A keyboard stabilizer is adapted to reduce the clanking and rattling sounds that it makes during operation. The invention takes advantage of the surprising result that adhesive, in proper amounts, can act as a sound dampener. First, a circumferential score is cut near each tip of the wire. Second, adhesive is applied to several critical points on the housings, stems, and wire. Third, lubricant is applied to several critical points on the housings, stems, and wire. The stabilizer is then assembled from the prepared parts.

A keyboard stabilizer is adapted to reduce the clanking and rattling sounds that it makes during operation. The invention takes advantage of the surprising result that adhesive, in proper amounts, can act as a sound dampener. First, a circumferential score is cut near each tip of the wire. Second, adhesive is applied to several critical points on the housings, stems, and wire. Third, lubricant is applied to several critical points on the housings, stems, and wire. The stabilizer is then assembled from the prepared parts.

An example keyboard can include: a base with a midpoint, a first end, and a second end opposite the first end; and a plurality of keys arranged on the base, wherein the plurality of keys is positioned to form a curved shape on the base such that the plurality of keys extend from the midpoint of the base towards a user as the plurality of keys extends towards the first end and the second end of the base.

An example keyboard can include: a base with a midpoint, a first end, and a second end opposite the first end; and a plurality of keys arranged on the base, wherein the plurality of keys is positioned to form a curved shape on the base such that the plurality of keys extend from the midpoint of the base towards a user as the plurality of keys extends towards the first end and the second end of the base.

An electronic device according to an embodiment of the disclosure may include a housing, a key cover that penetrates at least a part of the housing and exposes at least a part of the key cover to an outside, a key button that is disposed inside the key cover and generates a pressing signal when the key button is pressed, a pressure sensor including a plurality of depressurization points between the key cover and the key button, and at least one processor electrically connected to the pressure sensor and the key button, and the at least one processor obtains a pressure signal corresponding to each of the plurality of depressurization points through the pressure sensor, obtains the pressing signal through the key button, and performs a specified operation based on the pressure signal corresponding to each of the obtained depressurization points and the pressing signal.

An electronic device according to an embodiment of the disclosure may include a housing, a key cover that penetrates at least a part of the housing and exposes at least a part of the key cover to an outside, a key button that is disposed inside the key cover and generates a pressing signal when the key button is pressed, a pressure sensor including a plurality of depressurization points between the key cover and the key button, and at least one processor electrically connected to the pressure sensor and the key button, and the at least one processor obtains a pressure signal corresponding to each of the plurality of depressurization points through the pressure sensor, obtains the pressing signal through the key button, and performs a specified operation based on the pressure signal corresponding to each of the obtained depressurization points and the pressing signal.

Electrical input devices can be produced using a multi-material 3D-printing process. The electrical input devices can include a non-conductive material portion and a conductive material portion. The non-conductive and conductive material portions are integrally formed during a single 3D-printing process. Deformation of the electrical input devices cause an electrical variance of the conductive material portion that is responsive to the deformation. Some electrical input devices described provide digital responses, and some electrical input devices described provide analog responses. The described techniques can be used to manufacture complex finished devices in a single 3D-print run, and, in some examples, without the need for post-processing or assembly.

A transparent keycap manufacturing method includes adhering an opaque base to a fixing film, performing a laser engraving process or an etching process on a bottom surface of the opaque base to generate a continuous hollow pattern region and a pattern component surrounded by the continuous hollow pattern region, coating transparent glue on the bottom surface of the opaque base to fill the continuous hollow pattern region with the transparent glue, adhering a transparent base to the bottom surface of the opaque base, and removing the fixing film from the opaque base.

A transparent keycap manufacturing method includes adhering an opaque base to a fixing film, performing a laser engraving process or an etching process on a bottom surface of the opaque base to generate a continuous hollow pattern region and a pattern component surrounded by the continuous hollow pattern region, coating transparent glue on the bottom surface of the opaque base to fill the continuous hollow pattern region with the transparent glue, adhering a transparent base to the bottom surface of the opaque base, and removing the fixing film from the opaque base.

A switch cap for a switch device that can reduce a pressing error of a switch is provided. A three-dimensional first cap main body moves by a force applied to a first abutting portion from a finger which is an operator. A first sensor is disposed in the first cap main body, and detects abutting or approach of the finger to the first abutting portion. A first transmission member is fixed to the inside of the first cap main body, and moves together with the first cap main body for first switching to transmit movement of the first cap main body to a push button which is a predetermined location of a switch device. A first sensor is formed in a flexible printed circuit board (FPC) disposed in the first cap main body, and the FPC is fixed by the first transmission member and the first cap main body.