The present disclosure relates to a condenser core configured for surrounding an electrical conductor. The condenser core includes an insulation material and a plurality of electrically conducting capacitive layers for modifying electrical fields formed by a current flowing in the electrical conductor. At least one of the electrically conducting capacitive layers includes a first foil and a second foil. Each of the first and second foils of an outermost capacitive layer is connected with a grounding arrangement for grounding the foils.

The present disclosure relates to a condenser core configured for surrounding an electrical conductor. The condenser core includes an insulation material and a plurality of electrically conducting capacitive layers for modifying electrical fields formed by a current flowing in the electrical conductor. At least one of the electrically conducting capacitive layers includes a first foil and a second foil. Each of the first and second foils of an outermost capacitive layer is connected with a grounding arrangement for grounding the foils.

A semiconductor package structure includes a substrate, a redistribution layer, a first semiconductor die, and a first capacitor. The substrate has a wiring structure. The redistribution layer is disposed over the substrate. The first semiconductor die is disposed over the redistribution layer. The first capacitor is disposed in the substrate and is electrically coupled to the first semiconductor die. The first capacitor includes a first capacitor substrate, a plurality of first capacitor cells, and a first through via. The first capacitor substrate has a first top surface and a first bottom surface. The first capacitor cells are disposed in the first capacitor substrate. The first through via is disposed in the first capacitor substrate and electrically couples the first capacitor cells to the wiring structure on the first top surface and the first bottom surface.

A passive component includes a body including a dummy portion and a device portion. The dummy portion and the device portion extend in a first direction and are arranged such that a longitudinal axis of the device portion is offset from a longitudinal axis of the body in a second direction perpendicular to the first direction. The passive component further includes first and second electrical contacts on at least one surface of the body.

A passive component includes a body including a dummy portion and a device portion. The dummy portion and the device portion extend in a first direction and are arranged such that a longitudinal axis of the device portion is offset from a longitudinal axis of the body in a second direction perpendicular to the first direction. The passive component further includes first and second electrical contacts on at least one surface of the body.

An electronic component includes a substrate including electrode pads disposed on an upper surface; and a plurality of multilayer capacitors mounted on the substrate and including external electrodes connected to the electrode pads. At least one multilayer capacitor among the plurality of multilayer capacitors is a multilayer capacitor of a horizontally stacked structure.

An electronic component includes a substrate including electrode pads disposed on an upper surface; and a plurality of multilayer capacitors mounted on the substrate and including external electrodes connected to the electrode pads. At least one multilayer capacitor among the plurality of multilayer capacitors is a multilayer capacitor of a horizontally stacked structure.

The capacitor array that includes: a capacitor layer including a plurality of capacitor portions divided by a plurality of through-portions and arranged in a plane, and the capacitor portions each have a first main surface and a second main surface that are opposite to each other in a thickness direction. The plurality of through-portions include a first through-portion extending in a first direction perpendicular to the thickness direction, and a second through-portion extending in a second direction perpendicular to the thickness direction and intersecting the first direction. In a sectional view, each of the first through-portion and the second through-portion independently has a taper having a width decreasing from one of the first main surface and the second main surface to the other main surface. The first through-portion has a taper angle that is different from a taper angle of the second through-portion.

A capacitor comprises a body of dielectric material in which an anode and a cathode are arranged in a stack. A capacitance-forming layer of the dielectric material is arranged between the anode and the cathode. The capacitor further comprises an electro-mechanical connection, which comprises a hole which extends into the body in the direction of the stack. The hole includes an electrical connector. The electrical connector is in electrical contact with either the anode or the cathode, comprises a compliant element, and is suitable for holding a contact pin. The compliant element is configured to decouple the body from mechanical forces applied to the contact pin. The compliant element reduces mechanical stresses experienced by the body of the capacitor. Also provided is a capacitor assembly comprising two or more such capacitors; a kit for assembling such capacitors, and the use of an electrical termination to protect a capacitor from stress.

A capacitor comprises a body of dielectric material in which an anode and a cathode are arranged in a stack. A capacitance-forming layer of the dielectric material is arranged between the anode and the cathode. The capacitor further comprises an electro-mechanical connection, which comprises a hole which extends into the body in the direction of the stack. The hole includes an electrical connector. The electrical connector is in electrical contact with either the anode or the cathode, comprises a compliant element, and is suitable for holding a contact pin. The compliant element is configured to decouple the body from mechanical forces applied to the contact pin. The compliant element reduces mechanical stresses experienced by the body of the capacitor. Also provided is a capacitor assembly comprising two or more such capacitors; a kit for assembling such capacitors, and the use of an electrical termination to protect a capacitor from stress.