H01H2229/036

Mirror feature in devices

Various processes for creating mirrored features are discussed herein as well as devices that include the mirrored features. One embodiment includes a button having a transparent layer and an opaque layer coupled to the transparent layer. A portion of the transparent layer extends through the opaque layer so that the portion of the transparent layer is flush with a back surface of the opaque layer and generally has a shape of a desired feature. The button also includes a reflective object positioned so that it may be seen through the transparent layer.

Dome switch stack and method for making the same
09793070 · 2017-10-17 · ·

Systems and methods for providing input component assemblies for dome switches are provided. In some embodiments, an input component assembly may include a first conductive contact pad coupled to a first board of a switch, a second conductive contact pad coupled to a second board of the switch, and a layer of conductive adhesive between the first conductive pad and the second conductive pad, where the layer is operative to provide a seal for the switch.

Dome switch stack and method for making the same
09786449 · 2017-10-10 · ·

Systems and methods for providing input component assemblies for dome switches are provided. In some embodiments, an input component assembly may include a contact area coupled to a circuit board for a switch, a conductive covering for enclosing the circuit board, and a dome positioned over the conductive covering, where the dome is operative to close at least one circuit of the switch when the dome is depressed towards the conductive covering.

PUSH SWITCH
20220165516 · 2022-05-26 ·

A push switch includes a case, a fixed contact member, a moving contact member, a first protective sheet, and a second protective sheet. The case has a first surface with a recess opened and a second surface opposite from the first surface. The fixed contact member includes a fixed contact in the recess and a terminal on an outer surface of the case. The moving contact member is in the recess and includes a moving contact to contact with the fixed contact through a press operation. The first protective sheet is provided for the first surface to cover the recess. The second protective sheet covers the second surface. The first protective sheet is welded to the first surface with a first welded portion surrounding an entire circumference of the recess. The second protective sheet is welded to the second surface with a second welded portion.

Electric Device Comprising A Sealed Housing Having a Lower Housing Part and an Upper Housing Part

An electric device includes an electric component and a housing having a lower housing part and an upper housing part. The electric component is supported on the lower housing part. The lower housing part and the upper housing part surround a housing volume in which the electric component is sealingly encased. A weld is formed between the upper housing part and the lower housing part. One of the lower housing part and the upper housing part has a protrusion welded to the other one of the lower housing part and the upper housing part. A gap is disposed between the lower housing part and the upper housing part, the gap extending radially from the protrusion to an outside of the housing. A solidified molten material from the weld is at least partially received in the gap.

Membrane circuit board and manufacturing method thereof

A membrane circuit board includes a first film substrate, a second film substrate, an insulating spacer substrate and a waterproof structure. The first circuit layer is installed on the first film substrate. A second circuit layer is installed on the second film substrate. The insulating spacer substrate arranged between the first film substrate and the second film substrate. The first circuit layer is arranged between the first film substrate and the insulating spacer substrate. The second circuit layer is arranged between the second film substrate and the insulating spacer substrate. The waterproof structure includes a first welding layer and a second welding layer. The first welding layer is arranged between the first film substrate and the insulating spacer substrate. The second welding layer is arranged between the second film substrate and the insulating spacer substrate.

ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME

An electronic component includes a housing and a cover. The housing includes a concave portion accommodating therein elements. The cover covers the concave portion. A laser-welded portion including a discontinuous portion is provided along a circumference of the concave portion of the housing and fixes the cover to the housing.

ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME

A housing includes a concave portion in which components are to be accommodated. A cover covers the concave portion. A first laser-welded portion is provided along a circumference of the concave portion of the housing and fixes the cover to the housing. The cover includes an opening positioned inside of the first laser-welded portion and corresponding to a part of the circumference of the concave portion of the housing.

MEMBRANE CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

A membrane circuit board includes a first film substrate, a second film substrate, an insulating spacer substrate and a waterproof structure. The first circuit layer is installed on the first film substrate. A second circuit layer is installed on the second film substrate. The insulating spacer substrate arranged between the first film substrate and the second film substrate. The first circuit layer is arranged between the first film substrate and the insulating spacer substrate. The second circuit layer is arranged between the second film substrate and the insulating spacer substrate. The waterproof structure includes a first welding layer and a second welding layer. The first welding layer is arranged between the first film substrate and the insulating spacer substrate. The second welding layer is arranged between the second film substrate and the insulating spacer substrate.

Switch body

The switch body includes: a wiring substrate where first to fourth fixed contact members are formed; and a movable contact member including a pressure receiving part opposite from the second fixed contact member, a first outer edge facing the first fixed contact member, and a second outer edge facing the third fixed contact member. The fourth fixed contact member is formed in a region outside a projection region being a projection of the movable contact member on the wiring substrate and is in a position facing the first outer edge when the second outer edge is moved to a region where the second fixed contact member is formed.