A carrier includes first and second container portions that are assembled together to provide a structure the supports and retains a capacitor. The first container portion and the second container portion are assembled together in a configuration in which the edges of the first wall structures face corresponding ones of the edges of the second wall structures, and the edges of the first wall structures are overlapping with respect to the corresponding ones of the edges of the second wall structures when the carrier is viewed in side view.

A carrier includes first and second container portions that are assembled together to provide a structure the supports and retains a capacitor. The first container portion and the second container portion are assembled together in a configuration in which the edges of the first wall structures face corresponding ones of the edges of the second wall structures, and the edges of the first wall structures are overlapping with respect to the corresponding ones of the edges of the second wall structures when the carrier is viewed in side view.

An electrolytic capacitor that includes a resin molding that includes a capacitor element including an anode, a dielectric layer, and a cathode, a sealing resin sealing the capacitor element; a first external electrode on a first end surface of the resin molding; and a second external electrode on a second end surface and connected to the cathode exposed at the second end surface of the resin molding, wherein when viewed in a thickness direction perpendicular to the length direction, the anode includes a first anode region having a first outer edge exposed at the first end surface and connected to the first external electrode, and a second anode region having a second outer edge positioned closest to the second external electrode in the length direction, and a length of the first outer edge is greater than a length of the second outer edge in a width direction.

A negative-pressure packaging method for aluminum electrolytic capacitors including: penetratedly arranging a capacitor element in a seal; placing the capacitor element, the seal and a case at an inner chamber of an accommodating mechanism; sealing the accommodating mechanism; vacuumizing the accommodating mechanism to allow the inner chamber to be in a negative pressure state; subjecting the seal and the case to packaging, such that the seal is located at a first depth of the case; and subjecting the seal and the case to pressing, such that the seal is located at a second depth of the case, where the second depth is closer to a bottom of the case with respect to the first depth.

Some embodiments of the present disclosure relate to a device comprising: a capacitor and at least one encapsulant. In some embodiments, the at least one encapsulant comprises at least one polymer. In some embodiments, the at least one encapsulant at least partially encapsulates the capacitor. In some embodiments, the at least one encapsulant has a stable Young's modulus. Some embodiments of the present disclosure further relate to methods of manufacturing and using the device described herein. In the examples the at least one polymer is a PVDF.

A capacitor and a method for manufacturing the capacitor are provided. The capacitor comprises (1) a capacitor main body including an outer package case, an opening sealing member attached to an inside of an open portion of the outer package case and a terminal lead penetrating through the opening sealing member; (2) a base attached to an outside of the open portion of the outer package case, the base including an insertion through hole through which the terminal lead passes to be disposed on an outer side of the base; and (3) a resin layer between the base and the opening sealing member.

A capacitor and a method for manufacturing the capacitor are provided. The capacitor comprises (1) a capacitor main body including an outer package case, an opening sealing member attached to an inside of an open portion of the outer package case and a terminal lead penetrating through the opening sealing member; (2) a base attached to an outside of the open portion of the outer package case, the base including an insertion through hole through which the terminal lead passes to be disposed on an outer side of the base; and (3) a resin layer between the base and the opening sealing member.

A solid electrolytic capacitor that includes: a capacitor element including an anode body connected to an anode lead, a dielectric layer on a surface of the anode body, and a cathode layer opposite to the anode body via the dielectric layer; an exterior resin covering the capacitor element; a first external electrode terminal on a first outer surface of the exterior resin and electrically connected to the anode body; a second external electrode terminal on a second outer surface of the exterior resin and electrically connected to the cathode layer; and a resin layer having a lower filler content than the exterior resin and covering at least a portion of an outer periphery of the anode lead between the first outer surface of the exterior resin and the anode body.

A solid electrolytic capacitor that includes: a capacitor element including an anode body connected to an anode lead, a dielectric layer on a surface of the anode body, and a cathode layer opposite to the anode body via the dielectric layer; an exterior resin covering the capacitor element; a first external electrode terminal on a first outer surface of the exterior resin and electrically connected to the anode body; a second external electrode terminal on a second outer surface of the exterior resin and electrically connected to the cathode layer; and a resin layer having a lower filler content than the exterior resin and covering at least a portion of an outer periphery of the anode lead between the first outer surface of the exterior resin and the anode body.

An electrolytic capacitor that includes: a cuboid resin molded body having a first end surface and a second end surface opposite to each other; a first external electrode on the first end surface and electrically connected to an exposed end of an anode; and a second external electrode on the second end surface and electrically connected to an exposed end of a cathode, wherein at least one of the first and second external electrodes has a multilayer structure including: an inner plating layer; and a resin electrode layer on the inner plating layer and containing a resin component and at least one metal selected from Ni, Cu, and Ag, and a total number of layers defining each of the first and second external electrodes is four or less.