H01J19/78

THz vacuum electronic devices with micro-fabricated electromagnetic circuits

A new class of efficient vacuum electronic devices (VEDs) for THz wave generation and amplification are disclosed. The EM circuits of these VEDs are micro-fabricated from Si wafers with high precision. The original design of the EM circuits overcomes the main limitations of existing THz VEDs constructed from metal or metallized components, such as low fabrication precision, high signal losses, low tolerance to electric breakdown and low beam efficiency. The disclosed VEDs may have up to 50% beam efficiency in the THz band.

THz vacuum electronic devices with micro-fabricated electromagnetic circuits

A new class of efficient vacuum electronic devices (VEDs) for THz wave generation and amplification are disclosed. The EM circuits of these VEDs are micro-fabricated from Si wafers with high precision. The original design of the EM circuits overcomes the main limitations of existing THz VEDs constructed from metal or metallized components, such as low fabrication precision, high signal losses, low tolerance to electric breakdown and low beam efficiency. The disclosed VEDs may have up to 50% beam efficiency in the THz band.

Spark Gap Device And Method Of Measurement Of X-Ray Tube Vacuum Pressure

In the present invention, a pressure measurement device for determining the vacuum level within the evacuated housing of a vacuum electrode device is provided that includes an electrically conductive enclosure secured to an interior surface of the housing, an electrically conductive electrode extending through an aperture in the housing, the electrode having a tip at one end positioned within the interior of the housing inside the enclosure to define a gap between the tip and the enclosure and a conductive lead at a second end disposed outside of the housing, and a voltage source connected to the conductive lead to supply a voltage potential to the tip of the electrode. A voltage difference produced between the electrode and the enclosure ionizes gas within the enclosure causing a measurable current to flow between the electrode and the enclosure which can be used to determine the vacuum level in the housing.

Spark Gap Device And Method Of Measurement Of X-Ray Tube Vacuum Pressure

In the present invention, a pressure measurement device for determining the vacuum level within the evacuated housing of a vacuum electrode device is provided that includes an electrically conductive enclosure secured to an interior surface of the housing, an electrically conductive electrode extending through an aperture in the housing, the electrode having a tip at one end positioned within the interior of the housing inside the enclosure to define a gap between the tip and the enclosure and a conductive lead at a second end disposed outside of the housing, and a voltage source connected to the conductive lead to supply a voltage potential to the tip of the electrode. A voltage difference produced between the electrode and the enclosure ionizes gas within the enclosure causing a measurable current to flow between the electrode and the enclosure which can be used to determine the vacuum level in the housing.

THz Vacuum Electronic Devices With Micro-Fabricated Electromagnetic Circuits
20210159040 · 2021-05-27 ·

A new class of efficient vacuum electronic devices (VEDs) for THz wave generation and amplification are disclosed. The EM circuits of these VEDs are micro-fabricated from Si wafers with high precision. The original design of the EM circuits overcomes the main limitations of existing THz VEDs constructed from metal or metallized components, such as low fabrication precision, high signal losses, low tolerance to electric breakdown and low beam efficiency. The disclosed VEDs may have up to 50% beam efficiency in the THz band.

THz Vacuum Electronic Devices With Micro-Fabricated Electromagnetic Circuits
20210159040 · 2021-05-27 ·

A new class of efficient vacuum electronic devices (VEDs) for THz wave generation and amplification are disclosed. The EM circuits of these VEDs are micro-fabricated from Si wafers with high precision. The original design of the EM circuits overcomes the main limitations of existing THz VEDs constructed from metal or metallized components, such as low fabrication precision, high signal losses, low tolerance to electric breakdown and low beam efficiency. The disclosed VEDs may have up to 50% beam efficiency in the THz band.

Vacuum tube rear device
10755885 · 2020-08-25 · ·

The present invention provides a device with rear-mounted vacuum tubes, comprising a protective cover with a plurality of heat dissipating holes, a rear panel with a panel opening, and at least one vacuum tube, wherein the vacuum tubes are arranged in a containing space of the protective cover through the panel opening and inserted to a connection circuit board for coupling to a printed circuit board. In addition, the protective cover, the rear panel, and the vacuum tubes are placed in parallel with the printed circuit board, so that heat dissipation for the device is improved and replacement and maintenance of the vacuum tubes are easier. In particular, a vacuum tube audio amplifier apparatus having the device with rear-mounted vacuum tubes as disclosed herein can be stacked.

Vacuum tube rear device
10755885 · 2020-08-25 · ·

The present invention provides a device with rear-mounted vacuum tubes, comprising a protective cover with a plurality of heat dissipating holes, a rear panel with a panel opening, and at least one vacuum tube, wherein the vacuum tubes are arranged in a containing space of the protective cover through the panel opening and inserted to a connection circuit board for coupling to a printed circuit board. In addition, the protective cover, the rear panel, and the vacuum tubes are placed in parallel with the printed circuit board, so that heat dissipation for the device is improved and replacement and maintenance of the vacuum tubes are easier. In particular, a vacuum tube audio amplifier apparatus having the device with rear-mounted vacuum tubes as disclosed herein can be stacked.