A film capacitor that includes a resin layer which has a first surface and a second surface and in which there are particles on at least one of the first surface and the second surface; and a metal layer on the first surface of the resin layer, wherein there are more particles in number on the at least one of the first surface and the second surface of the resin layer than inside the resin layer.

A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.

The present invention relates to the urea of micro- and nanoelectronics and relates to ultra-compact micro capacitors, how they can he used, for example, in electrical and electronic devices. The object of the present invention consists in specifying an ultra-compact micro capacitor with the highest capacity. The problem is solved by an ultra-compact micro capacitor which is made from a rolled-up layer stack of alternatingly arranged layers of dielectric and/or electrically insulating and electrically conductive materials with rolled-up lengths of the layer stack of at least 1 mm, and an absolute electrical storage capacity of at least 10 nF. The problem is additionally solved by a method, in which a layer containing a water-soluble cellulose derivative is applied to a substrate and a layer stack to same, the layer containing the cellulose derivative is removed from the substrate using Nuttier, an organic solvent and/or an organic solvent mixture, and the layer stack is rolled up with a rolling speed of more than 0.1 mm/min.

A conductive paste that includes conductive particles and a solvent. The solvent has a Hansen solubility parameter with an SP value of 24 to 39, a hydrogen bond term δh of 15 or more, and a polarity term δp of 7 or more. The conductive paste is applied to an unfired laminated body having laminated ceramic green sheets and internal electrode layers.

A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes, a first external electrode connected to the first internal electrode, and a second external electrode connected to the second internal electrode. The ceramic body includes a capacitance formation portion having first and a second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, the ceramic body including a first margin portion disposed on the third and fifth surfaces and a second margin portion disposed on the fourth and sixth surfaces.

Transfer films, articles made therewith, and methods of making and using transfer films to form an electrical stack are disclosed. The transfer films (100) may include a plurality of co-extensive electrical protolayers (22, 23, 24) forming an electrical protolayer stack (20), at least selected or each electrical protolayer independently comprising at least 25 wt % sacrificial material and a thermally stable material and having a uniform thickness of less than 25 micrometers. The transfer films may include a plurality of co-extensive electrical protolayers forming an electrical protolayer stack, at least selected or each protolayer independently exhibiting a complex viscosity of between 10.sup.3 and 10.sup.4 Poise at a shear rate of 100/s when heated to a temperature between its Tg and T.sub.dec.

A multi-layer ceramic capacitor includes a multi-layer unit, a side margin, and a bonding unit. The multi-layer unit includes ceramic layers and internal electrodes. The ceramic layers are made of first ceramics and laminated in a first direction, the first ceramics having a first average crystal grain diameter. The internal electrodes are disposed between the ceramic layers. The side margin is made of second ceramics and covers the multi-layer unit from a second direction orthogonal to the first direction, the second ceramics having a second average crystal grain diameter. The bonding unit is made of third ceramics and disposed between the multi-layer unit and the side margin, the third ceramics having a third average crystal grain diameter that is larger than the first average crystal grain diameter and the second average crystal grain diameter.

High energy density multi-layer capacitors comprise inner electrodes buried within thin layers of alkali-free glass. The multi-layer glass capacitor can be fabricated by heating a plurality of capacitor layers above the annealing temperature of the glass to thermal bond the layers together. The edge margin of the buried electrodes can be selected to provide an adequate protection level from high-voltage flashover of the multi-layer glass capacitor. For example, an edge margin of 0.125″ can hold off about 10 kV in air.

In an electronic component, a first outer electrode includes a first conductive layer provided on a first end surface. A second outer electrode includes a second conductive layer provided on a second end surface. A first inner electrode passes through the first conductive layer. A second inner electrode passes through the second conductive layer.

A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes, a first external electrode connected to the first internal electrode, and a second external electrode connected to the second internal electrode. The ceramic body includes a capacitance formation portion having first and a second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, the ceramic body including a first margin portion disposed on the third and fifth surfaces and a second margin portion disposed on the fourth and sixth surfaces.