H01H2037/525

Circuit breaker heater-bimetal assembly, heater-bimetal apparatus, and assembly methods thereof
09779900 · 2017-10-03 · ·

A heater-bimetal apparatus is disclosed. The heater-bimetal apparatus has a heating element having a first portion and a second portion, a bimetal element coupled to the heating element at a third portion between the first and second portions, and a support member coupled to the heating element at the third portion, the support member including registration surfaces adapted to be received in pockets formed in spaced portions of circuit breaker housing. Assemblies including the heater-bimetal apparatus and methods of assembly of heater-bimetal assemblies are provided, as are other aspects.

MANUFACTURE METHOD OF A CONCAVE DISC-SHAPED STRUCTURE OF BIMETAL STRIP
20220139652 · 2022-05-05 ·

A manufacture method of a concave disc-shaped structure of bimetal strip, particularly to one that is a coaxial positioning method of the guide hole which having elastic disc-shape structure bimetal strips not affected by external stress, which having a bimetal structure which outer edge will not be damaged and does not affect by stress while inner edge pulling closed to the outer edge, it includes: a bimetal strip, a lug, and an assembling jig, having two displaceable positioning holes, and use the guiding surface to make the two positioning holes gradually turn inside to condense to the combining surface of the lugs, so as to achieve the purpose of accurate positioning and combination.

TEMPERATURE-DEPENDENT SWITCHING MECHANISM, TEMPERATURE-DEPENDENT SWITCH, AND METHOD OF MANUFACTURING THE SAME
20240029974 · 2024-01-25 ·

A temperature-dependent switching mechanism for a temperature-dependent switch, having: a temperature-dependent bimetal snap-action disc having a first through hole; a temperature independent snap-action spring disc having a second through hole; and an electrically conductive contact member including a main body that passes through the first through hole and the second through hole. The contact member includes a support shoulder projecting radially from the main body, a first locking element projecting radially from the main body and arranged on a first side of the support shoulder, and a second locking element projecting radially from the main body and arranged on a second side of the support shoulder opposite the first side. The temperature-dependent bimetal snap-action disc and the snap-action spring disc are arranged between the locking elements and the support shoulder and are each held captive, but with clearance, by these on the main body of the contact member.

Overload release, in particular for a circuit breaker
10529514 · 2020-01-07 · ·

An overload release is disclosed, in particular for a circuit breaker, including a metal strip which is made of at least two different types of metal and around which a heat conductor is wound, wherein an electrical insulator is arranged between the metal strip and the heat conductor. In an embodiment, the heat conductor is welded onto the metal strip by way of arc welding.

CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF
20240064901 · 2024-02-22 · ·

This disclosure provides a circuit board assembly and a manufacturing method thereof. The circuit board assembly includes circuit board, embedded chip, heat dissipation assembly and temperature switch structure. The temperature switch structure includes a first metal layer and a second metal layer stacked on each other. The first metal layer of the temperature switch structure is electrically connected to the circuit board and is thermally coupled to the embedded chip. A thermal expansion coefficient of the first metal layer is different from a thermal expansion coefficient of the second metal layer so that the temperature switch structure is deformed in response to a temperature change of the embedded chip to be in contact with or spaced apart from the second electrically conductive contact of the heat dissipation assembly.

DISSIMILAR METAL JOINED MATERIAL AND METHOD OF MANUFACTURING SAME
20190337086 · 2019-11-07 · ·

An object of the present invention is to provide a dissimilar metal joined material that has corrosion resistance that can prolong life resulting from corrosion and has a small difference from original characteristics. There is provided a dissimilar metal joined material including: a clad material including a high thermal expansion layer composed of an alloy containing Mn, and a low thermal expansion layer composed of an alloy containing Ni, the low thermal expansion layer being joined directly to the high thermal expansion layer or via an intermediate layer; and a corrosion resistant plating layer provided on at least a surface of the high thermal expansion layer, the corrosion resistant plating layer having a thickness of 10 nm to 120 nm.

Thermally actuated switch and forming dies
10347450 · 2019-07-09 · ·

This invention is a thermally actuated switch in which a sealed vessel contains a fixed contact and a heat-sensitive-plate assembly that has a structure in which a movable contact is anchored to one lengthwise end of a heat-sensitive plate, one end of a metal support is anchored to the other end of said heat-sensitive plate, and the heat-sensitive plate is then drawn. The heat-sensitive-plate assembly has a dish-shaped drawn section near the middle of the heat-sensitive plate and has folded sections between the area where the movable contact is anchored and the widthwise edges of the heat-sensitive plate and also between the area where the metal support is anchored and the widthwise edges of the heat-sensitive plate.

TEMPERATURE-DEPENDENT SWITCH AND METHOD OF MANUFACTURING THE SAME
20240258051 · 2024-08-01 ·

A temperature-dependent switch having a first external terminal, a second external terminal and a temperature-dependent switching mechanism. The temperature-dependent switching mechanism comprises a temperature-dependent switching element which is configured to change its geometric shape as a function of its temperature in order to switch the switching mechanism between a closed position, in which the switching mechanism establishes an electrically conductive connection between the first external terminal and the second external terminal, and an open position, in which the switching mechanism disconnects the electrically conductive connection. The temperature-dependent switching mechanism comprises a spring element which is permanently electrically and mechanically connected in series to the temperature-dependent switching element. The temperature-dependent switching mechanism also comprises a connecting component, which is arranged between the spring element and the temperature-dependent switching element and is attached to the spring element and the temperature-dependent switching element.

Manufacture method of a concave disc-shaped structure of bimetal strip
12148587 · 2024-11-19 ·

A manufacture method of a concave disc-shaped structure of bimetal strip, particularly to one that is a coaxial positioning method of the guide hole which having elastic disc-shape structure bimetal strips not affected by external stress, which having a bimetal structure which outer edge will not be damaged and does not affect by stress while inner edge pulling closed to the outer edge, it includes: a bimetal strip, a lug, and an assembling jig, having two displaceable positioning holes, and use the guiding surface to make the two positioning holes gradually turn inside to condense to the combining surface of the lugs, so as to achieve the purpose of accurate positioning and combination.

Circuit board assembly and manufacturing method thereof
12324100 · 2025-06-03 · ·

This disclosure provides a circuit board assembly and a manufacturing method thereof. The circuit board assembly includes circuit board, embedded chip, heat dissipation assembly and temperature switch structure. The temperature switch structure includes a first metal layer and a second metal layer stacked on each other. The first metal layer of the temperature switch structure is electrically connected to the circuit board and is thermally coupled to the embedded chip. A thermal expansion coefficient of the first metal layer is different from a thermal expansion coefficient of the second metal layer so that the temperature switch structure is deformed in response to a temperature change of the embedded chip to be in contact with or spaced apart from the second electrically conductive contact of the heat dissipation assembly.