A capacitor module is provided with a case with a bottom surface and an opening, a first capacitor group including first capacitors each having first and second electrodes, and a side surface connecting the first and second electrodes, a second capacitor group including second capacitors each having third and fourth electrodes, and a side surface connecting the third and fourth electrodes, a first bus bar having an electrode contact portion in contact with the first electrode, a second bus bar having an electrode contact portion in contact with the third electrode, a third bus bar having an electrode contact portion commonly in contact with the second electrode and the fourth electrode, a sealing resin filled in the case; and an insulating member provided between the electrode contact portion of the first bus bar and the electrode contact portion of the second bus bar and surrounded by the sealing resin.

A capacitor module is provided with a case with a bottom surface and an opening, a first capacitor group including first capacitors each having first and second electrodes, and a side surface connecting the first and second electrodes, a second capacitor group including second capacitors each having third and fourth electrodes, and a side surface connecting the third and fourth electrodes, a first bus bar having an electrode contact portion in contact with the first electrode, a second bus bar having an electrode contact portion in contact with the third electrode, a third bus bar having an electrode contact portion commonly in contact with the second electrode and the fourth electrode, a sealing resin filled in the case; and an insulating member provided between the electrode contact portion of the first bus bar and the electrode contact portion of the second bus bar and surrounded by the sealing resin.

A double-sided copper-clad laminate that includes an adhesive layer and a copper foil in order on each of both surfaces of a resin film, the resin film is in a cured state at 25° C., and each of the copper foils has a maximum peak height Sp of 0.05 μm or more and 3.3 μm or less as measured in accordance with ISO 25178 on a surface on a side being in contact with the adhesive layer.

A process of forming a cross-linked electronically active hydrophilic co-polymer is provided and includes the steps of: a. mixing an intrinsically electronically active material and at least one compound of formula (I) with water to form an intermediate mixture; b. adding at least one hydrophilic monomer, at least one hydrophobic monomer, and at least one cross-linker to the intermediate mixture to form a co-monomer mixture; and c. polymerising the co-monomer mixture. Formula (I) is defined as: ##STR00001##
where R.sup.1 and R.sup.2 are independently optionally substituted C.sub.1-C.sub.6 alkyl and X.sup.− is an anion.

A process of forming a cross-linked electronically active hydrophilic co-polymer is provided and includes the steps of: a. mixing an intrinsically electronically active material and at least one compound of formula (I) with water to form an intermediate mixture; b. adding at least one hydrophilic monomer, at least one hydrophobic monomer, and at least one cross-linker to the intermediate mixture to form a co-monomer mixture; and c. polymerising the co-monomer mixture. Formula (I) is defined as: ##STR00001##
where R.sup.1 and R.sup.2 are independently optionally substituted C.sub.1-C.sub.6 alkyl and X.sup.− is an anion.

A second busbar is provided that has a second electrode terminal and a second connection terminal. A first busbar is provided that has a first electrode terminal, a lateral side coupler, an overhang, and a first connection terminal. The first electrode terminal and/or the second electrode terminal has a protruding piece for connection (connecting protrusion). This protruding piece is elastically depressible in response to contact with an electrode surface of a capacitor element unit inserted from an opposite side of the lateral side coupler across a space between the first and second electrode terminals.

A second busbar is provided that has a second electrode terminal and a second connection terminal. A first busbar is provided that has a first electrode terminal, a lateral side coupler, an overhang, and a first connection terminal. The first electrode terminal and/or the second electrode terminal has a protruding piece for connection (connecting protrusion). This protruding piece is elastically depressible in response to contact with an electrode surface of a capacitor element unit inserted from an opposite side of the lateral side coupler across a space between the first and second electrode terminals.

A capacitor includes cup-shaped lower electrodes disposed on a substrate, a capacitor dielectric layer conformally covering inner surfaces and outer surfaces of the cup-shaped lower electrodes, and a support layer disposed between outer surfaces of the cup-shaped lower electrodes to connect the cup-shaped lower electrodes. The capacitor further includes an annealed oxide layer, which is interposed between the inner surfaces of the cup-shaped lower electrodes and the capacitor dielectric layer, and is also interposed between a portion of the outer surfaces of the cup-shaped lower electrodes and the capacitor dielectric layer. A method for forming the capacitor is also provided.

A capacitor includes cup-shaped lower electrodes disposed on a substrate, a capacitor dielectric layer conformally covering inner surfaces and outer surfaces of the cup-shaped lower electrodes, and a support layer disposed between outer surfaces of the cup-shaped lower electrodes to connect the cup-shaped lower electrodes. The capacitor further includes an annealed oxide layer, which is interposed between the inner surfaces of the cup-shaped lower electrodes and the capacitor dielectric layer, and is also interposed between a portion of the outer surfaces of the cup-shaped lower electrodes and the capacitor dielectric layer. A method for forming the capacitor is also provided.

Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a die in a first dielectric layer; and a capacitor including a first conductive pillar and a second conductive pillar in the first dielectric layer, each pillar having a first end and an opposing second end, where the first and second conductive pillars form a first plate of the capacitor; a second dielectric layer on the die and on the second end of the first and second conductive pillars extending at least partially along a first thickness of the first and second conductive pillars and tapering from the second end towards the first end; and a metal layer on the second dielectric layer, wherein the metal layer extends at least partially along a second thickness of the first and second conductive pillars, where the metal layer forms a second plate of the capacitor.