Patent classifications
H01H61/01
THERMAL OVERLOAD RELAY
A case has an engagement hole formed in a side surface thereof in the width direction, a cover has a projecting piece formed thereon, the projecting piece projecting toward the case side, and a tip portion of the projecting piece is fitted into the engagement hole from the inside. A reset bar has a recessed portion formed in a preset range extending in the depth direction and the circumferential direction within the outer peripheral surface of the reset bar and, when positioned at either an initial position or an automatic reset position, prevents the tip portion from being pushed inside by having the outer peripheral surface opposed to the back side of the projecting piece. In addition, when positioned at a manual reset position, the reset bar allows the tip portion to be pushed inside by having the recessed portion opposed to the back side of the projecting piece.
BISTABLE SHAPE MEMORY ALLOY INERTIAL ACTUATOR
Bistable shape memory alloy inertial actuator capable of preventing accidental actuation caused by environmental temperature variations, its method of operation and its use in devices.
ELECTRICALLY CONTROLLED SOLID-STATE THERMAL SWITCH
Electrically controlled solid-state thermal switches and methods of controlling heat flow. An electrostrictive material is electromagnetically coupled to first and second electrodes that provide an electric field to the electrostrictive material. Different portions of the electrostrictive material are thermally coupled to each of a heat sink and a thermal load so that heat flowing from one into the other passes through the electrostrictive material. A control voltage is applied to the electrodes to selectively generate the electric field, thereby selectively altering the thermal conductivity of the electrostrictive material. The heat sink and thermal load are thereby selectively thermally coupled to each other in dependance on the control voltage.
ELECTRICALLY CONTROLLED SOLID-STATE THERMAL SWITCH
Electrically controlled solid-state thermal switches and methods of controlling heat flow. An electrostrictive material is electromagnetically coupled to first and second electrodes that provide an electric field to the electrostrictive material. Different portions of the electrostrictive material are thermally coupled to each of a heat sink and a thermal load so that heat flowing from one into the other passes through the electrostrictive material. A control voltage is applied to the electrodes to selectively generate the electric field, thereby selectively altering the thermal conductivity of the electrostrictive material. The heat sink and thermal load are thereby selectively thermally coupled to each other in dependance on the control voltage.
Actuator with shape memory wire
The present invention concerns an electric actuator (A, A′), comprising a rotor member (6) and an actuating assembly (4) configured to interfere with said rotor member (6), causing it to rotate, characterized in that said rotor member (6) comprises a pair of eccentric reliefs (63) arranged so as to interfere with said actuating assembly (4), and in that said actuating assembly (4) comprises a shape memory wire (2), wherein said actuating assembly (4) is configured to cause the rotation of said rotor member (6) when electric current flows through at least a portion of said shape memory wire (2).
Package-integrated bistable switch for electrostatic discharge (ESD) protection
Embodiments may relate to a package substrate that includes a signal line and a ground line. The package substrate may further include a switch communicatively coupled with the ground line. The switch may have an open position where the switch is communicatively decoupled with the signal line, and a closed position where the switch is communicatively coupled with the signal line. Other embodiments may be described or claimed.
Package-integrated bistable switch for electrostatic discharge (ESD) protection
Embodiments may relate to a package substrate that includes a signal line and a ground line. The package substrate may further include a switch communicatively coupled with the ground line. The switch may have an open position where the switch is communicatively decoupled with the signal line, and a closed position where the switch is communicatively coupled with the signal line. Other embodiments may be described or claimed.
Bistable shape memory alloy inertial actuator
Bistable shape memory alloy inertial actuator capable of preventing accidental actuation caused by environmental temperature variations, its method of operation and its use in devices.
CONTROL DEVICES AND METHODS
A flow control device (2) having: an outer wall; a static part (10) enclosed by the outer wall and at least partially defining a fluid path (42); a movable element which is movable relative to the static part (10) and arranged such that movement of the movable element relative to the static part (10) causes the fluidic resistance of the fluid path (42) to change; and an actuator arrangement (30″) arranged such that when energy is supplied to the actuator arrangement it causes the movable element to move relative to the static part, wherein the actuator arrangement (30″) and/or movable element are arranged such that the movable element does not move relative to the static part (10) when no energy is supplied to the actuator arrangement, and further wherein the actuator arrangement (30″) and the movable element are positioned within the fluid path (10).
PACKAGE-INTEGRATED BISTABLE SWITCH FOR ELECTROSTATIC DISCHARGE (ESD) PROTECTION
A switch in a package substrate of a microelectronic package is provided, the switch comprising: an actuator plate; a strike plate; and a connecting element mechanically coupling the actuator plate and the strike plate. The switch is configured to move within a cavity inside the package substrate between an open position and a closed position, a conductive material is coupled to the switch and to a ground via in the package substrate, and the conductive material is configured to move with the switch, such that the switch is conductively coupled to the ground via in the open position and the closed position.