A DC high-voltage relay with at least one contact pair including a movable contact and a fixed contact, the contact pair having a contact force and/or an opening force of 100 gf or more, having a rated voltage of 48 V or more, the movable contact and/or the fixed contact includes a Ag oxide-based contact material. Metal components contain at least one metal M essentially containing Zn, and a balance being Ag and inevitable impurity metals, and the contact material has a content of the metal M of 0.2% by mass or more and 8% by mass or less based on a total mass. The contact material has a material structure in which one or more oxides of the metal M having an average particle size of 0.01 μm or more and 0.4 μm or less are dispersed in a matrix including Ag or a Ag alloy.

The sintered electrical contact material described in this specification includes at least one salt dispersed within a silver matrix, and no more than 100 ppm of cadmium and cadmium compounds. The sintered electrical contact material exhibit contact resistances much lower than than commercially available silver composites. The salts dispersed within the silver matrix represent a new class of additives for silver composites for high and low current applications.

The sintered electrical contact material described in this specification includes at least one salt dispersed within a silver matrix, and no more than 100 ppm of cadmium and cadmium compounds. The sintered electrical contact material exhibit contact resistances much lower than than commercially available silver composites. The salts dispersed within the silver matrix represent a new class of additives for silver composites for high and low current applications.

A layered structure for forming charging terminals for high power applications. In some embodiments, the layered structure may include a substrate and a contact layer disposed over at least a portion of the substrate. The substrate may have a conductivity greater than 40% International Annealed Copper Standard (IACS). The contact layer may demonstrate a coefficient of friction of less than 1.4, such as from 0.1 to 1.4, as measured in accordance with American Society of Testing and Materials (ASTM) G99-17. The contact layer may include a precious-metal-based alloy, such as a silver-samarium alloy.

The present invention relates to an electric switch with rubbing contact (3) comprising on the one hand at least one fixed contact (9) and on the other hand at least one moving rubbing contact (3) that can move along a predefined trajectory and exhibiting a contact surface (10) intended to rub on said at least one fixed contact (9), characterized in that at least said contact surface (10) is treated by ion bombardment by virtue of an ion beam, and in that the fixed (9) and moving (3) contacts are bare.

The present invention relates to an electric switch with rubbing contact (3) comprising on the one hand at least one fixed contact (9) and on the other hand at least one moving rubbing contact (3) that can move along a predefined trajectory and exhibiting a contact surface (10) intended to rub on said at least one fixed contact (9), characterized in that at least said contact surface (10) is treated by ion bombardment by virtue of an ion beam, and in that the fixed (9) and moving (3) contacts are bare.

Provided is a tape-shaped contact member including a tape-shaped contact material. At least one wire-shaped brazing material is bonded to the tape-shaped contact material, at least one projection including the brazing material and protruding from a surface of the contact material is formed in a cross-sectional shape, a diffusion region containing a metal component forming the brazing material is formed along an interface with the brazing material inside the contact material, and the diffusion region has a thickness of 2 μm or more and 10 μm or less. A chip-shaped contact component can be obtained by cutting the tape-shaped contact member to an arbitrary length. The present contact component is useful as a constituent member for a switching electrical contact, and capable of adapting to height reduction of the electrical contact. The present invention can also contribute to reduction of occurrence of poor bonding.

There are provided a composite plated product wherein a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material and wherein the amount of the carbon particles dropped out of the composite plating film is small, and a method for producing the same. After a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material (of preferably copper or a copper alloy) by electroplating using a silver-plating solution to which the carbon particles are added, a treatment for removing part of the carbon particles on the surface thereof is carried out.

There are provided a composite plated product wherein a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material and wherein the amount of the carbon particles dropped out of the composite plating film is small, and a method for producing the same. After a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material (of preferably copper or a copper alloy) by electroplating using a silver-plating solution to which the carbon particles are added, a treatment for removing part of the carbon particles on the surface thereof is carried out.

A contact material mainly composed of an Ag alloy, includes: an Ag alloy; and at least one main additive existing as a phase different from the Ag alloy and selected from the group consisting of tin oxide, nickel, nickel oxide, iron, iron oxide, tungsten, tungsten carbide, tungsten oxide, zinc oxide, and carbon, wherein when a metal atom constituting the main additive or the main additive is carbon, the Ag alloy contains a solid solution element having a vacancy binding energy lower than a vacancy binding energy that is a binding energy between the metal atom included in the main additive and a vacancy in an Ag metal, or a binding energy between carbon included in the main additive of carbon and a vacancy in an Ag metal, in an amount of 0.01 wt. % or more.