This description relates generally to semiconductor devices. A semiconductor device can include first and second conductive layers that can be positioned over a substrate, and at least one dielectric layer between the first and second conductive layers. The at least one dielectric layer can be positioned over at least a portion of the second conductive layer, and the first conductive layer can be positioned over a portion of the least one dielectric layer. The semiconductor device can further include a third conductive layer that can be positioned over the substrate and can be conductively connected to the second conductive layer and the substrate. The third conductive layer includes a fusible link.

A switch device includes a plurality of lead frames that is conductive and configured to electrically connectable to an external device, a contact-separation mechanism configured to allow the plurality of lead frames to be electrically connected to and separated from each other, and an electric element configured to connect the plurality of lead frames to each other. The electric element is surface-mounted on the lead frames and sealed with resin. In each of the lead frame, the boundary, such as a groove or a notch, is formed along the outer edge of the arrangement position of the electric element.

A switch device includes a plurality of lead frames that is conductive and configured to electrically connectable to an external device, a contact-separation mechanism configured to allow the plurality of lead frames to be electrically connected to and separated from each other, and an electric element configured to connect the plurality of lead frames to each other. The electric element is surface-mounted on the lead frames and sealed with resin. In each of the lead frame, the boundary, such as a groove or a notch, is formed along the outer edge of the arrangement position of the electric element.

A process of manufacturing a heat resistant and low carbon plate for a circuit breaker includes preparing a heat resistant and low carbon plate for a circuit breaker; coating the heat resistant and low carbon plate with organic material; coating the organic material with inorganic material; and heating and drying the heat resistant and low carbon plate. The process continuously grips each of heat resistant and low carbon plates conveyed on a conveyor with a coat application device being used for the coating steps. A circuit breaker having the heat resistant and low carbon plate is also provided.

A process of manufacturing a heat resistant and low carbon plate for a circuit breaker includes preparing a heat resistant and low carbon plate for a circuit breaker; coating the heat resistant and low carbon plate with organic material; coating the organic material with inorganic material; and heating and drying the heat resistant and low carbon plate. The process continuously grips each of heat resistant and low carbon plates conveyed on a conveyor with a coat application device being used for the coating steps. A circuit breaker having the heat resistant and low carbon plate is also provided.

The present application discloses a keyboard, which includes a base plate and a thin film circuit board. The base plate includes a first part, a second part and an inclined part. The first part has a first limiting portion and a second limiting portion, the second part has a third limiting portion. The thin film circuit board includes a first region, a second region and at least one connecting portion. The first region is located on the first part, and the first region has at least one opening. The first limiting portion and the second limiting portion are disposed in said opening. The second region is located on the second part, and the second region has at least one opening. The connecting portion is located on the inclined part, and the third limiting portion is passed through the opening of the second part and propped against the connecting portion.

A keyboard is disclosed, which includes a base plate and a thin film circuit board. The base plate includes a first part, a second part, and an inclined part. Two edges of the inclined part are connected to the first part and the second part, respectively. The inclined part includes a hollow portion. The thin film circuit board is disposed on the base plate and includes a first region, a second region, and a connecting portion. The connecting portion has a first connecting end, a second connecting end, and an inclined segment. The first connecting end is connected to the first region; the second connecting end is connected to the second region. The first connecting end and the second connecting end correspond to different positions on an axial direction. Moreover, part of the inclined segment is located in the hollow portion.

A keyboard is disclosed, which includes a base plate and a thin film circuit board. The base plate includes a first part, a second part, and an inclined part. Two edges of the inclined part are connected to the first part and the second part, respectively. The inclined part includes a hollow portion. The thin film circuit board is disposed on the base plate and includes a first region, a second region, and a connecting portion. The connecting portion has a first connecting end, a second connecting end, and an inclined segment. The first connecting end is connected to the first region; the second connecting end is connected to the second region. The first connecting end and the second connecting end correspond to different positions on an axial direction. Moreover, part of the inclined segment is located in the hollow portion.

The present application discloses a keyboard, which includes a base plate and a thin film circuit board. The base plate includes a first part, a second part and an inclined part. The first part has a first limiting portion and a second limiting portion, the second part has a third limiting portion. The thin film circuit board includes a first region, a second region and at least one connecting portion. The first region is located on the first part, and the first region has at least one opening. The first limiting portion and the second limiting portion are disposed in said opening. The second region is located on the second part, and the second region has at least one opening. The connecting portion is located on the inclined part, and the third limiting portion is passed through the opening of the second part and propped against the connecting portion.

An electronic device and methods including a switch formed in a chip package are shown. An electronic device and methods including a switch formed in a polymer based dielectric are shown. Examples of switches shown include microelectromechanical system (MEMS) structures, such as cantilever switches and/or shunt switches.