An electronic device includes an input, an output, a metal fuse, a resistor, a heat control transistor, and a heat controller. The metal fuse is coupled between the input and the output. The resistor is coupled between the metal fuse and the heat control transistor. The heat control transistor is coupled between the resistor and a reference terminal of the electronic device, and the heat controller is configured to control a heater current of the heat control transistor.

A protection device comprises a substrate, a fusible element and a heating element. The substrate comprises a first electrode and a second electrode on its surface. The fusible element is disposed on the substrate and connects to the first electrode and the second electrode at two ends. The fusible element comprises a first metal layer and a second metal layer disposed on the first metal layer. The second metal layer has a lower melting point than that of the first metal layer. The heating element is disposed on the substrate. In the event of over-voltage or over-temperature, the heating element heats up to melt and blow the fusible element. The second metal layer is 40-95% of the fusible element in thickness.

An electronic device includes an input, an output, a metal fuse, a resistor, a heat control transistor, and a heat controller. The metal fuse is coupled between the input and the output. The resistor is coupled between the metal fuse and the heat control transistor. The heat control transistor is coupled between the resistor and a reference terminal of the electronic device, and the heat controller is configured to control a heater current of the heat control transistor.

A protective element (30) includes an insulating substrate (33), a plurality of electrodes (34) provided on the insulating substrate (33), a fuse element (35) electrically connected to any electrode (34) of the plurality of electrodes (34), and a heat generation element (38) provided on the insulating substrate (33) for heating and fusing the fuse element (35). The fuse element (35) contains a composite metal material in which a first fusible metal (31) and a second fusible metal (32) are stacked, some of a component of the first fusible metal (31) being dissolved at a joint working temperature, the second fusible metal (32) being lower in melt temperature than the first fusible metal (31), at least some of a component of the second fusible metal (32) being molten at the joint working temperature.

A protective element includes an insulating substrate, a plurality of electrodes provided on the insulating substrate, a fuse element electrically connected to any electrode of the plurality of electrodes, and a heat generation element provided on the insulating substrate for heating and fusing the fuse element. The fuse element contains a composite metal material in which a first fusible metal and a second fusible metal are stacked, some of a component of the first fusible metal being dissolved at a joint working temperature, the second fusible metal being lower in melt temperature than the first fusible metal, at least some of a component of the second fusible metal being molten at the joint working temperature.

The invention relates to a conducting track fuse (1) for an electrical or electronic device, comprising: a first and a second connection region (2a, 2b); a nonlinearly extending burn-out region (3), which is arranged between the first and second connection regions (2a, 2b); and a covering element (15), which has at least two side walls (9) and a covering face (8), which covering element is arranged over the first and second connection regions (2a, 2b) and over the burn-out region (3), the burn-out region (3) and the covering element (5) being arranged relative to each other in such a way that the area of the covering face (8) covers the burn-out region (3) and a cavity (7) is formed between the burn-out region (3) and the covering face (8) as a result of the height of the side walls (9).

A protection device comprises a substrate, a fusible element and a heating element. The substrate comprises a first electrode and a second electrode on its surface. The fusible element is disposed on the substrate and connects to the first electrode and the second electrode at two ends. The fusible element comprises a first metal layer and a second metal layer disposed on the first metal layer. The second metal layer has a lower melting point than that of the first metal layer. The heating element is disposed on the substrate. In the event of over-voltage or over-temperature, the heating element heats up to melt and blow the fusible element. The second metal layer is 40-95% of the fusible element in thickness.

A protection device comprises a first planar substrate, a second planar substrate, a heating element and a fusible element. The second planar substrate is attached to the underside of the first planar substrate to form a composite structure. The heating element comprises an insulating layer and a heating layer disposed thereon. The heating element is disposed on the first planar substrate, and the insulating layer is disposed between the first planar substrate and the heating layer. The fusible element is disposed above the heating element. The heating element heats up to blow the fusible element in the event of over-voltage or over-temperature.

The invention relates to a conducting track fuse (1) for an electrical or electronic device, comprising: a first and a second connection region (2a, 2b); a nonlinearly extending burn-out region (3), which is arranged between the first and second connection regions (2a, 2b); and a covering element (15), which has at least two side walls (9) and a covering face (8), which covering element is arranged over the first and second connection regions (2a, 2b) and over the burn-out region (3), the burn-out region (3) and the covering element (5) being arranged relative to each other in such a way that the area of the covering face (8) covers the burn-out region (3) and a cavity (7) is formed between the burn-out region (3) and the covering face (8) as a result of the height of the side walls (9).

Structures of and methods for fabricating fine-scale interconnects and fuses are disclosed. A mushroom-type structure with a narrow stalk supporting a wider cap can be used for fine-scale interconnects with widths on the scale of hundreds of nanometers that have low resistivity. Micro-air bridges can be introduced by omitting the stalk in sections of the interconnect, allowing the interconnect to bridge over obstacles. The mushroom-type micro-air bridge structure can also be modified to create fine-scale fuses that have low resistivity overall and sections of significantly higher resistivity where the micro-air bridges exist. The significantly higher resistivity results in preferential fusing at the micro-air bridges. Both mushroom interconnects and mushroom fuses can be fabricated using electron beam lithography.