The present disclosure relates to a condenser bushing including a condenser core and electrically conductive field-grading layers, which are embedded in insulating material of the condenser core and arranged around a central channel for conductor extending along an axis defining an axial direction, while an electric connection is provided to at least one of the field-grading layers, wherein pairs of neighbouring field-grading layers with the insulation material between them form sections of the condenser core of axial lengths L.sub.1 through L.sub.n and with capacitances C.sub.1 through C.sub.n, characterized in that a shape of at least one of the field-grading layers deviates from cylindricality in order to reduce non-uniformity of electric field stress of the condenser bushing compared to a corresponding condenser bushing with the cylindrical field-grading layers forming sections of the axial lengths L.sub.1 through L.sub.n and with capacitances C.sub.1 through C.sub.n.

A trench capacitor manufacturing method is provided. The method includes forming a deep trench in a wafer, forming a trench capacitor structure including a plurality of dielectric films and a plurality of conductive layers in the deep trench; determining if the wafer has a tensile stress based on the forming of the trench capacitor structure; performing a high temperature heat treatment to the trench capacitor structure to change a form of the wafer to a direction that offsets the tensile stress; forming an inter-layer insulating film on the trench capacitor structure; and forming a metal interconnect on the inter-layer insulating film.

A trench capacitor manufacturing method is provided. The method includes forming a deep trench in a wafer, forming a trench capacitor structure including a plurality of dielectric films and a plurality of conductive layers in the deep trench; determining if the wafer has a tensile stress based on the forming of the trench capacitor structure; performing a high temperature heat treatment to the trench capacitor structure to change a form of the wafer to a direction that offsets the tensile stress; forming an inter-layer insulating film on the trench capacitor structure; and forming a metal interconnect on the inter-layer insulating film.

An AIMD includes a conductive housing, an electrically conductive ferrule with an insulator hermetically sealing the ferrule opening. A conductive pathway is hermetically sealed and disposed through the insulator. A filter capacitor is disposed on a circuit board within the housing and has a dielectric body supporting at least two active and two ground electrode plates interleaved, wherein the at least two active electrode plates are electrically connected to the conductive pathway on the device side, and the at least two ground electrode plates are electrically coupled to either the ferrule and/or the conductive housing. The dielectric body has a dielectric constant less than 1000 and a capacitance of between 10 and 20,000 picofarads. The filter capacitor is configured for EMI filtering of MRI high RF pulsed power by a low ESR, wherein the ESR of the filter capacitor at an MRI RF pulsed frequency or range of frequencies is less than 2.0 ohms.

An AIMD includes a conductive housing, an electrically conductive ferrule with an insulator hermetically sealing the ferrule opening. A conductive pathway is hermetically sealed and disposed through the insulator. A filter capacitor is disposed on a circuit board within the housing and has a dielectric body supporting at least two active and two ground electrode plates interleaved, wherein the at least two active electrode plates are electrically connected to the conductive pathway on the device side, and the at least two ground electrode plates are electrically coupled to either the ferrule and/or the conductive housing. The dielectric body has a dielectric constant less than 1000 and a capacitance of between 10 and 20,000 picofarads. The filter capacitor is configured for EMI filtering of MRI high RF pulsed power by a low ESR, wherein the ESR of the filter capacitor at an MRI RF pulsed frequency or range of frequencies is less than 2.0 ohms.

An EMI filtering, coaxial power connector may be formed as an inline component or a port of a device. The connector may have dimensions to accept F-type coaxial connectors. The connector includes a conductive outer shell with a first opening and a second opening. A dielectric member is disposed within the shell. A conductive pin is supported by the dielectric member. A feed-through capacitor has a central opening and a first lead formed within the central opening. The pin is electrically connected to the first lead. A second lead of the capacitor is formed at an outer perimeter of the capacitor and is electrically connected to the shell. A metal plate is mounted within the shell. The plate is disk-shaped with a central hole. An outer perimeter of the plate is in electrical contact with the shell. The pin passes through the central hole without making electrical contact with the plate, and the plate resides between the second opening of the shell and the capacitor.

An EMI filtering, coaxial power connector may be formed as an inline component or a port of a device. The connector may have dimensions to accept F-type coaxial connectors. The connector includes a conductive outer shell with a first opening and a second opening. A dielectric member is disposed within the shell. A conductive pin is supported by the dielectric member. A feed-through capacitor has a central opening and a first lead formed within the central opening. The pin is electrically connected to the first lead. A second lead of the capacitor is formed at an outer perimeter of the capacitor and is electrically connected to the shell. A metal plate is mounted within the shell. The plate is disk-shaped with a central hole. An outer perimeter of the plate is in electrical contact with the shell. The pin passes through the central hole without making electrical contact with the plate, and the plate resides between the second opening of the shell and the capacitor.

A double-sided copper-clad laminate that includes an adhesive layer and a copper foil in order on each of both surfaces of a resin film, the resin film is in a cured state at 25° C., and each of the copper foils has a maximum peak height Sp of 0.05 μm or more and 3.3 μm or less as measured in accordance with ISO 25178 on a surface on a side being in contact with the adhesive layer.

A feedthrough component includes a feedthrough ferrule including a ferrule body extending from a proximal end to a distal end along a longitudinal axis of the feedthrough ferrule and a ferrule passageway extending through the ferrule body and defined by a plurality of sidewalls. The ferrule passageway includes a proximal passage portion defined by one or more proximal sidewalls of the plurality of sidewalls and extending along the longitudinal axis, a distal passage portion defined by one or more distal sidewalls and extending along the longitudinal axis, and a beveled ledge disposed between the proximal passage portion and the distal passage portion and extending from the one or more distal sidewalls toward the longitudinal axis of the feedthrough ferrule. The beveled ledge includes a beveled surface extending toward the longitudinal axis, where a normal to the beveled surface intersects the longitudinal axis.

A feedthrough component includes a feedthrough ferrule including a ferrule body extending from a proximal end to a distal end along a longitudinal axis of the feedthrough ferrule and a ferrule passageway extending through the ferrule body and defined by a plurality of sidewalls. The ferrule passageway includes a proximal passage portion defined by one or more proximal sidewalls of the plurality of sidewalls and extending along the longitudinal axis, a distal passage portion defined by one or more distal sidewalls and extending along the longitudinal axis, and a beveled ledge disposed between the proximal passage portion and the distal passage portion and extending from the one or more distal sidewalls toward the longitudinal axis of the feedthrough ferrule. The beveled ledge includes a beveled surface extending toward the longitudinal axis, where a normal to the beveled surface intersects the longitudinal axis.