Patent classifications
H01J19/54
SYSTEMS AND METHODS FOR CREATING AN ELECTRON COIL MAGNET
A magnet system comprising: a supplied magnetic field producer configured for creating a supplied magnetic field (SMF) or a supplied radial electric field producer configured for creating a supplied radial electric field (SREF); and an electron gun positioned so as to fire electrons into the SMF or the SREF such that the electrons fired from the electron gun form an electron coil, wherein the electron coil creates a self-generated magnetic field (SGMF), wherein the electron coil is formed in a vacuum.
SYSTEMS AND METHODS FOR CREATING AN ELECTRON COIL MAGNET
A magnet system comprising: a supplied magnetic field producer configured for creating a supplied magnetic field (SMF) or a supplied radial electric field producer configured for creating a supplied radial electric field (SREF); and an electron gun positioned so as to fire electrons into the SMF or the SREF such that the electrons fired from the electron gun form an electron coil, wherein the electron coil creates a self-generated magnetic field (SGMF), wherein the electron coil is formed in a vacuum.
VACUUM CHANNEL ELECTRONIC ELEMENT, OPTICAL TRANSMISSION CIRCUIT, AND LAMINATED CHIP
A laminated body is provided in a circumferential shape with a gap formed in a part of a circumferential direction on a semiconductor layer. In the laminated body, a first insulating layer, a gate layer, a second insulating layer, and a drain layer are layered in this order from the semiconductor layer side. An impurity diffusion layer is formed on a surface of the semiconductor layer, and a backside electrode on a backside surface. The impurity diffusion layer extends from a position in contact with side walls in a channel space to an outside of the laminated body through a region corresponding to the gap on the surface of the semiconductor layer. A portion of the impurity diffusion layer beyond the laminated body is a contact region to which a wiring for applying a predetermined voltage is connected. A cover layer made of an insulating material is formed in an upper portion and a periphery of the annular portion including the laminated body and the gap.
VACUUM TUBE FOR AMPLIFIER CIRCUIT, AND AMPLIFIER CIRCUIT USING SAME
A vacuum tube for amplifier circuit includes: a light incidence window that transmits signal light; a photoelectric conversion unit that converts the signal light transmitted through the light incidence window into photoelectrons; an output unit that has an anode, on which the photoelectrons are incident, and outputs a signal corresponding to the incident photoelectrons; and a grid electrode that is disposed in a path of the photoelectrons from the photoelectric conversion unit to the anode and controls the amount of photoelectrons incident on the anode.
VACUUM TUBE FOR AMPLIFIER CIRCUIT, AND AMPLIFIER CIRCUIT USING SAME
A vacuum tube for amplifier circuit includes: a light incidence window that transmits signal light; a photoelectric conversion unit that converts the signal light transmitted through the light incidence window into photoelectrons; an output unit that has an anode, on which the photoelectrons are incident, and outputs a signal corresponding to the incident photoelectrons; and a grid electrode that is disposed in a path of the photoelectrons from the photoelectric conversion unit to the anode and controls the amount of photoelectrons incident on the anode.
Vertical metal-air transistor
A method of forming a vertical metal-air transistor device is provided. The method includes forming a precursor stack with a stack template on the precursor stack on a substrate. The method further includes forming a bottom spacer on the substrate around the precursor stack, and depositing a liner casing on the precursor stack. The method further includes depositing a conductive gate layer on the bottom spacer and liner casing. The method further includes reducing the size of the stack template to form a template post on the precursor stack, and forming a stack cap on the template post and precursor stack.
VERTICAL METAL-AIR TRANSISTOR
A method of forming a vertical metal-air transistor device is provided. The method includes forming a precursor stack with a stack template on the precursor stack on a substrate. The method further includes forming a bottom spacer on the substrate around the precursor stack, and depositing a liner casing on the precursor stack. The method further includes depositing a conductive gate layer on the bottom spacer and liner casing. The method further includes reducing the size of the stack template to form a template post on the precursor stack, and forming a stack cap on the template post and precursor stack.
Microelectromechanical light emitter component, light emitter component and method for producing a microelectromechanical light emitter component
A microelectromechanical light emitter component comprises an emitter layer structure of the microelectromechanical light emitter component and an inductive structure of the microelectromechanical light emitter component. The inductive structure of the microelectromechanical light emitter component is configured to generate current in the emitter layer structure by electromagnetic induction, such that the emitter layer structure emits light. The emitter layer structure is electrically insulated from the inductive structure.
Microelectromechanical light emitter component, light emitter component and method for producing a microelectromechanical light emitter component
A microelectromechanical light emitter component comprises an emitter layer structure of the microelectromechanical light emitter component and an inductive structure of the microelectromechanical light emitter component. The inductive structure of the microelectromechanical light emitter component is configured to generate current in the emitter layer structure by electromagnetic induction, such that the emitter layer structure emits light. The emitter layer structure is electrically insulated from the inductive structure.
Electron gun thermal dissipation in a vacuum
Embodiments include a vacuum device, comprising: an enclosure configured to enclose a vacuum, comprising an external base forming at least a portion of the enclosure; an internal base within the enclosure; and at least one thermal dissipative strap assembly, comprising: an internal base thermal conductive base in contact with the internal base, an external base thermal conductive base in contact with the external base, and a flexible thermal dissipative strap coupling the internal base thermal conductive base to the external base thermal conductive base.