Patent classifications
H01G4/1218
DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR
A dielectric composition that contains a first complex oxide represented by (Bi.sub.xNa.sub.1−x)TiO.sub.3—CaTiO.sub.3 and having a perovskite structure as a main component; and at least one second complex oxide having a perovskite structure selected from the group consisting of BaZrO.sub.3, SrZrO.sub.3, CaZrO.sub.3, NaNbO.sub.3, and NaTaO.sub.3 as an auxiliary component. A tolerance factor t when the at least one second complex oxide is BaZrO.sub.3, NaNbO.sub.3, or NaTaO.sub.3 is 0.9016≤t≤0.9035, a tolerance factor t when the at least one second complex oxide is SrZrO.sub.3 is 0.9005≤t≤0.9025, and a tolerance factor t when the at least one second complex oxide is CaZrO.sub.3 is 0.9000 t<0.9020.
CERAMIC ELECTRONIC DEVICE, DIELECTRIC MATERIAL, AND MANUFACTURING METHOD OF CERAMIC ELECTRONIC DEVICE
A ceramic electronic device includes a dielectric layer and an internal electrode layer that are alternately stacked, wherein the dielectric layer contains yttria-stabilized zirconia and (Ca.sub.x1Ba.sub.x2Sr.sub.1-x1-x2)(Ti.sub.yZr.sub.1-y)O.sub.3 (0.6≤x1≤0.9, 0≤x2≤0.1, 0≤y≤0.1) as a main component, and wherein, in the dielectric layer, a concentration of the yttria-stabilized zirconia when a total amount of Ti and Zr is 100 mol % is 0.5 mol % or more and 5.0 mol % or less.
Multilayer capacitor and board having the same mounted thereon
A multilayer capacitor includes a body having a plurality of dielectric layers and first and second internal electrodes alternately disposed with the dielectric layers interposed therebetween, and further including an active region in which the first and second internal electrodes overlap each other, and upper and lower covers disposed above and below the active region, respectively; and first and second external electrodes disposed on the body to be connected to the first and second internal electrodes, respectively, wherein the upper and lower covers include barium titanate (BT, BaTiO.sub.3) and Yttria-stabilized zirconia (YSZ).
Multilayer electronic component
A multilayer electronic component includes a body comprising dielectric layers, and first and second internal electrode layers alternately stacked in a stacking direction with respective dielectric layers interposed therebetween. The first internal electrode layer includes first and second internal electrodes arranged with a first spacer interposed therebetween, and the second internal electrode layer includes third and fourth internal electrodes arranged with a second spacer interposed therebetween.
Multilayer electronic component and method for manufacturing multilayer electronic component
A multilayer electronic component includes a multilayer body including dielectric layers and inner electrode layers, the multilayer body including an electrode facing portion in which the inner electrode layers are laminated to face each other with the dielectric layers interposed therebetween. The multilayer body has a thickness of at least about 1.5 mm in a lamination direction, a length of at least about 3.0 mm, and a width of at least about 1.5 mm. Each of the dielectric layers includes Ba, Ti, and Cl. A Cl concentration C.sub.1 in the entire electrode facing portion satisfies about 10 wtppm<C.sub.1<about 50 wtppm. On an imaginary central axis line, a Cl concentration C.sub.2 in a central portion of the electrode facing portion and a Cl concentration C.sub.3 in both end portions of the electrode facing portion satisfy about 0.5C.sub.2≤C.sub.3<C.sub.2.
Multilayer ceramic capacitor
A multilayer ceramic capacitor includes a multilayer body including dielectric layers which are stacked and internal electrode layers which are stacked, and external electrodes, each connected to the internal electrode layers. The external electrodes each include a conductive resin layer and a plated layer on the conductive resin layer. The conductive resin layer includes a resin portion, conductive fillers dispersed in the resin portion, and metal particles dispersed unevenly in a distribution differing from that of the conductive fillers in the conductive resin layer. An abundance ratio of the metal particles to the resin portion is higher on a side of the plated layer of the conductive resin layer than on a side of the conductive resin layer close to the multilayer body.
Ceramic electronic device and manufacturing method of the same
A ceramic electronic device includes a multilayer chip in which a plurality of dielectric layers of which a main component is ceramic and a plurality of internal electrode layers are stacked. The plurality of internal electrode layers include Ni, Sn and Au.
Multi-layered ceramic electronic component and manufacturing method thereof
A multilayer ceramic electronic component includes a ceramic body including first and second internal electrodes disposed to face each other and a dielectric layer interposed therebetween. When an average thickness of the dielectric layer is denoted as ‘td,’ an average thickness of the first and second internal electrodes is denoted as ‘te,’ and a standard deviation of thicknesses of an internal electrode, measured at a plurality of points in a predetermined region of the internal electrode, is denoted as ‘σte,’ a ratio of the standard deviation of thicknesses of the internal electrode to the average thickness of the dielectric layer, which is denoted as ‘σte/td,’ satisfies 0.12≤σte/td≤0.21.
Multilayer ceramic electronic component
A multilayer ceramic electronic component includes first and second multilayer ceramic electronic component bodies facing each other in a length direction that connects first and second end surfaces. A first metal terminal is connected to a first outer electrode. A second metal terminal is connected to a fourth outer electrode. An outer casing covers the first and second multilayer ceramic electronic component bodies, and at least a portion of each of the first and second metal terminals. A third metal terminal is exposed from the outer casing.
Ceramic electronic component and method of manufacturing the same
A ceramic electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains has a core-dual shell structure having a core and a dual shell. The dual shell includes a first shell surrounding at least a portion of the core, and a second shell surrounding at least a portion of the first shell, and a concentration of a rare earth element included in the second shell is more than 1.3 times to less than 3.8 times a concentration of a rare earth element included in the first shell.