This application provides an embedded substrate, a circuit board assembly, and an electronic device. The embedded substrate in this application includes an insulation layer, and an electronic element and a conductive connector that are embedded inside the insulation layer. The conductive connector is electrically connected to the electronic element. The conductive connector includes at least one fuse unit, the fuse unit includes a fusible structure and two electrical connection ends, the fusible structure is connected between the two electrical connection ends in a direction of an electrical path of the conductive connector, and the fusible structure is configured to be blown when a passing current exceeds a preset current threshold, to disconnect an electrical connection between the electronic element and an external connection end. In this application, maintenance and replacement costs are low during current burning prevention, and a volume is compact.

This application provides an embedded substrate, a circuit board assembly, and an electronic device. The embedded substrate in this application includes an insulation layer, and an electronic element and a conductive connector that are embedded inside the insulation layer. The conductive connector is electrically connected to the electronic element. The conductive connector includes at least one fuse unit, the fuse unit includes a fusible structure and two electrical connection ends, the fusible structure is connected between the two electrical connection ends in a direction of an electrical path of the conductive connector, and the fusible structure is configured to be blown when a passing current exceeds a preset current threshold, to disconnect an electrical connection between the electronic element and an external connection end. In this application, maintenance and replacement costs are low during current burning prevention, and a volume is compact.

An electronic installation device for controlling a load in an electrical circuit, which comprises a single or multi-layer printed circuit board arrangement with electrical components and conductor tracks and which comprises a load circuit and a control circuit. According to the invention, in order to provide an electronic installation device with protective devices against short-circuit and against overload and which are specific to devices, the load circuit and the control circuit are at least functionally coupled to one another, and the electronic installation device comprises a first overcurrent protection device for protection against short-circuit currents and a second overcurrent protection device for protection against overload currents.

A power fuse for protecting an electrical load subject to transient load current cycling events in a direct current electrical power system is provided. The power fuse includes at least one fuse element assembly that includes an elongated planar substrate, a plurality of fusible weak spots, and a conductor. The weak spots are formed on the substrate and are longitudinally spaced from one another on the substrate. The conductor is separately provided from the substrate and the weak spots. The conductor includes a solid elongated strip of metal having no stamped weak spot openings therein and therefore avoiding thermal-mechanical fatigue strain in the conductor when subjected to the transient load current cycling events. The solid elongated strip of metal includes coplanar connector sections that are mounted to respective ones of the weak spots and obliquely extending sections bent out of plane of the connector sections to extend above the substrate.

A power fuse for protecting an electrical load subject to transient load current cycling events in a direct current electrical power system is provided. The power fuse includes at least one fuse element assembly that includes an elongated planar substrate, a plurality of fusible weak spots, and a conductor. The weak spots are formed on the substrate and are longitudinally spaced from one another on the substrate. The conductor is separately provided from the substrate and the weak spots. The conductor includes a solid elongated strip of metal having no stamped weak spot openings therein and therefore avoiding thermal-mechanical fatigue strain in the conductor when subjected to the transient load current cycling events. The solid elongated strip of metal includes coplanar connector sections that are mounted to respective ones of the weak spots and obliquely extending sections bent out of plane of the connector sections to extend above the substrate.

A flexible thin sheet-shaped electric wire includes: a body part having electrical insulation; and a conductor part that is arranged in the body part. Further, the conductor part includes a conductor body, and a fuse part that is formed in a part of the conductor body and of which a cross-sectional area is smaller than a cross-sectional area of the conductor body. Still further, the body part includes a conductor region in which the conductor body is arranged and a fuse region in which the fuse part is arranged. The fuse part includes an enclosing part that is arranged to enclose the entire circumference of at least a part of the fuse region.

The chip-type current fuse is configured to include a fuse element 5 formed between a first front electrode 3 and a second front electrode 4. The fuse element 5 includes: a first linear portion 5a that has an end connected to the first front electrode 3 and extends in a direction toward the second front electrode 4; a second linear portion 5b that has an end connected to the second front electrode 4 and extends in parallel to the first linear portion 5a in a direction toward the first front electrode 3; and an inclined linear portion 5c that links the first linear portion 5a and the second linear portion 5b to each other. The inclined linear portion 5c is connected at an acute angle to each of the first linear portion 5a and the second linear portion 5b.

In a chip fuse, a heat-storing layer is formed on an insulated substrate, a fuse film is formed on the heat-storing layer, and a protective film is formed on the fuse element section. The chip fuse includes surface electrode sections on both ends in the length direction of the chip fuse and a fuse element section between the surface electrode sections. In this chip fuse, a rectangular bank section is formed over the heat-storing layer and the surface electrode sections to surround the fuse element section, and a first protective layer is formed on the inner side of the bank section. In addition, during the bank formation process, a sheet-like photosensitive-group-containing material is laminated on the fuse element section, surface electrode sections, and heat-storing layer, and the sheet-like photosensitive-group-containing material is exposed to ultraviolet light and developed to form the rectangular bank section.

In a chip fuse, a heat-storing layer is formed on an insulated substrate, a fuse film is formed on the heat-storing layer, and a protective film is formed on the fuse element section. The chip fuse includes surface electrode sections on both ends in the length direction of the chip fuse and a fuse element section between the surface electrode sections. In this chip fuse, a rectangular bank section is formed over the heat-storing layer and the surface electrode sections to surround the fuse element section, and a first protective layer is formed on the inner side of the bank section. In addition, during the bank formation process, a sheet-like photosensitive-group-containing material is laminated on the fuse element section, surface electrode sections, and heat-storing layer, and the sheet-like photosensitive-group-containing material is exposed to ultraviolet light and developed to form the rectangular bank section.

A power fuse for protecting an electrical load subject to transient load current cycling events in a direct current electrical power system is provided. The power fuse includes at least one fuse element assembly that includes one or more substrates, one or more sets of weak spots, and a conductor. The weak spots are formed on the substrates, and the substrates are longitudinally spaced apart from one another along the conductor. The conductor is separately provided from the substrate and the weak spots. The conductor includes one or more strips of metal having no stamped weak spot openings therein and therefore avoiding thermal-mechanical fatigue strain in the conductor when subjected to the transient load current cycling events. The conductor includes connector sections that are attached to respective ones of the sets of weak spots, and extending sections coupling the connector sections.