxide-resistant electrical attachment for connection to an EMI filter, an EMI filter circuit board, an AIMD circuit board, or AIMD electronics. The oxide-resistant electrical attachment, including an oxide-resistant sputter layer 165 is disposed on the device side surface of the hermetic seal ferrule over which an ECA stripe is provided. The ECA stripe may comprise one of a thermal-setting electrically conductive adhesive, an electrically conductive polymer, an electrically conductive epoxy, an electrically conductive silicone, an electrically conductive polyimides, or an electrically conductive polyimide, such as those manufactured by Ablestick Corporation. The oxide-free electrical attachment between the ECA stripe and the filter or AIMD circuits may comprise one of gold, platinum, palladium, silver, iridium, rhenium, rhodium, tantalum, tungsten, niobium, zirconium, vanadium, and combinations or alloys thereof.