An active metamaterial array of the present disclosure includes: a substrate; a plurality of metamaterial structures disposed on the substrate and spaced apart from each other; a conductivity variable material layer formed between each of the plurality of the metamaterial structures so as to selectively connect the metamaterial structures; an electrolyte material layer formed on the metamaterial structures and the conductivity variable material layer; and a gate electrode disposed at one end of the substrate so as to be in contact with one region of the electrolyte material layer, and when an external voltage is applied to the gate electrode, the gate electrode changes the conductivity of the conductivity variable material layer by controlling the migration of ions contained in the electrolyte material layer.

A capacitor provides a plurality of selectable capacitance values, by selective connection of six capacitor sections of a capacitive element each having a capacitance value. The capacitor sections are provided in a plurality of wound cylindrical capacitive elements. Two vertically stacked wound cylindrical capacitance elements may each provide three capacitor sections. There may be six separately wound cylindrical capacitive elements each providing a capacitor section. The capacitor sections have a common element terminal.

A capacitor provides a plurality of selectable capacitance values, by selective connection of six capacitor sections of a capacitive element each having a capacitance value. The capacitor sections are provided in a plurality of wound cylindrical capacitive elements. Two vertically stacked wound cylindrical capacitance elements may each provide three capacitor sections. There may be six separately wound cylindrical capacitive elements each providing a capacitor section. The capacitor sections have a common element terminal.

An MEMS structure-based adjustable capacitor is provided, comprising: a lower plate A, a movable plate B, an upper plate C, a fixed apparatus D and one or more connecting conductors E; a lower end of the fixed apparatus D is fixedly connected to the lower plate A, an upper end of the fixed apparatus D is fixedly connected to the upper plate C, a structure B4 is provided at a middle part of movable plate B, and the movable plate B is able to move up and down along the fixed apparatus D; the lower plate A is provided with a lower electrode A1, and the movable plate B is provided with a movable electrode B1 and adjustment electrodes B2; the lower electrode A1 and the movable electrode B1 constitute a unit capacitor; and the upper plate C is provided with an upper electrode C1 and adjustment electrodes C2.

An MEMS structure-based adjustable capacitor is provided, comprising: a lower plate A, a movable plate B, an upper plate C, a fixed apparatus D and one or more connecting conductors E; a lower end of the fixed apparatus D is fixedly connected to the lower plate A, an upper end of the fixed apparatus D is fixedly connected to the upper plate C, a structure B4 is provided at a middle part of movable plate B, and the movable plate B is able to move up and down along the fixed apparatus D; the lower plate A is provided with a lower electrode A1, and the movable plate B is provided with a movable electrode B1 and adjustment electrodes B2; the lower electrode A1 and the movable electrode B1 constitute a unit capacitor; and the upper plate C is provided with an upper electrode C1 and adjustment electrodes C2.

The present disclosure relates to an apparatus comprising at least one sensing capacitor and a controller, wherein the controller is configured to receive a signal from the at least one sensing capacitor indicative of a change of charge of the sensing capacitor, and wherein the controller is configured to determine an amount of force applied to the sensing capacitor, an acceleration of the sensing capacitor, a torsion of the sensing capacitor, a vibration of the sensing capacitor or a pulling force applied to the sensing capacitor based on the change of charge of the at least one sensing capacitor.

A packaged RF transistor device includes an RF transistor die including a plurality of RF transistor cells, an RF input lead coupled to the plurality of RF transistor cells, an RF output lead, and an output matching network coupled between the plurality of RF transistor cells and the RF output lead. The output matching network includes a plurality of capacitors having respective upper capacitor plates, wherein the upper capacitor plates of the capacitors are coupled to output terminals of respective ones of the RF transistor cells. The plurality of capacitors may be provided as a capacitor block that includes a common reference capacitor plate and a dielectric layer on the reference capacitor plate. The upper capacitor plates may be on the dielectric layer.

A packaged RF transistor device includes an RF transistor die including a plurality of RF transistor cells, an RF input lead coupled to the plurality of RF transistor cells, an RF output lead, and an output matching network coupled between the plurality of RF transistor cells and the RF output lead. The output matching network includes a plurality of capacitors having respective upper capacitor plates, wherein the upper capacitor plates of the capacitors are coupled to output terminals of respective ones of the RF transistor cells. The plurality of capacitors may be provided as a capacitor block that includes a common reference capacitor plate and a dielectric layer on the reference capacitor plate. The upper capacitor plates may be on the dielectric layer.

A vacuum variable capacitor includes a pre-vacuum enclosure for reducing a pressure differential across the bellows, wherein a drive is disposed outside the enclosures of the vacuum variable capacitor. The vacuum force load on the drive system can thereby be reduced, allowing faster movement of the movable electrode, faster capacitance adjustment of the vacuum variable capacitor and longer lifetimes of the device.

A vacuum variable capacitor includes a pre-vacuum enclosure for reducing a pressure differential across the bellows, wherein a drive is disposed outside the enclosures of the vacuum variable capacitor. The vacuum force load on the drive system can thereby be reduced, allowing faster movement of the movable electrode, faster capacitance adjustment of the vacuum variable capacitor and longer lifetimes of the device.